专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20060261472A1 Multilayer module and method of manufacturing the same 失效
标题翻译：多层模块及其制造方法
公开(公告)号：US20060261472A1
公开(公告)日：2006-11-23
申请号：US11435716
申请日：2006-05-18
申请人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
发明人： Junichi Kimura , Kazuhiko Honjo , Eiji Kawamoto , Shinji Harada , Motoyoshi Kitagawa
IPC分类号： H01L23/34
CPC分类号： H05K1/144 , H01L23/49827 , H01L23/5384 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/50 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06548 , H01L2225/06565 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/0237 , H05K1/185 , H05K3/0052 , H05K3/3436 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10371 , H05K2201/10666 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A multilayer module which includes parts-containing module whose circuit board has been mounted at one surface with electronic component and the electronic component is covered with resin layer. Connection terminals have been provided either at resin layer or at the other surface of circuit board, also through hole has been provided for connection between the two surfaces of module. Also included is module, which has been provided with connection terminals at a place corresponding to connection terminal, and through hole for connection between the connection terminals and electronic component. Disposed between conductor layer and conductor layer is insulation layer, which insulation layer having conductive bond for connection between connection terminals, respectively. In the above-described configuration, places of through hole and electronic component in module are not restricted by a location of through hole.
摘要翻译：一种多层模块，其包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。已经在树脂层或电路板的另一表面设置了连接端子，并且还提供了用于在模块的两个表面之间连接的通孔。还包括在对应于连接端子的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。在导体层和导体层之间设置绝缘层，绝缘层分别具有用于连接端子之间连接的导电接合层。在上述结构中，模块中的通孔和电子部件的位置不受通孔的位置的限制。

22. 发明申请

US20060260122A1 Component-embedded printed wiring board and method of manufacturing the same 失效
标题翻译：组件嵌入式印刷电路板及其制造方法
公开(公告)号：US20060260122A1
公开(公告)日：2006-11-23
申请号：US11434763
申请日：2006-05-17
申请人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
发明人： Kazuhiko Honjo , Toshihiko Mori , Eiji Kawamoto , Junichi Kimura , Motoyoshi Kitagawa
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/3511 , H05K3/284 , H05K3/4652 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/0401
摘要： A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at place corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with a pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any airs, and the reliable PWB is thus obtainable.
摘要翻译：公开了一种组件嵌入式印刷电路板（PWB）。该PWB包括（a）在与电子部件对应的位置处形成的流体树脂嵌入部，使得嵌入部覆盖电子部件，（b）与电路基板的顶面平行设置的树脂流速加速器，围绕所述嵌入部分，以及（c）至少在所述加速器和所述电路板之间配置树脂。流体树脂嵌入部分填充与粘合树脂相同的树脂。这种结构允许加速器以施加到PWB的压力来压缩树脂，使得树脂趋于沿着电路板流动。结果，流体树脂嵌入部分被树脂充分填充而不留下任何空气，从而可获得可靠的PWB。

23. 发明授权

US06998532B2 Electronic component-built-in module 有权
标题翻译：电子元件内置模块
公开(公告)号：US06998532B2
公开(公告)日：2006-02-14
申请号：US10500539
申请日：2003-12-22
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
IPC分类号： H01L23/28
CPC分类号： H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H05K2201/0209 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.
摘要翻译：模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料，覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

24. 发明授权

US08564171B2 Acoustic wave element and electronic device including the same 有权
标题翻译：声波元件和包括其的电子设备
公开(公告)号：US08564171B2
公开(公告)日：2013-10-22
申请号：US13248148
申请日：2011-09-29
申请人： Toru Yamaji , Mitsuhiro Furukawa , Koji Kawakita , Eiji Kawamoto
发明人： Toru Yamaji , Mitsuhiro Furukawa , Koji Kawakita , Eiji Kawamoto
IPC分类号： H03H9/25
CPC分类号： H03H9/1092
摘要： An acoustic wave element includes a piezoelectric substrate, an IDT electrode, a sidewall, a lid, and an adhesive layer. The IDT electrode is provided on the piezoelectric substrate. The sidewall is provided around the IDT electrode above the piezoelectric substrate. The lid is provided above the sidewall so as to cover a space above the IDT electrode. The adhesive layer is made of an adhesive provided between the lid and the sidewall. The top surface of the sidewall has a groove. The groove is filled with an adhesive, which reduces the protrusion amount of the adhesive.
摘要翻译：声波元件包括压电基片，IDT电极，侧壁，盖子和粘合剂层。 IDT电极设置在压电基片上。侧壁设置在压电基板上方的IDT电极周围。盖子设置在侧壁上方以覆盖IDT电极上方的空间。粘合剂层由设置在盖和侧壁之间的粘合剂制成。侧壁的顶面具有凹槽。凹槽填充有粘合剂，这降低了粘合剂的突出量。

25. 发明授权

US07382628B2 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US07382628B2
公开(公告)日：2008-06-03
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/18
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

26. 发明申请

US20050051358A1 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US20050051358A1
公开(公告)日：2005-03-10
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/02 , H05K1/14 , H05K3/28 , H05K3/34 , H05K3/46 , H05K9/00 , H05K7/06
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

27. 发明授权

US06514364B2 Manufacturing method of wiring board, and conductive paste used therein 失效
标题翻译：接线板的制造方法及其中使用的导电糊
公开(公告)号：US06514364B2
公开(公告)日：2003-02-04
申请号：US09459778
申请日：1999-12-13
申请人： Kazuhiro Miura , Yoshihisa Takase , Masaaki Hayama , Eiji Kawamoto , Yuji Yagi
发明人： Kazuhiro Miura , Yoshihisa Takase , Masaaki Hayama , Eiji Kawamoto , Yuji Yagi
IPC分类号： B32B3112
CPC分类号： H05K3/207 , H05K1/0306 , H05K1/092 , H05K3/386 , H05K3/4647 , H05K2203/0113
摘要： The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.
摘要翻译：导电粒子可以不受粘合剂层的软化和去除的影响而被烧结。结果，可以形成高精度的布线图案，而不会导致导电图案的变形。其包括在膜上填充具有导电性成分和树脂的导电膏的布线图案的槽的步骤，将具有导电性浆料的膜的导电性糊料侧表面粘接到陶瓷基板的粘合剂层侧面的工序具有粘合剂层的步骤，通过从具有膜，导电浆料，粘合剂层，陶瓷基板和膜的第一层压体剥离薄膜基材，在粘合剂层表面上形成导电图案的步骤，并且将导电浆料填充物将凹槽放置在粘合剂层的表面上，以及烧制具有陶瓷基板，粘合剂层和导电图案的第二层压体的步骤，去除粘合剂层并烧结导电颗粒，其中导电糊剂至少（i）在粘合剂层软化之后烧结，或（ii）在粘合剂层被燃烧之后。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式