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1. 发明授权

US06514364B2 Manufacturing method of wiring board, and conductive paste used therein 失效
标题翻译：接线板的制造方法及其中使用的导电糊
公开(公告)号：US06514364B2
公开(公告)日：2003-02-04
申请号：US09459778
申请日：1999-12-13
申请人： Kazuhiro Miura , Yoshihisa Takase , Masaaki Hayama , Eiji Kawamoto , Yuji Yagi
发明人： Kazuhiro Miura , Yoshihisa Takase , Masaaki Hayama , Eiji Kawamoto , Yuji Yagi
IPC分类号： B32B3112
CPC分类号： H05K3/207 , H05K1/0306 , H05K1/092 , H05K3/386 , H05K3/4647 , H05K2203/0113
摘要： The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.
摘要翻译：导电粒子可以不受粘合剂层的软化和去除的影响而被烧结。结果，可以形成高精度的布线图案，而不会导致导电图案的变形。其包括在膜上填充具有导电性成分和树脂的导电膏的布线图案的槽的步骤，将具有导电性浆料的膜的导电性糊料侧表面粘接到陶瓷基板的粘合剂层侧面的工序具有粘合剂层的步骤，通过从具有膜，导电浆料，粘合剂层，陶瓷基板和膜的第一层压体剥离薄膜基材，在粘合剂层表面上形成导电图案的步骤，并且将导电浆料填充物将凹槽放置在粘合剂层的表面上，以及烧制具有陶瓷基板，粘合剂层和导电图案的第二层压体的步骤，去除粘合剂层并烧结导电颗粒，其中导电糊剂至少（i）在粘合剂层软化之后烧结，或（ii）在粘合剂层被燃烧之后。

2. 发明授权

US06347584B1 Method of manufacturing electronic components using intaglio plate having dual releasing layers 失效
标题翻译：使用具有双重释放层的凹版印刷电路板制造方法
公开(公告)号：US06347584B1
公开(公告)日：2002-02-19
申请号：US09589346
申请日：2000-06-08
申请人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
发明人： Eiji Kawamoto , Kazuhiro Miura , Masaaki Hayama , Yoshihisa Takase
IPC分类号： B41N106
CPC分类号： B41N1/06 , B41M1/10 , H05K1/0306 , H05K1/0313 , H05K1/0393 , H05K3/207 , H05K2203/0113
摘要： A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio 1 having a dual releasing layer structure is used. In this structure, first releasing layer 2 is formed on the surface of intaglio 1 by chemical absorption, and second releasing layer 3 is formed on the first releasing layer by physical adsorption. This structure allows intaglio 1 to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer 3 can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio 1. As a result, patterns for electronic components can be formed on substrates at an excellent yield.
摘要翻译：使用凹版印刷制造电子元件以提高印刷产量的方法。使用具有双重释放层结构的凹版1。在这种结构中，通过化学吸收在凹版1的表面上形成第一释放层2，通过物理吸附在第一释放层上形成第二释放层3。这种结构使得凹版印刷机1具有稳定的剥离能力，从而提高印刷产率。此外，由于可以根据需要添加第二释放层3，所以即使在重复使用凹版印刷的情况下也不会降低打印质量。此外，双释放层结构可以提高凹版印刷版1的释放能力的耐久性。结果，可以以优异的成品率在基板上形成电子部件的图案。

3. 发明授权

US06374733B1 Method of manufacturing ceramic substrate 有权
标题翻译：制造陶瓷基板的方法
公开(公告)号：US06374733B1
公开(公告)日：2002-04-23
申请号：US09601776
申请日：2000-09-25
申请人： Masaaki Hayama , Noboru Mouri , Hayami Matsunaga , Masayuki Mizuno , Eiji Kawamoto , Yuji Yagi
发明人： Masaaki Hayama , Noboru Mouri , Hayami Matsunaga , Masayuki Mizuno , Eiji Kawamoto , Yuji Yagi
IPC分类号： B41M110
CPC分类号： H05K3/4647 , H01L21/4867 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0306 , H05K1/092 , H05K3/207 , H05K3/4053 , H05K3/4061 , H05K3/4605 , H05K3/4667 , H05K2203/0113 , H05K2203/0139
摘要： The present invention relates to a manufacturing method of a ceramic substrate used in various electronic appliances, and more particularly to a manufacturing method of a ceramic substrate forming a conductor pattern by intaglio printing. A conductive paste is supplied in the intaglio by using any one of screen mask, metal mask, or drawing device, and therefore the conductive paste can be supplied uniformly in desired positions only. The supplying amount of the conductive paste can be adjusted by repeating printing, so that an optimum amount can be set depending on the pattern. As a result, a fine wiring pattern of thick film can be easily formed, and a ceramic circuit board low in wiring resistance, high in wiring density, and high in dimensional precision of wiring pattern can be obtained.
摘要翻译：本发明涉及用于各种电子设备的陶瓷基板的制造方法，更具体地说，涉及通过凹版印刷形成导体图案的陶瓷基板的制造方法。通过使用屏幕掩模，金属掩模或拉制装置中的任何一个，在凹版中提供导电膏，因此导电浆可以均匀地供给到期望的位置。可以通过重复印刷来调整导电浆料的供给量，从而可以根据图案设定最佳量。结果，可以容易地形成厚膜的精细布线图案，并且可以获得布线电阻低，布线密度高，布线图形尺寸精度高的陶瓷电路板。

4. 发明授权

US06998532B2 Electronic component-built-in module 有权
标题翻译：电子元件内置模块
公开(公告)号：US06998532B2
公开(公告)日：2006-02-14
申请号：US10500539
申请日：2003-12-22
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
IPC分类号： H01L23/28
CPC分类号： H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H05K2201/0209 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.
摘要翻译：模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料，覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

