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21. 发明申请

US20140197532A1 Semiconductor Module and Method for Manufacturing Semiconductor Module 有权
标题翻译：半导体模块和半导体模块制造方法
公开(公告)号：US20140197532A1
公开(公告)日：2014-07-17
申请号：US13983291
申请日：2011-03-04
申请人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
发明人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
IPC分类号： H01L23/367 , H01L21/52
CPC分类号： H01L23/3675 , H01L21/52 , H01L23/3107 , H01L23/36 , H01L23/3735 , H01L23/42 , H01L23/433 , H01L23/473 , H01L23/49575 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/33 , H01L2224/33181 , H01L2224/40137 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/73265 , H01L2924/014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/20927 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.
摘要翻译：半导体模块包括壳体，该壳体包括由框架部分形成的容纳空间以及设置成彼此面对的壁对部分。壁部包括散热部和在框架部分处支撑散热部的支撑壁，壁部包括散热部和支撑壁，该支撑壁在框架部分处支撑散热部。设置在壁部的散热部分别设置成面对多个半导体器件块。多个单独的散热部被支撑壁包围，支撑壁变形为通过壳体内部的分离的散热部从框架部分凹陷，使得多个绝缘片紧密接合到多个引线框架和多个散热部分。

22. 发明申请

US20110012262A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110012262A1
公开(公告)日：2011-01-20
申请号：US12825783
申请日：2010-06-29
申请人： Toshiaki MORITA , Yusuke Yasuda , Eiichi Ide
发明人： Toshiaki MORITA , Yusuke Yasuda , Eiichi Ide
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/05624 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/325 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/8384 , H01L2224/92 , H01L2224/92247 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10272 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01026
摘要： A semiconductor device wherein a semiconductor element made of Si or Si group material mounted on a substrate, the semiconductor element is mounted on the substrate and the semiconductor element is bonded to a silver bonding material via a oxide film formed on the semiconductor element. The bonding material comprising silver oxide particles having an average particle size of 1 nm to 50 nm and an organic reducing agent is used for bonding in air, which gives a high bonding strength to the oxide on the semiconductor element.
摘要翻译：一种半导体器件，其中安装在衬底上的由Si或Si基团材料制成的半导体元件，所述半导体元件安装在所述衬底上，并且所述半导体元件经由形成在所述半导体元件上的氧化物膜结合到银接合材料。使用包含平均粒径为1nm〜50nm的氧化银粒子和有机还原剂的接合材料在空气中接合，这对半导体元件上的氧化物具有高的接合强度。

23. 发明授权

US09439332B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US09439332B2
公开(公告)日：2016-09-06
申请号：US14237975
申请日：2012-08-09
申请人： Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
发明人： Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
IPC分类号： H05K7/20 , H01L23/36 , H01L23/433 , H01L23/495 , B60L1/00 , B60L3/00 , B60L11/12 , B60L11/14 , B60L15/00 , B60L1/02 , B60L15/20 , H02M7/00 , H01L21/56 , H01L23/00 , H01L23/473
CPC分类号： H05K7/209 , B60L1/003 , B60L1/02 , B60L3/003 , B60L11/123 , B60L11/14 , B60L15/007 , B60L15/2036 , B60L2200/26 , B60L2200/42 , B60L2210/40 , B60L2220/14 , B60L2240/12 , B60L2240/24 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/525 , B60L2250/16 , B60L2250/24 , B60L2250/26 , B60L2260/28 , H01L21/565 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49575 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/06181 , H01L2224/291 , H01L2224/29139 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37157 , H01L2224/3716 , H01L2224/3718 , H01L2224/3754 , H01L2224/40137 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01047 , H01L2924/1203 , H01L2924/12042 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/203 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H05K7/20927 , Y02P90/60 , Y02T10/6217 , Y02T10/645 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/0002 , H01L2924/01033 , H01L2224/45099
摘要： A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.
摘要翻译：功率模块包括密封体，其中半导体芯片安装的导体板以暴露的导体板的散热表面的方式被树脂密封，散热构件被布置成面对散热表面以及设置在密封体和散热构件之间的绝缘层。绝缘层具有层叠体，其通过层叠浸渍树脂浸渍的陶瓷热喷涂膜和粘合树脂层而制成，其中混合具有良好导热性的填料，并且被设置成与散热构件接触以及至少全部的散热面，以及设置在散热构件和密封体之间的间隙中以覆盖层叠体的整个周向端部的应力消除树脂部。

