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21. 发明授权

US06284600B1 Species implantation for minimizing interface defect density in flash memory devices 有权
标题翻译：用于最小化闪存器件中的界面缺陷密度的物种植入
公开(公告)号：US06284600B1
公开(公告)日：2001-09-04
申请号：US09609468
申请日：2000-07-03
申请人： Yider Wu , Mark T. Ramsbey , Chi Chang , Yu Sun , Tuan Duc Pham , Jean Y. Yang
发明人： Yider Wu , Mark T. Ramsbey , Chi Chang , Yu Sun , Tuan Duc Pham , Jean Y. Yang
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L27/115
摘要： A predetermined species such as nitrogen is placed at an interface between a bit line junction and a dielectric layer of a control dielectric structure of a flash memory device to minimize degradation of such an interface by minimizing formation of interface defects during program or erase operations of the flash memory device. The predetermined species such as nitrogen is implanted into a bit line junction of the flash memory device. A thermal process is performed that heats up the semiconductor wafer such that the predetermined species such as nitrogen implanted within the semiconductor wafer thermally drifts to the interface between the bit line junction and the control dielectric structure during the thermal process. The predetermined species such as nitrogen at the interface minimizes formation of interface defects and thus degradation of the interface with time during the program or erase operations of the flash memory device.
摘要翻译：将诸如氮的预定物质放置在闪存存储器件的控制电介质结构的位线结和电介质层之间的界面处，以通过在编程或擦除操作期间最小化界面缺陷的形成来最小化这种界面的劣化闪存设备。将诸如氮的预定物质注入到闪速存储器件的位线结中。执行加热半导体晶片的热处理，使得在热处理期间注入到半导体晶片内的预定物质例如氮漂移到位线结与控制电介质结构之间的界面。在闪存器件的编程或擦除操作期间，预定种类例如接口处的氮使界面缺陷的形成最小化，从而使界面的时效性降低。

22. 发明授权

US06667243B1 Etch damage repair with thermal annealing 有权
标题翻译：蚀刻损伤修复与热退火
公开(公告)号：US06667243B1
公开(公告)日：2003-12-23
申请号：US10222248
申请日：2002-08-16
申请人： Mark T. Ramsbey , Nicholas H. Tripsas , Arvind Halliyal , Jeffrey A. Shields , Yider Wu
发明人： Mark T. Ramsbey , Nicholas H. Tripsas , Arvind Halliyal , Jeffrey A. Shields , Yider Wu
IPC分类号： H01L21302
CPC分类号： H01L21/02071 , H01L21/31138 , H01L21/32137 , H01L21/32139 , H01L29/6659 , Y10S438/906 , Y10S438/94
摘要： A method of manufacturing a semiconductor device etches a feature on a substrate in accordance with a photoresist mask. The photoresist mask is removed by plasma etching. Laser thermal annealing is performed to vaporize polymer residue created during the stripping of the photoresist mask, and to repair damage to the substrate.
摘要翻译：半导体器件的制造方法根据光致抗蚀剂掩模蚀刻衬底上的特征。通过等离子体蚀刻去除光致抗蚀剂掩模。进行激光热退火以蒸发在光刻胶掩模剥离期间产生的聚合物残余物，并修复对基材的损伤。

23. 发明授权

US06399984B1 Species implantation for minimizing interface defect density in flash memory devices 有权
标题翻译：用于最小化闪存器件中的界面缺陷密度的物种植入
公开(公告)号：US06399984B1
公开(公告)日：2002-06-04
申请号：US09882242
申请日：2001-06-15
申请人： Yider Wu , Mark T. Ramsbey , Chi Chang , Yu Sun , Tuan Duc Pham , Jean Y. Yang
发明人： Yider Wu , Mark T. Ramsbey , Chi Chang , Yu Sun , Tuan Duc Pham , Jean Y. Yang
IPC分类号： H01L29788
CPC分类号： H01L27/11568 , H01L27/115
摘要： A predetermined species such as nitrogen is placed at an interface between a bit line junction and a dielectric layer of a control dielectric structure of a flash memory device to minimize degradation of such an interface by minimizing formation of interface defects during program or erase operations of the flash memory device. The predetermined species such as nitrogen is implanted into a bit line junction of the flash memory device. A thermal process is performed that heats up the semiconductor wafer such that the predetermined species such as nitrogen implanted within the semiconductor wafer thermally drifts to the interface between the bit line junction and the control dielectric structure during the thermal process. The predetermined species such as nitrogen at the interface minimizes formation of interface defects and thus degradation of the interface with time during the program or erase operations of the flash memory device.
摘要翻译：将诸如氮的预定物质放置在闪存存储器件的控制电介质结构的位线结和电介质层之间的界面处，以通过在编程或擦除操作期间最小化界面缺陷的形成来最小化这种界面的劣化闪存设备。将诸如氮的预定物质注入到闪速存储器件的位线结中。执行加热半导体晶片的热处理，使得在热处理期间注入到半导体晶片内的预定物质例如氮漂移到位线结和控制电介质结构之间的界面。在闪存器件的编程或擦除操作期间，预定种类例如接口处的氮使界面缺陷的形成最小化，从而使界面的时效性降低。

