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    • 21. 发明授权
    • SRAM-type memory cell
    • SRAM型存储单元
    • US08575697B2
    • 2013-11-05
    • US13039167
    • 2011-03-02
    • Carlos MazureRichard FerrantBich-Yen Nguyen
    • Carlos MazureRichard FerrantBich-Yen Nguyen
    • H01L27/11H01L27/12G11C5/06G11C11/00
    • H01L27/1104G11C11/412H01L21/84H01L27/1203
    • An SRAM-type memory cell that includes a semiconductor on insulator substrate having a thin film of semiconductor material separated from a base substrate by an insulating layer; and six transistors such as two access transistors, two conduction transistors and two charge transistors arranged so as to form with the conduction transistors two back-coupled inverters. Each of the transistors has a back control gate formed in the base substrate below the channel and able to be biased in order to modulate the threshold voltage of the transistor, with a first back gate line connecting the back control gates of the access transistors to a first potential and a second back gate line connecting the back control gates of the conduction transistors and charge transistors to a second potential. The first and second potentials can be modulated according to the type of cell control operation.
    • 一种SRAM型存储单元,包括绝缘体上半导体衬底,其具有通过绝缘层从基底衬底分离的半导体材料薄膜; 以及六个晶体管,例如两个存取晶体管,两个导通晶体管和两个电荷晶体管,其布置成与导通晶体管形成两个反向耦合的反相器。 每个晶体管具有形成在通道下方的基底衬底中的后控制栅极,并且能够被偏置以便调制晶体管的阈值电压,第一背栅极线将存取晶体管的背控制栅极连接到 第一电位和第二背栅极线,其将导通晶体管和电荷晶体管的背控制栅极连接到第二电位。 第一和第二电位可以根据电池控制操作的类型进行调制。
    • 22. 发明授权
    • Data-path cell on an SeOI substrate with a back control gate beneath the insulating layer
    • SeOI衬底上的数据通道单元,在绝缘层下面带有一个后控制栅极
    • US08432216B2
    • 2013-04-30
    • US13007483
    • 2011-01-14
    • Carlos MazureRichard Ferrant
    • Carlos MazureRichard Ferrant
    • G05F1/10H01L27/105G06F17/50
    • H01L27/1203H01L29/78609H01L29/78648
    • The invention provides a data-path cell specifically adapted to its environment for use in an integrated circuit produced on a semiconductor-on-insulator (SeOI) substrate. The data-path cell includes an array of field-effect transistors, each transistor having a source region, a drain region and a channel region formed in the thin semiconductor layer of the SeOI substrate, and further having a front gate control region formed above the channel region. In particular, one or more transistors of the data-path cell further includes a back gate control region formed in the bulk substrate beneath the channel region and configured so as to modify the performance characteristics of the transistor in dependence on its state of bias. Also, an integrated circuit including one or more of the data-path cells and methods for designing or driving these data-path cells.
    • 本发明提供一种特别适用于其环境的数据通道单元,用于在绝缘体上半导体(SeOI)衬底上制造的集成电路中。 数据通道单元包括场效应晶体管阵列,每个晶体管具有形成在SeOI衬底的薄半导体层中的源极区,漏极区和沟道区,并且还具有形成在栅极上的前栅极控制区 渠道区域。 特别地,数据通道单元的一个或多个晶体管还包括形成在沟道区下面的体衬底中的背栅极控制区域,并且被配置为根据其偏置状态来修改晶体管的性能特性。 而且,包括一个或多个数据路径单元的集成电路以及用于设计或驱动这些数据路径单元的方法。
    • 24. 发明授权
    • Methods for manufacturing multilayer wafers with trench structures
    • 制造具有沟槽结构的多层晶圆的方法
    • US08309426B2
    • 2012-11-13
    • US13093615
    • 2011-04-25
    • Konstantin BourdelleCarlos Mazure
    • Konstantin BourdelleCarlos Mazure
    • H01L21/76
    • H01L21/76283H01L21/76275H01L29/66181
    • The present invention provides methods for the manufacture of a trench structure in a multilayer wafer that comprises a substrate, an oxide layer on the substrate and a semiconductor layer on the oxide layer. These methods include the steps of forming a trench through the semiconductor layer and the oxide layer and extending into the substrate, and of performing an anneal treatment of the formed trench such that at the inner surface of the trench some material of the semiconductor layer flows at least over a portion of the part of the oxide layer exposed at the inner surface of the trench. Substrates manufactured according to this invention are advantageous for fabricating various semiconductor devices, e.g., MOSFETs, trench capacitors, and the like.
    • 本发明提供了在多层晶片中制造沟槽结构的方法,该多层晶片包括衬底,衬底上的氧化物层和氧化物层上的半导体层。 这些方法包括以下步骤:通过半导体层和氧化物层形成沟槽并延伸到衬底中,并且对所形成的沟槽进行退火处理,使得在沟槽的内表面处,半导体层的一些材料在 至少暴露在沟槽内表面的部分氧化物层的一部分。 根据本发明制造的衬底有利于制造各种半导体器件,例如MOSFET,沟槽电容器等。
    • 30. 发明申请
    • DATA-PATH CELL ON AN SeOI SUBSTRATE WITH A BACK CONTROL GATE BENEATH THE INSULATING LAYER
    • 具有后控制门的SeOI基板上的数据路径电池绝缘层
    • US20110133822A1
    • 2011-06-09
    • US13013580
    • 2011-01-25
    • Carlos MazureRichard Ferrant
    • Carlos MazureRichard Ferrant
    • G05F1/10H01L27/105G06F17/50
    • H01L21/84H01L27/0207H01L27/11807H01L27/1203
    • This invention provides a semiconductor device structure formed on a conventional semiconductor-on-insulator (SeOI) substrate defined by a pattern defining at least one field-effect transistor having: in the thin film of the SeOI substrate, a source region, a drain region, a channel region, and a front control gate region formed above the channel region; and in the base substrate beneath the buried oxide of the SeOI substrate, a back control gate region, arranged under the channel region and configured to shift the threshold voltage of the transistor in response to bias voltages. This invention also provides patterns defining standard-cell-type circuit structures and data-path-cell type circuit structures that include arrays of the FET patterns provided by this invention. Such circuit structures also include back gate lines connecting the back gate control regions. This invention also provides methods of operating and designing such semiconductor device structures.
    • 本发明提供了一种半导体器件结构,其形成在传统的绝缘体上半导体(SeOI)衬底上,该衬底由限定至少一个场效应晶体管的图案限定,该场效应晶体管具有:在SeOI衬底的薄膜中,源极区, ,沟道区和形成在沟道区上方的前控制栅区; 以及位于所述SeOI衬底的所述掩埋氧化物之下的所述基底衬底中,所述背面控制栅极区域布置在所述沟道区域下方并且被配置为响应于偏压而移位所述晶体管的阈值电压。 本发明还提供了定义包括由本发明提供的FET图案的阵列的标准单元型电路结构和数据路径单元型电路结构的图案。 这种电路结构还包括连接背栅极控制区域的后栅极线。 本发明还提供了操作和设计这种半导体器件结构的方法。