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    • 22. 发明授权
    • Semiconductor memory device with hierarchical bit line structure
    • 具有分层位线结构的半导体存储器件
    • US07489570B2
    • 2009-02-10
    • US11480447
    • 2006-07-05
    • Nam-Seog KimJong-Cheol LeeHak-Soo YuUk-Rae Cho
    • Nam-Seog KimJong-Cheol LeeHak-Soo YuUk-Rae Cho
    • G11C7/00
    • G11C11/417G11C7/18G11C8/12
    • A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.
    • 半导体存储器件具有分层位线结构。 半导体存储器件可以包括第一和第二存储器单元簇,其共享相同的位线对并且在操作上被分割; 第三和第四存储单元簇,其分别对应于与第一和第二存储器单元簇耦合的字线,并且共享与位线对不同的位线对,并在操作上分割; 以及用于响应于列选择信号将与第一至第四存储器单元簇连接的位线对之一切换到公共读出放大器的列通路。 由此,连接到位线的外围电路的负载导致的工作速度降低得到改善,并且随着芯片尺寸的减小,列通道的数量大幅减少。
    • 23. 发明授权
    • Data transmission circuitry of a synchronous semiconductor memory device
    • 同步半导体存储器件的数据传输电路
    • US6128233A
    • 2000-10-03
    • US370842
    • 1999-08-09
    • Hak-Soo YuSu-Chul Kim
    • Hak-Soo YuSu-Chul Kim
    • G11C11/413G11C7/10G11C7/22G11C11/407G11C11/4076G11C11/4093G11C11/4096G11C11/417G11C7/00
    • G11C11/4093G11C11/4076G11C11/4096G11C7/1006G11C7/1072G11C7/22
    • A synchronous memory comprising: a memory cell array being comprised of a plurality of memory cells; a clock control circuit for receiving a first clock signal, a second clock signal, and a third clock signal, and for generating an internal clock signal, a plurality of control signals, and a plurality of flag signals; a first register circuit for storing a plurality of input data bits in response to the internal clock signal and the control signals; a second register circuit for storing the flag signals in response to the internal clock signal and the control signals; a write drive circuit for writing the input data bits passing through the first register circuit into the memory cell array in response to the flag signals during a write cycle; a sense amplifier circuit coupled to the memory cell array; an address comparator circuit for receiving read and write address signals and for generating a first, a second, and a third combination signals; and a switching circuit for transferring the input data bits passing through the first register circuit and the flag signals passing through the second register circuit to output terminals of the device.
    • 一种同步存储器,包括:由多个存储单元组成的存储单元阵列; 时钟控制电路,用于接收第一时钟信号,第二时钟信号和第三时钟信号,并用于产生内部时钟信号,多个控制信号和多个标志信号; 第一寄存器电路,用于响应于内部时钟信号和控制信号而存储多个输入数据位; 第二寄存器电路,用于响应于内部时钟信号和控制信号而存储标志信号; 写入驱动电路,用于在写入周期期间响应于标志信号,将通过第一寄存器电路的输入数据位写入存储单元阵列; 耦合到存储单元阵列的读出放大器电路; 地址比较器电路,用于接收读和写地址信号,并用于产生第一,第二和第三组合信号; 以及用于将通过第一寄存器电路的输入数据位和通过第二寄存器电路的标志信号传送到器件的输出端的开关电路。
    • 25. 发明授权
    • Data line layout and line driving method in semiconductor memory device
    • 半导体存储器件中的数据线布局和线驱动方法
    • US07697314B2
    • 2010-04-13
    • US12006502
    • 2008-01-03
    • Nam-Seog KimHak-Soo YuUk-Rae Cho
    • Nam-Seog KimHak-Soo YuUk-Rae Cho
    • G11C5/06
    • G11C5/063G11C7/1051G11C7/1069G11C7/18G11C11/417
    • A data line layout structure comprises a plurality of first data lines, second data lines, a third data line, a first data line driver, and a second data line driver. The plurality of first data lines are connected to sub mats in a memory mat so that a predetermined number of first data lines are connected to each sub mat. The second data lines are disposed in a smaller quantity than the number of the first data lines so as to form a hierarchy with respect to the first data lines. The third data line is disposed to form a hierarchy with respect to the second data lines, and transfers data provided through the second data lines to a data latch. The first data line driver is connected between the first data lines and the second data lines, and performs a logical ORing operation for output of the first data lines so as to drive a corresponding second data line. The second data line driver is connected between the second data lines and the third data line, and performs a logical ORing operation for output of the second data lines so as to drive the third data line.
    • 数据线布局结构包括多个第一数据线,第二数据线,第三数据线,第一数据线驱动器和第二数据线驱动器。 多个第一数据线连接到存储器垫中的子垫,使得预定数量的第一数据线连接到每个子垫。 第二数据线的布置量比第一数据线的数量少,从而形成相对于第一数据线的层次。 第三数据线被布置成相对于第二数据线形成层级,并且将通过第二数据线提供的数据传送到数据锁存器。 第一数据线驱动器连接在第一数据线和第二数据线之间,并且执行用于输出第一数据线的逻辑“或”运算,以驱动对应的第二数据线。 第二数据线驱动器连接在第二数据线和第三数据线之间,并且执行用于输出第二数据线的逻辑“或”运算,以驱动第三数据线。
    • 26. 发明授权
    • Semiconductor memory device with hierarchical bit line structure
    • 具有分层位线结构的半导体存储器件
    • US07656723B2
    • 2010-02-02
    • US12347239
    • 2008-12-31
    • Nam-Seog KimJong-Cheol LeeHak-Soo YuUk-Rae Cho
    • Nam-Seog KimJong-Cheol LeeHak-Soo YuUk-Rae Cho
    • G11C7/22
    • G11C11/417G11C7/18G11C8/12
    • A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.
    • 半导体存储器件具有分层位线结构。 半导体存储器件可以包括第一和第二存储器单元簇,其共享相同的位线对并且在操作上被分割; 第三和第四存储单元簇,其分别对应于与第一和第二存储器单元簇耦合的字线,并且共享与位线对不同的位线对,并在操作上分割; 以及用于响应于列选择信号将与第一至第四存储器单元簇连接的位线对之一切换到公共读出放大器的列通路。 由此,连接到位线的外围电路的负载导致的工作速度降低得到改善,并且随着芯片尺寸的减小,列通孔的数量基本上减小。