5. 发明申请

US20050013082A1 Electronic component-built-in module 有权
标题翻译：电子元件内置模块
公开(公告)号：US20050013082A1
公开(公告)日：2005-01-20
申请号：US10500539
申请日：2003-12-22
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe
IPC分类号： H01L21/60 , H05K3/28 , H05K3/34 , H02H1/00
CPC分类号： H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H05K2201/0209 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2201/2036 , Y02P70/611 , H01L2924/00 , H01L2224/05599
摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.
摘要翻译：模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料，覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

6. 发明授权

US07382628B2 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US07382628B2
公开(公告)日：2008-06-03
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/18
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

7. 发明申请

US20050051358A1 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US20050051358A1
公开(公告)日：2005-03-10
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/02 , H05K1/14 , H05K3/28 , H05K3/34 , H05K3/46 , H05K9/00 , H05K7/06
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

8. 发明授权

US6141847A Method of manufacturing composite electronic component 失效
标题翻译：复合电子元器件制造方法
公开(公告)号：US6141847A
公开(公告)日：2000-11-07
申请号：US997164
申请日：1997-12-23
申请人： Masayuki Mizuno , Masaaki Hayama , Kazuhiro Miura , Noboru Mori , Akira Hashimoto , Mitsuteru Yamada
发明人： Masayuki Mizuno , Masaaki Hayama , Kazuhiro Miura , Noboru Mori , Akira Hashimoto , Mitsuteru Yamada
IPC分类号： H01G4/40 , H01G7/00
CPC分类号： H01G4/40 , Y10T29/435 , Y10T29/4902
摘要： A ceramic substrate 1 made of magnetic substance on which an inductor 2 is formed is prepared. A ceramic substrate 3 made of dielectric substance on which a capacitor 4 is formed is also prepared. An intermediate layer 5 made of lass paste is printed on the inductor 2 and the capacitor 4. After debinding the substrates 1 and 3 independently, both the substrates are filed with the intermediate layer 5 therebetween so that both the substrates may be glued and integrated. As such, because the debinding process is provided before filing, less gas is generated in firing, and as a result, voids are restrained from occurring.
摘要翻译：制备由其上形成有电感器2的磁性物质制成的陶瓷基板1。还制备了由其上形成有电容器4的介电材料制成的陶瓷基板3。在电感器2和电容器4上印刷由轻质糊料制成的中间层5.在独立地剥离基板1和3之后，两个基板之间留有中间层5，使得两个基板可以胶合并整合。因此，因为脱脂处理在提交之前提供，所以在烧制中产生较少的气体，结果，抑制了空隙的发生。

9. 发明授权

US06372158B1 Conductive paste 失效
标题翻译：导电胶
公开(公告)号：US06372158B1
公开(公告)日：2002-04-16
申请号：US09696687
申请日：2000-10-26
申请人： Akira Hashimoto , Takeo Yasuho , Masaaki Hayama , Kazuhiro Miura
发明人： Akira Hashimoto , Takeo Yasuho , Masaaki Hayama , Kazuhiro Miura
IPC分类号： H01B122
CPC分类号： H05K1/092 , H01B1/22
摘要： A paste of the present invention comprises a precious metal organic acid salt added to precious metal powder as a precious metal component of the conductive paste. The base metal organic acid salts are also used instead of base metal components in the inorganic binders to exclude particles with larger diameters from the conductive paste. The conductive paste of the present invention allows the lumps in the paste caused by the insufficient dispersion to be 10 &mgr;m &PHgr; or less, thereby remarkably reducing the screen blockage during screen printing of wiring pattern of 100 &mgr;m or less in width.
摘要翻译：本发明的糊剂包含贵金属有机酸盐，作为导电浆料的贵金属成分添加到贵金属粉末中。也可以使用贱金属有机酸盐代替无机粘合剂中的贱金属成分，以从导电糊中排除具有较大直径的颗粒。本发明的导电性糊料使由分散不充分引起的糊状物块为10μm＆amp; PHgr; 以下，在丝网印刷期间显着降低宽度为100μm以下的布线图案的屏幕堵塞。

10. 发明授权

US06846375B2 Method of manufacturing multilayer ceramic wiring board and conductive paste for use 失效
标题翻译：制造多层陶瓷布线板和使用的导电浆料的方法
公开(公告)号：US06846375B2
公开(公告)日：2005-01-25
申请号：US09979018
申请日：2001-03-15
申请人： Masaaki Hayama , Kazuhiro Miura , Akira Hashimoto , Takeo Yasuho
发明人： Masaaki Hayama , Kazuhiro Miura , Akira Hashimoto , Takeo Yasuho
IPC分类号： H01L21/48 , H05K3/46 , B32B31/26
CPC分类号： H01L21/4857 , H01L21/4867 , H05K3/4664
摘要： The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.
摘要翻译：本发明提供一种制造低温烧结多层陶瓷布线板的方法，包括以下步骤：通过在未烧成的生片（1）上印刷导电浆料（4）形成布线层; 在陶瓷基板的至少一侧层叠具有布线层的未烧成的生片，形成层叠体; 并烧制层压板。本发明还提供了用于该方法的糊剂。在烧成工序中，在用于层压燃烧的所述生片中的粘合剂层（8）或粘合剂树脂后，生片中的玻璃陶瓷开始烧结，玻璃陶瓷的烧结开始或之后，导电粒子导电膏开始烧结。该制造方法可以提供没有图案变形的精确布线板，并且还提供在电极周边的玻璃陶瓷中没有裂纹并且具有致密膜结构的电极的低温陶瓷多层布线板。

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