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21. 发明申请

US20070075726A1 Interposer and test assembly for testing electronic devices 有权
标题翻译：用于测试电子设备的插件和测试组件
公开(公告)号：US20070075726A1
公开(公告)日：2007-04-05
申请号：US11607973
申请日：2006-12-04
申请人： Benson Chan , Frank Egitto , Voya Markovich
发明人： Benson Chan , Frank Egitto , Voya Markovich
IPC分类号： G01R31/26
CPC分类号： G01R1/06711 , G01R1/0735 , G01R1/07378 , H05K1/0393 , H05K3/365 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09627 , H05K2201/09745 , H05K2201/10378
摘要： A test apparatus which uses a pair of substrates and housing to interconnect a host substrate (e.g., PCB) to an electronic device (e.g., semiconductor chip) to accomplish testing of the device. The apparatus includes a housing designed for being positioned on the PCB and have one of the substrates oriented therein during device engagement. The engaging contacts of the upper (second) substrate are sculpted to assure effective chip connection.
摘要翻译：一种测试装置，其使用一对基板和壳体将主机基板（例如，PCB）与电子设备（例如，半导体芯片）互连以完成设备的测试。该装置包括被设计用于定位在PCB上的壳体，并且在装置接合期间其中一个基板定向于其中。上（第二）衬底的接合触点被雕刻以确保有效的芯片连接。

22. 发明申请

US20050289019A1 Method and system for tracking goods 有权
标题翻译：跟踪货物的方法和系统
公开(公告)号：US20050289019A1
公开(公告)日：2005-12-29
申请号：US10860067
申请日：2004-06-04
申请人： Benson Chan , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , How Lin , William Maines , Voya Markovich
IPC分类号： B65G61/00 , G06K17/00 , G06Q10/00 , G06Q99/00
CPC分类号： G06K17/00 , G06Q10/08 , G06Q10/087
摘要： A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.
摘要翻译：一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问通过和包括装运，例如，给客户。主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

23. 发明授权

US07142121B2 Radio frequency device for tracking goods 失效
标题翻译：射频设备跟踪商品
公开(公告)号：US07142121B2
公开(公告)日：2006-11-28
申请号：US10860071
申请日：2004-06-04
申请人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K2017/0045 , G06Q10/087
摘要： A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).
摘要翻译：用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个的货物被运输和跟踪。或者，该装置可以通过其他方式（例如，粘合剂）附接。托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量，类型等）。

24. 发明申请

US20060213973A1 Electronic card assembly 有权
标题翻译：电子卡组装
公开(公告)号：US20060213973A1
公开(公告)日：2006-09-28
申请号：US11086324
申请日：2005-03-23
申请人： Benson Chan , How Lin , Voya Markovich , Ronald Smith
发明人： Benson Chan , How Lin , Voya Markovich , Ronald Smith
IPC分类号： G06K5/00 , G06K19/06
CPC分类号： G06K19/005 , G06K7/084 , G06K17/00 , G06K19/07354 , G06K2017/0064
摘要： An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.
摘要翻译：提供了一种电子卡组件，其包括其中具有可移动卡的保护壳体。在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹）被大会的阅读器组件接收。

25. 发明授权

US07552091B2 Method and system for tracking goods 有权
标题翻译：跟踪货物的方法和系统
公开(公告)号：US07552091B2
公开(公告)日：2009-06-23
申请号：US10860067
申请日：2004-06-04
申请人： Benson Chan , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , How Lin , William Maines , Voya Markovich
IPC分类号： G06Q99/00
CPC分类号： G06K17/00 , G06Q10/08 , G06Q10/087
摘要： A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.
摘要翻译：一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问通过和包括装运，例如，给客户。主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

26. 发明申请

US20050270160A1 Radio frequency device for tracking goods 失效
标题翻译：射频设备跟踪商品
公开(公告)号：US20050270160A1
公开(公告)日：2005-12-08
申请号：US10860071
申请日：2004-06-04
申请人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
IPC分类号： G06K17/00 , G06K19/077 , G06Q10/00 , G08B1/08
CPC分类号： G06K19/07749 , G06K2017/0045 , G06Q10/087
摘要： A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).
摘要翻译：用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个的货物被运输和跟踪。或者，该装置可以通过其他方式（例如，粘合剂）附接。托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量，类型等）。