24. 发明授权

US08400777B2 Electronic member, electronic part and manufacturing method therefor 失效
标题翻译：电子部件，电子部件及其制造方法
公开(公告)号：US08400777B2
公开(公告)日：2013-03-19
申请号：US12696590
申请日：2010-01-29
申请人： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda
发明人： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda
IPC分类号： H05K7/10
CPC分类号： H05K3/32 , C25D11/34 , H01L23/3142 , H01L23/481 , H01L23/49582 , H01L23/49811 , H01L23/49833 , H01L23/49866 , H01L23/50 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L33/62 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05169 , H01L2224/05568 , H01L2224/05639 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/16145 , H01L2224/16225 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48105 , H01L2224/48177 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81009 , H01L2224/81193 , H01L2224/81201 , H01L2224/81395 , H01L2224/81486 , H01L2224/8184 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K1/185 , H05K3/244 , H05K2201/10636 , H05K2201/10674 , H05K2203/0315 , H05K2203/1157 , H05K2203/121 , Y02P70/611 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/053 , H01L2224/83205
摘要： When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer.
摘要翻译：当氧化银还原成银时，在氧化银内形成大量的金属银芯。然后，氧化银被以中空的方式被还原，同时保持原有的外部结构。结果，产生的银的曲率变大。利用这种微观粒子实施机制，即使氧化银不是颗粒状构造而是紧密堆叠的层状结构，也可实现粘结。在本发明中，提供了一种电子部件，其包括用于输入/输出电信号的电极或用于建立与电信号的连接的连接端子，其中电极或连接端子的最上表面是银 - 氧化层。

25. 发明申请

US20120104618A1 LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD 审中-公开
标题翻译：低温接合材料和粘接方法
公开(公告)号：US20120104618A1
公开(公告)日：2012-05-03
申请号：US13348072
申请日：2012-01-11
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： H01L23/488
CPC分类号： H05K3/321 , B22F1/0014 , B22F1/0062 , B22F3/14 , B22F2003/145 , B23K35/22 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/83 , H01L25/072 , H01L2224/29007 , H01L2224/29101 , H01L2224/2919 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K2201/0224 , H05K2201/0257 , H05K2201/0266 , Y10T428/12028 , Y10T428/12181 , Y10T428/2991 , Y10T428/8305 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012
摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
摘要翻译：一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分，基于体积基数具有至少峰值分布的部分。本公开还涉及使用接合材料的接合方法。

26. 发明申请

US20100270515A1 ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH THE SAME, AND SEMICONDUCTOR DEVICE BONDED WITH THE SAME 有权
标题翻译：电导电粘接材料，与其结合的方法以及与其结合的半导体器件
公开(公告)号：US20100270515A1
公开(公告)日：2010-10-28
申请号：US12768778
申请日：2010-04-28
申请人： Yuusuke YASUDA , Toshiaki Morita , Eiichi Ide , Teiichi Inada
发明人： Yuusuke YASUDA , Toshiaki Morita , Eiichi Ide , Teiichi Inada
IPC分类号： H01B1/02 , H01B1/12 , B23K20/00
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.
摘要翻译：本发明提供一种接合材料和在不施加压力的情况下在较低温度下能够具有较高接合强度的接合界面处的金属接合方法，与平均粒径不大的金属颗粒的接合材料相比超过100nm。一种导电性接合材料，其包含（A）银颗粒，（B）氧化银，和（C）包含不超过30个碳原子的有机材料作为必要组分的分散剂，其中（A）银粉末，（B）氧化银粉末，（C）含有不超过30个碳原子的有机材料的分散剂的含量为99.0〜100重量％。换句话说，不含树脂粘合剂。

27. 发明申请

US20080156398A1 BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE 有权
标题翻译：使用金属颗粒的粘合方法和粘合材料
公开(公告)号：US20080156398A1
公开(公告)日：2008-07-03
申请号：US11965973
申请日：2007-12-28
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： B23K35/34
CPC分类号： B23K35/34 , B23K35/3612 , H01L23/3107 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29294 , H01L2224/29387 , H01L2224/29393 , H01L2224/30181 , H01L2224/32175 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/48739 , H01L2224/48839 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8384 , H01L2224/83986 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0541 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/48 , H01L2224/83205
摘要： It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 μm and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.
摘要翻译：本发明的目的是提供一种能够在与使用平均粒径不大于100nm的金属颗粒的接合材料相比在较低温度下的接合界面处通过金属接合实现接合的接合材料和接合方法。提供了一种粘合材料，其包括金属颗粒前体，金属颗粒前体是选自金属氧化物颗粒，金属碳酸盐颗粒和金属羧酸盐颗粒中的至少一种，平均粒径为1 以及由有机物构成的还原剂，其中金属颗粒前体的含量相对于每100质量份的接合材料大于50质量份且不大于99质量份。