24. 发明授权

US06828199B2 Monos device having buried metal silicide bit line 有权
标题翻译：具有埋置金属硅化物位线的单体器件
公开(公告)号：US06828199B2
公开(公告)日：2004-12-07
申请号：US10022798
申请日：2001-12-20
申请人： Jusuke Ogura , Mark T. Ramsbey , Arvind Halliyal , Zoran Krivokapic , Minh Van Ngo , Nicholas H. Tripisas
发明人： Jusuke Ogura , Mark T. Ramsbey , Arvind Halliyal , Zoran Krivokapic , Minh Van Ngo , Nicholas H. Tripisas
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L21/743 , H01L27/115 , H01L29/66833 , H01L29/792
摘要： A MONOS device and method for making the device has a charge trapping dielectric layer, such as an oxide-nitride-oxide (ONO) layer, formed on a substrate. A recess is created through the ONO layer and in the substrate. A metal silicide bit line is formed in the recess and bit line oxide is formed on top of the metal silicide. A word line is formed over the ONO layer and the bit line oxide, and a low resistance silicide is provided on top of the word line. The silicide is formed by laser thermal annealing, for example.
摘要翻译：用于制造该器件的MONOS器件和方法具有形成在衬底上的电荷捕获介电层，例如氧化物 - 氮化物 - 氧化物（ONO）层。通过ONO层和衬底产生凹陷。在凹部中形成金属硅化物位线，并且在金属硅化物的顶部上形成位线氧化物。在ONO层和位线氧化物之间形成字线，并且在字线的顶部提供低电阻硅化物。硅化物例如由激光热退火形成。

25. 发明授权

US06798002B1 Dual-purpose anti-reflective coating and spacer for flash memory and other dual gate technologies and method of forming 有权
标题翻译：双用途抗反射涂层和闪存间隔器等双栅技术及成型方法
公开(公告)号：US06798002B1
公开(公告)日：2004-09-28
申请号：US09607675
申请日：2000-06-30
申请人： Robert B. Ogle, Jr. , Tuan D. Pham , Mark T. Ramsbey
发明人： Robert B. Ogle, Jr. , Tuan D. Pham , Mark T. Ramsbey
IPC分类号： H01L27108
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11536
摘要： A dual gate semiconductor device, such as a flash memory semiconductor device, whose plurality of dual gate sidewall spacer structure is formed by a first and second anti-reflection fabrication process. The sidewall spacers of the dual transistor gate structures in the core memory region are left coated with the second anti-reflective coating material, after being used for gate patterning, to act as sidewall spacers for use in subsequent ion implant and salicidation fabrication steps. The second anti-reflective coating material is selected from a material group such as silicon oxynitride (SiON), silicon nitride (Si3N4), and silicon germanium (SiGe), or other anti-reflective coating material having optical properties and that are compatible with the subsequent implant and salicidation steps.
摘要翻译：诸如闪存半导体器件的双栅极半导体器件，其多个双栅极侧壁间隔结构通过第一和第二抗反射制造工艺形成。核心存储器区域中的双晶体管栅极结构的侧壁间隔物在用于栅极图案化之后被第二抗反射涂层材料涂覆以用作用于后续离子注入和盐化制造步骤的侧壁间隔物。第二抗反射涂层材料选自诸如氮氧化硅（SiON），氮化硅（Si 3 N 4）和硅锗（SiGe）的材料组或具有光学性质的其它抗反射涂层材料，并且与随后的植入和盐化步骤。