27. 发明申请

US20070166944A1 Method of making circuitized substrate 有权
标题翻译：制造电路化基板的方法
公开(公告)号：US20070166944A1
公开(公告)日：2007-07-19
申请号：US11324432
申请日：2006-01-04
申请人： Robert Japp , John Lauffer , Voya Markovich , William Wilson
发明人： Robert Japp , John Lauffer , Voya Markovich , William Wilson
IPC分类号： H01L21/20
CPC分类号： H05K3/4641 , H05K3/429 , H05K2203/068
摘要： A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.
摘要翻译：一种制造电路化基板的方法和使用其的电气组件，其中基板由至少两个亚复合材料构成，其中这些亚复合材料中的至少一个的介电材料在粘合（例如，层压）期间被加热到另一个足以使电介质材料流入并基本上填充用于接合结构的导电层中的开口。导电通孔形成在接合结构内，以耦合所选择的结构导电层。通过将一个或多个电气部件（例如，半导体芯片或芯片载体）定位在最终结构上并将其电耦合到结构的外部电路，可以形成电组件。

28. 发明申请

US20060154434A1 Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate 有权
标题翻译：制造用于电路化衬底的内部电容性衬底的方法和制造所述电路化衬底的方法
公开(公告)号：US20060154434A1
公开(公告)日：2006-07-13
申请号：US11172794
申请日：2005-07-05
申请人： Rabindra Das , John Lauffer , Voya Markovich , James Matthews
发明人： Rabindra Das , John Lauffer , Voya Markovich , James Matthews
IPC分类号： H01L21/20 , H01L21/44
CPC分类号： H05K1/162 , H05K3/4611 , H05K3/4688 , H05K2201/0209 , H05K2201/09309 , H05K2201/09509 , H05K2203/0207
摘要： A method of forming a capacitive substrate in which first and second conductors are formed opposite a dielectric, with one of these electrically coupled to a thru-hole connection. Each functions as an electrode for the resulting capacitor. The substrate is then adapted for being incorporated within a larger structure to form a circuitized substrate such as a printed circuit board or a chip carrier. Additional capacitors are also possible.
摘要翻译：一种形成电容基板的方法，其中第一和第二导体与电介质相对地形成，其中一个电气基板电耦合到通孔连接。每个都用作所得电容器的电极。然后将衬底适用于并入更大的结构中以形成诸如印刷电路板或芯片载体的电路化衬底。附加的电容器也是可能的。

29. 发明申请

US20070007033A1 Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate 有权
标题翻译：具有涂层微粒糊连接的电路化基板，多层基板组件，利用其的电气组件和信息处理系统以及制造所述基板的方法
公开(公告)号：US20070007033A1
公开(公告)日：2007-01-11
申请号：US11244180
申请日：2005-10-06
申请人： Rabindra Das , John Lauffer , Roy Magnuson , Voya Markovich
发明人： Rabindra Das , John Lauffer , Roy Magnuson , Voya Markovich
IPC分类号： H05K1/09
CPC分类号： H05K3/4069 , H05K3/429 , H05K3/4614 , H05K2201/015 , H05K2201/0245 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/1152
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.
摘要翻译：一种电路化基板，包括用于提供电连接的导电浆料。在一个实施方案中，糊状物包含粘合剂组分和至少一种包含微粒的金属组分。在另一个实施方案中，糊状物包括粘合剂和多根纳米线。所选择的微粒或纳米线包括其上的焊料层。还提供了制造这种基板的方法，以及用于将这种基板作为其一部分的电组件和信息处理系统适配器。

30. 发明申请

US20060248717A1 Method of making circuitized substrate with filled isolation border 失效
标题翻译：制造具有填充隔离边界的电路化基板的方法
公开(公告)号：US20060248717A1
公开(公告)日：2006-11-09
申请号：US11482945
申请日：2006-07-10
申请人： John Lauffer , James Larnerd , Voya Markovich
发明人： John Lauffer , James Larnerd , Voya Markovich
IPC分类号： H05K3/10 , H05K3/36
CPC分类号： H05K3/44 , H05K1/056 , H05K3/0047 , H05K3/0052 , H05K3/429 , H05K3/4641 , H05K2203/0323 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer.
摘要翻译：一种制造电路化衬底的方法，该衬底包括沿着其至少一个导电层的侧边缘部分的多个邻接的开放段，这些开放段通过电介质材料的屏障隔开，其基本上填充开放段，例如在层压工艺，其将基板的两个电介质层粘合到导电层。

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