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21. 发明授权

US09656064B2 Implantable lead having multi-planar spiral inductor filter 有权
公开(公告)号：US09656064B2
公开(公告)日：2017-05-23
申请号：US14316896
申请日：2014-06-27
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Warren S. Dabney , Christine A. Frysz , Richard L. Brendel
IPC分类号： A61N1/00 , A61N1/08 , A61N1/05 , H01F17/02 , H03H1/00
摘要： A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.

22. 发明申请

US20170087356A1 MLCC FILTER ON AN AIMD CIRCUIT BOARD WITH DIRECT CONNECT TO GOLD BRAZE BETWEEN A FEEDTHROUGH LEAD WIRE AND A HERMETIC SEAL INSULATOR 审中-公开
公开(公告)号：US20170087356A1
公开(公告)日：2017-03-30
申请号：US15375315
申请日：2016-12-12
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC分类号： A61N1/08 , A61N1/375 , H03H1/00 , A61N1/37
CPC分类号： A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , A61N2001/086 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K2201/10015
摘要： An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the Insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. There is also an active path electrically extending between the active end metallization of the chip capacitor and the lead wire. The active path comprises at least a first electrical connection material connected directly to both the second gold braze and the lead wire, and the first electrical connection material is electrically connected to the active end metallization of the chip capacitor.

23. 发明申请

US20170087354A1 MLCC FILTER ON AN AIMD CIRCUIT BOARD WITH DIRECT CONNECT TO GOLD BRAZE BETWEEN A HERMETIC FEEDTHROUGH FERRULE AND INSULATOR 有权
公开(公告)号：US20170087354A1
公开(公告)日：2017-03-30
申请号：US15373139
申请日：2016-12-08
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
IPC分类号： A61N1/08 , H01G4/40 , H01G4/35 , A61N1/375 , H03H1/00 , H03H7/01 , H05K1/18 , A61N1/37 , H01R13/7195 , H05K5/00
CPC分类号： A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , A61N2001/086 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K2201/10015
摘要： An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

24. 发明授权

US09492659B2 Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device 有权
标题翻译：与氧化铝基底和铂填充通孔用于有源可植入医疗器械的共烧密封馈通
公开(公告)号：US09492659B2
公开(公告)日：2016-11-15
申请号：US14182569
申请日：2014-02-18
申请人： Greatbatch Ltd.
发明人： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC分类号： H01R43/00 , A61N1/08 , A61N1/05 , H01G4/35 , H01G2/10 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , A61N1/375 , C22C29/12
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
摘要翻译：共同燃烧的密封馈通可附接到主动植入式医疗装置。馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。通孔穿过氧化铝电介质基板从体液侧设置到器件侧。在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

25. 发明申请

US20160263373A1 RF FILTER ON A CIRCUIT BOARD FOR AN ACTIVE MEDICAL DEVICE (AMD) FOR HANDLING HIGH RF POWER INDUCED IN AN ASSOCIATED IMPLANTED LEAD FROM AN EXTERNAL RF FIELD 有权
标题翻译：用于处理来自外部RF场的相关外延引线中引起的高RF功率的有源医疗设备（AMD）的电路板上的射频滤波器
公开(公告)号：US20160263373A1
公开(公告)日：2016-09-15
申请号：US15163241
申请日：2016-05-24
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Robert Shawn Johnson , Warren S. Dabney , Thomas Marzano , Richard L. Brendel , Christopher Michael Williams , Holly Noelle Moschiano , Keith W. Seitz , John E. Roberts
IPC分类号： A61N1/08 , A61N1/375 , H01G4/35 , H01G4/30 , H01G4/005 , A61N1/37 , H01G4/12
CPC分类号： A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/3754 , A61N1/3758 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H03H1/0007
摘要： An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.
摘要翻译： AIMD包括导电壳体，具有绝缘体的导电套圈密封密封套圈开口。导电通路密封并通过绝缘体设置。滤波电容器设置在壳体内的电路板上，并且具有支撑交错的至少两个有源和两个接地电极板的电介质体，其中至少两个有源电极板电连接到器件侧的导电路径，以及所述至少两个接地电极板电耦合到套圈和/或导电壳体。电介质体的介电常数小于1000，电容为10至20,000皮法。滤波电容器被配置为通过低ESR对MRI高RF脉冲功率进行EMI滤波，其中以RF射频脉冲频率或频率范围的滤波电容器的ESR小于2.0欧姆。