26. 发明授权

US06630384B1 Method of fabricating double densed core gates in sonos flash memory 有权
标题翻译：在sonos闪存中制造双激光核心门的方法
公开(公告)号：US06630384B1
公开(公告)日：2003-10-07
申请号：US09971483
申请日：2001-10-05
申请人： Yu Sun , Michael A. Van Buskirk , Mark T. Ramsbey
发明人： Yu Sun , Michael A. Van Buskirk , Mark T. Ramsbey
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L27/115
摘要： One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; forming a first set of memory cell gates over the charge trapping dielectric in the core region; forming a conformal insulation material layer around the first set of memory cell gates; and forming a second set of memory cell gates in the core region, wherein each memory cell gate of the second set of memory cell gates is adjacent to at least one memory cell gate of the first set of memory cell gates, each memory cell gate of the first set of memory cell gates is adjacent at least one memory cell gate of the second set of memory cell gates, and the conformal insulation material layer is positioned between each adjacent memory cell gate.
摘要翻译：本发明的一个方面涉及一种形成非易失性半导体存储器件的方法，包括在衬底上形成电荷俘获电介质，所述衬底具有芯区域和外围区域; 在芯区域中的电荷俘获电介质上形成第一组存储单元栅极; 在所述第一组存储单元栅极周围形成保形绝缘材料层; 以及在所述核心区域中形成第二组存储器单元栅极，其中所述第二组存储单元栅极的每个存储单元栅极与所述第一组存储单元栅极的至少一个存储单元栅极相邻，第一组存储单元栅极与第二组存储单元栅极的至少一个存储单元栅极相邻，并且保形绝缘材料层位于每个相邻的存储单元栅极之间。

27. 发明授权

US06630383B1 Bi-layer floating gate for improved work function between floating gate and a high-K dielectric layer 有权
标题翻译：双层浮栅，用于改善浮栅和高K电介质层之间的功函数
公开(公告)号：US06630383B1
公开(公告)日：2003-10-07
申请号：US10274063
申请日：2002-10-17
申请人： Effiong Ibok , Wei Zheng , Nicholas H. Tripsas , Mark T. Ramsbey , Fred T K Cheung
发明人： Effiong Ibok , Wei Zheng , Nicholas H. Tripsas , Mark T. Ramsbey , Fred T K Cheung
IPC分类号： H01L21336
CPC分类号： H01L21/28194 , H01L21/28273 , H01L29/42324 , H01L29/4958 , H01L29/51 , H01L29/511
摘要： In one embodiment, a method of making a gate stack semiconductor device is disclosed. The method comprises the steps of: forming a tunnel oxide layer over a p-type semiconductor substrate; forming a floating gate over the tunnel oxide layer by first forming an n-type polysilicon layer and subjecting the n-type polysilicon layer to nitridation, and then forming a p-type polysilicon layer over the nitridated n-type polysilicon layer; and forming a high-K insulating layer over the p-type polysilicon layer.
摘要翻译：在一个实施例中，公开了制造栅叠层半导体器件的方法。该方法包括以下步骤：在p型半导体衬底上形成隧道氧化物层; 通过首先形成n型多晶硅层并对n型多晶硅层进行氮化，然后在氮化的n型多晶硅层上形成p型多晶硅层，在隧道氧化物层上形成浮栅; 以及在p型多晶硅层上形成高K绝缘层。

