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    • 22. 发明申请
    • Captive screw with receiving space
    • 带收容空间的螺丝
    • US20050053446A1
    • 2005-03-10
    • US10925289
    • 2004-08-23
    • Chin-Fa HuangPeng YangQiong Chen
    • Chin-Fa HuangPeng YangQiong Chen
    • F16B5/02F16B35/06H05K7/14F16B21/18
    • H05K7/1417F16B5/0208F16B35/06
    • A captive screw (80) is provided for attaching two sheets together. The captive screw includes a screw (40) and a cap (50). The screw includes a head (41), a threaded shank (43), and a flange (42) located between the head and the shank. The cap includes a cavity (51) and a skirt portion (53). The shank forms a plurality of ribs (52) on an underside thereof. The flange forms a plurality of vertical ridges (44) therearound. The cap and the screw are combined, with the head and the flange tightly fitted in the cavity. The shank extends out of the skirt portion, with cylindrical space defined therebetween. A rod portion of a complementary engaging rivet can then be received in the space.
    • 提供固定螺钉(80)用于将两个片材连接在一起。 固定螺钉包括螺钉(40)和盖(50)。 螺钉包括头部(41),螺纹柄部(43)和位于头部和柄部之间的凸缘(42)。 盖包括空腔(51)和裙部(53)。 柄部在其下侧形成多个肋(52)。 凸缘在其周围形成多个垂直脊(44)。 盖和螺钉组合在一起,头部和凸缘紧密地嵌入腔体中。 柄部延伸出裙部,其间限定有圆柱形空间。 然后可以在该空间中容纳互补接合铆钉的杆部分。
    • 23. 发明授权
    • Method and apparatus for removal of mold flash
    • 去除模具闪光的方法和装置
    • US06576867B1
    • 2003-06-10
    • US09857724
    • 2002-02-12
    • Yong Feng LuYak Hui SimQiong ChenLong Chen LaiBin Othman Rustam
    • Yong Feng LuYak Hui SimQiong ChenLong Chen LaiBin Othman Rustam
    • B23K2636
    • H01L21/67092B08B7/0042H01L21/56H01L2924/0002H01L2924/00
    • A method and apparatus for the removal of mold flash from an IC device using a non-thermal laser ablation method. Ablation is achieved under conditions in which the mold flash is converted to plasma under short laser pulses which do not give sufficient time or energy for significant thermal processes to occur. As a result, the heat sink underneath the mold flash is prevented from heating up due to lack of heat transfer, thereby protecting the heat sink from heat damages. According to one feature of the invention, a mask is provided to protect the molded packaging of the IC device from the laser beam. The mask has at least one hole which corresponds to the heat sink of the device wherethrough the laser beam can pass. According to another feature of the invention, a large beam diameter is provided to increase the efficiency of the deflashing process.
    • 一种使用非热激光烧蚀方法从IC器件去除模具闪光的方法和装置。 在短激光脉冲下将模具闪光转换成等离子体的条件下实现消融,这对于显着的热处理没有给出足够的时间或能量。 结果,由于缺少热传递,防止模具闪光下面的散热器被加热,从而保护散热器免受热损坏。 根据本发明的一个特征,提供一种掩模以保护IC器件的模制封装免受激光束的影响。 掩模具有至少一个孔,其对应于通过激光束可以通过的装置的散热器。 根据本发明的另一个特征,提供了大的光束直径以提高去屑过程的效率。
    • 24. 外观设计
    • Nail polisher
    • USD1050604S1
    • 2024-11-05
    • US29947987
    • 2024-06-18
    • Qiong Chen
    • Qiong Chen
    • FIG. 1 is a front, left and top perspective view of a nail polisher showing my design;
      FIG. 2 is a rear, right and bottom perspective view thereof;
      FIG. 3 is a front elevation view thereof;
      FIG. 4 is a rear elevation view thereof;
      FIG. 5 is a left-side elevation view thereof;
      FIG. 6 is a right-side elevation view thereof;
      FIG. 7 is an enlarged top plan view thereof;
      FIG. 8 is an enlarged bottom plan view thereof;
      FIG. 9 is an enlarged view of portion 9 shown in FIG. 1; and,
      FIG. 10 is an enlarged view of portion 10 shown in FIG. 1.
      The evenly-incremented broken lines shown in the drawings illustrate portions of the nail polisher that form no part of the claimed design. The short-dash-long-dash broken lines shown in FIGS. 1, 9 and 10 depict the bounds of the enlarged views as well as the bounds of the portions of the drawings from which they were extracted, and form no part of the claimed design.