26. 发明授权

US09427596B2 Low impedance oxide resistant grounded capacitor for an AIMD 有权
标题翻译：用于AIMD的低阻抗氧化物接地电容器
公开(公告)号：US09427596B2
公开(公告)日：2016-08-30
申请号：US14826229
申请日：2015-08-14
申请人： Greatbatch Ltd.
发明人： Jason Woods , Richard L. Brendel , Robert A. Stevenson , Christopher Michael Williams , Robert Naugler , Christine A. Frysz
IPC分类号： A61N1/00 , A61N1/375 , H02G15/013 , H01G4/35 , H01G4/40 , H01G2/02 , H01G4/228 , H01R13/7195 , H03H1/00
CPC分类号： A61N1/3754 , H01G2/02 , H01G4/228 , H01G4/35 , H01G4/40 , H01R13/7195 , H02G15/013 , H03H1/00 , H03H2001/0042 , H03H2001/0085
摘要： A hermetically sealed filtered feedthrough assembly for an AIMD includes an electrically conductive ferrule with an electrically conductive extension at least partially extending into the ferrule opening. An electrically non-conductive insulator hermetically seals the ferrule opening. An electrically conductive pathway is hermetically sealed and disposed through the insulator between a body fluid and device side. A filter capacitor is located on the device side. A first low impedance electrical coupling is between a first metallization of the filter capacitor and the pathway. A ground conductor is disposed through the filter capacitor in non-conductive relation with the at least one active and ground electrode plates, where the ground conductor is electrically coupled to the extension of the ferrule. An oxide-resistant metal addition is disposed on the device side and electrically couples the ground conductor to the second metallization of the filter capacitor.
摘要翻译：用于AIMD的气密密封的过滤馈通组件包括具有至少部分延伸到套圈开口中的导电延伸部的导电套圈。非导电绝缘体气密地密封套圈开口。导电通路密封并通过绝缘体设置在体液和器件侧之间。滤波电容器位于器件侧。第一低阻抗电耦合在滤波电容器的第一金属化和通路之间。接地导体与所述至少一个有源和接地电极板以非导电关系设置穿过所述滤波电容器，其中所述接地导体电耦合到所述套圈的延伸部。在器件侧设置耐氧化金属添加剂，并将接地导体电耦合到滤波电容器的第二金属化。

27. 发明申请

US20160008595A1 EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：电磁干扰过滤共同连接的传播途径，有源可插拔医疗设备的有用电容器和引线组件
公开(公告)号：US20160008595A1
公开(公告)日：2016-01-14
申请号：US14864959
申请日：2015-09-25
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Thomas Marzano , Keith W. Seitz , Steven W. Winn , Christine A. Frysz , Richard L. Brendel , Jason Woods , Dominick J. Frustaci , Xiaohong Tang , William C. Thiebolt
IPC分类号： A61N1/08 , H02G3/22 , H01G4/40 , H01G4/005 , H01G4/12 , H01G4/35
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
摘要翻译：一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地电极板电耦合到外部金属化。导电引线设置在未填充的电容器通孔内。电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

28. 发明授权

US09014808B2 RF filter for an active medical device (AMD) for handling high RF power induced in an associated implanted lead from an external RF field 有权
标题翻译：用于处理来自外部RF场的相关植入引线中感应的高RF功率的有源医疗器件（AMD）的RF滤波器
公开(公告)号：US09014808B2
公开(公告)日：2015-04-21
申请号：US14187297
申请日：2014-02-23
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Robert S. Johnson , Dominick J. Frustaci , Warren S. Dabney , Keith W. Seitz , Thomas Marzano , John E. Roberts , William C. Thiebolt , Christopher M. Williams , Buehl E. Truex
IPC分类号： H01G4/35 , A61N1/08 , A61N1/37 , A61N1/375 , H03H1/00 , A61N1/05
CPC分类号： A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
摘要： An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
摘要翻译：用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮法之间的电容的电容器，以及温度介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。

29. 发明授权

US08938309B2 Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device 有权
标题翻译：适用于在有源可植入医疗装置的体液侧的电导体侧面附接的高密封气动穿通绝缘体
公开(公告)号：US08938309B2
公开(公告)日：2015-01-20
申请号：US13742781
申请日：2013-01-16
申请人： Greatbatch Ltd.
发明人： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Buehl E. Truex , Donald Hickel, Jr.
IPC分类号： A61N1/00 , H01R43/00 , A61N1/05 , A61N1/375 , H01G4/35 , H01G2/10 , A61N1/372 , C22C29/12
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
摘要翻译：升高的馈通可附接到有源可植入医疗装置的顶部或侧面。馈通包括导电套圈和电介质基片。电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。电介质基片包括通常在导电套圈上方升高的体液侧提升部分。至少一个通孔穿过电介质基底从体液侧设置到器件侧。导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

30. 发明申请

US20140330355A1 IMPLANTABLE LEAD HAVING MULTI-PLANAR SPIRAL INDUCTOR FILTER 有权
标题翻译：具有多平面螺旋电感滤波器的可植入引线
公开(公告)号：US20140330355A1
公开(公告)日：2014-11-06
申请号：US14316896
申请日：2014-06-27
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Warren S. Dabney , Christine A. Frysz , Richard L. Brendel
IPC分类号： A61N1/08 , A61N1/05
CPC分类号： A61N1/08 , A61N1/05 , A61N1/086 , H01F17/02 , H03H1/0007
摘要： A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.
摘要翻译：在选定的RF诊断或治疗频率或频率范围内具有初级共振的多层螺旋波滤波器包括形成可植入医疗引线的至少一部分的细长导体。细长导体包括具有至少一个平坦表面的第一螺旋缠绕段，形成第一感应组件的第一端和第二端，以及具有至少一个平坦表面的第二螺旋缠绕段，第一端和第二端端部，其形成第二电感元件。第一和第二螺旋缠绕段在相同的纵向缠绕并共享共同的纵向轴线。螺旋缠绕段的平面表面彼此面对，并且电介质材料设置在螺旋缠绕段的相对的平坦表面之间和螺旋缠绕段的相邻线圈之间，从而形成电容。

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