28. 发明授权

US06620717B1 Memory with disposable ARC for wordline formation 失效
标题翻译：具有一次性ARC用于字线形成的记忆
公开(公告)号：US06620717B1
公开(公告)日：2003-09-16
申请号：US10100487
申请日：2002-03-14
申请人： Tazrien Kamal , Scott A. Bell , Kouros Ghandehari , Mark T. Ramsbey , Jeffrey A. Shields , Jean Y. Yang
发明人： Tazrien Kamal , Scott A. Bell , Kouros Ghandehari , Mark T. Ramsbey , Jeffrey A. Shields , Jean Y. Yang
IPC分类号： H01L213205
CPC分类号： H01L27/11568 , H01L21/32139 , H01L27/115
摘要： A method of manufacturing for a Flash memory includes depositing a charge-trapping material over a semiconductor substrate and implanting first and second bitlines. A wordline material is deposited over the charge-trapping dielectric material and a hard mask material deposited. A disposable anti-reflective coating (ARC) material and a photoresist material are deposited followed by processing to form a patterned photoresist material and a patterned ARC material. The hard mask material is processed to form a patterned hard mask material. The patterned photoresist is removed and then the patterned ARC without damaging the patterned hard mask material or the wordline material. The wordline material is processed using the patterned hard mask material to form a wordline and the patterned hard mask material is removed without damaging the wordline or the charge-trapping dielectric material.
摘要翻译：一种用于闪速存储器的制造方法包括在半导体衬底上沉积电荷捕获材料并植入第一和第二位线。字线材料沉积在电荷捕获电介质材料上并沉积硬掩模材料。沉积一次性抗反射涂层（ARC）材料和光致抗蚀剂材料，然后进行处理以形成图案化的光致抗蚀剂材料和图案化的ARC材料。加工硬掩模材料以形成图案化的硬掩模材料。去除图案化的光致抗蚀剂，然后去除图案化的ARC，而不损坏图案化的硬掩模材料或字线材料。使用图案化的硬掩模材料处理字线材料以形成字线，并且去除图案化的硬掩模材料而不损坏字线或电荷捕获电介质材料。

29. 发明授权

US06548855B1 Non-volatile memory dielectric as charge pump dielectric 失效
标题翻译：非易失性存储介质作为电荷泵电介质
公开(公告)号：US06548855B1
公开(公告)日：2003-04-15
申请号：US10147622
申请日：2002-05-16
申请人： Mark T. Ramsbey , Arvind Halliyal , Kuo-Tung Chang , Nicholas H. Tripsas , Wei Zheng , Unsoon Kim
发明人： Mark T. Ramsbey , Arvind Halliyal , Kuo-Tung Chang , Nicholas H. Tripsas , Wei Zheng , Unsoon Kim
IPC分类号： H01L2976
CPC分类号： H01L27/11526 , H01L27/115 , H01L27/11539
摘要： A non-volatile memory device for retention of data when electrical power is terminated. The non-volatile memory device includes at least one memory cell and a charge pump for stepping up the incoming voltage supply. The charge pump includes at least one capacitor, wherein the dielectric of the charge pump capacitor and the dielectric of the memory cell are formed during the same processing step.
摘要翻译：一种用于在电力终止时保留数据的非易失性存储器件。非易失性存储器件包括至少一个存储单元和用于加速输入电压源的电荷泵。电荷泵包括至少一个电容器，其中电荷泵电容器的电介质和存储单元的电介质在相同的处理步骤期间形成。

30. 发明授权

US06455373B1 Semiconductor device having gate edges protected from charge gain/loss 有权
标题翻译：具有防止电荷增益/损耗的栅极边缘的半导体器件
公开(公告)号：US06455373B1
公开(公告)日：2002-09-24
申请号：US09834419
申请日：2001-04-12
申请人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
发明人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
IPC分类号： H01L21336
CPC分类号： H01L27/11526 , H01L21/823468 , H01L27/105 , H01L27/11536
摘要： A plurality of core gate stacks and periphery gates on the substrate, each core gate stack and periphery gate having at least one side and first and second protective shoulders formed on said plurality of core gate stacks and periphery gates, such that a dopant can be implanted sequentially into source and drain regions of a substrate supporting the stacks to establish transistors and such that charge migration into said at least one side of the gate stacks during interlayer dielectric (ILD) formation and device metallization is prevented, at least the second shoulder being frabricated from at least one material selected from a group consisting essentially of nitride and silicon oxynitride (SiON).
摘要翻译：在基板上的多个核心栅极叠层和周边栅极，每个芯栅极叠层和周边栅极具有形成在所述多个芯栅极叠层和外围栅极上的至少一个侧面和第一和第二保护肩部，使得掺杂剂可被植入顺序地进入支撑堆叠的衬底的源极和漏极区域以建立晶体管，并且防止在层间电介质（ILD）形成和器件金属化期间电荷迁移到栅极叠层的所述至少一个侧面，至少第二肩部被破坏选自由氮化物和氮氧化硅（SiON）组成的组中的至少一种材料。

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