28. 发明授权

US06556307B1 Method and apparatus for inputting three-dimensional data 失效
标题翻译：用于输入三维数据的方法和装置
公开(公告)号：US06556307B1
公开(公告)日：2003-04-29
申请号：US09393384
申请日：1999-09-10
申请人： Toshio Norita , Hiroshi Uchino , Eiichi Ide
发明人： Toshio Norita , Hiroshi Uchino , Eiichi Ide
IPC分类号： G01B1124
CPC分类号： G01B11/2518
摘要： A method and apparatus for inputting three-dimensional data are provided, in which operation for obtaining incident angles is not required and accuracy of three-dimensional data can be improved. The method includes steps of irradiating a reference light beam from a first starting point A to an object by a first angle &thgr;A, irradiating a reference light beam from a second starting point B separated from the first starting point A to the object by a second angle &thgr;B, moving the first and the second starting points A, B in one direction so as to perform sub scanning of an imaginary plane VS, detecting time points TA, TB when the reference light beam reflected by the object Q passes each sampling section of the imaginary plane; and calculating the position of the object for each sampling section in accordance with positions of the first and second starting points A, B in each of the detected time points TA, TB and first and second angles &thgr;A, &thgr;B.
摘要翻译：提供一种用于输入三维数据的方法和装置，其中不需要用于获得入射角的操作，并且可以提高三维数据的精度。该方法包括以下步骤：将来自第一起始点A的参考光束照射到物体上的第一角度θA，从与第一起始点A分离的第二起点B的参考光束照射到物体第二角度 θB，沿着一个方向移动第一和第二起始点A，B，以便进行虚拟平面VS的副扫描，当由对象Q反射的参考光束通过每个采样部分时检测时间点TA，TB 假想平面; 并且根据检测时间点TA，TB以及第一和第二角度θA，θB中的每一个中的第一和第二起始点A，B的位置来计算每个采样部分的对象的位置。

29. 发明授权

US09076780B2 Power module and lead frame for power module 有权
标题翻译：电源模块和电源模块引线框架
公开(公告)号：US09076780B2
公开(公告)日：2015-07-07
申请号：US13994417
申请日：2011-12-13
申请人： Yoshinori Negishi , Hiroshi Nakano , Eiichi Ide , Haruo Akahoshi , Motoko Harada , Toshiaki Ishii
发明人： Yoshinori Negishi , Hiroshi Nakano , Eiichi Ide , Haruo Akahoshi , Motoko Harada , Toshiaki Ishii
IPC分类号： H01L23/482 , H01L23/495 , H01L23/00 , H01L23/373 , H01L21/48 , H01L21/56 , H01L23/36 , H01L23/433 , H01L23/31
CPC分类号： H01L23/49568 , H01L21/4803 , H01L21/4807 , H01L21/481 , H01L21/4871 , H01L21/4878 , H01L21/4882 , H01L21/565 , H01L23/3107 , H01L23/36 , H01L23/373 , H01L23/3731 , H01L23/3735 , H01L23/4334 , H01L23/49582 , H01L24/26 , H01L24/27 , H01L24/28 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48245 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.
摘要翻译：本发明旨在提供一种功率模块的功率模块和引线框架，其能够在保持散热性能的同时提高散热器和绝缘树脂片材之间的粘附性。功率模块包括：引线框架，包括由Cu或Cu合金形成的导体板，以及至少形成在导体板的至少另一侧的与安装半导体器件的一侧相反的Al膜; 所述半导体器件安装在所述导体板的一侧上; 至少密封半导体器件和导体板的密封树脂; 以及通过它们之间的Al膜粘附到导体板的绝缘树脂片。

30. 发明申请

US20140168901A1 Power Module 有权
标题翻译：电源模块
公开(公告)号：US20140168901A1
公开(公告)日：2014-06-19
申请号：US14237975
申请日：2012-08-09
申请人： Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
发明人： Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
IPC分类号： H05K7/20
CPC分类号： H05K7/209 , B60L1/003 , B60L1/02 , B60L3/003 , B60L11/123 , B60L11/14 , B60L15/007 , B60L15/2036 , B60L2200/26 , B60L2200/42 , B60L2210/40 , B60L2220/14 , B60L2240/12 , B60L2240/24 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/525 , B60L2250/16 , B60L2250/24 , B60L2250/26 , B60L2260/28 , H01L21/565 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49575 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/06181 , H01L2224/291 , H01L2224/29139 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37157 , H01L2224/3716 , H01L2224/3718 , H01L2224/3754 , H01L2224/40137 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01047 , H01L2924/1203 , H01L2924/12042 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/203 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H05K7/20927 , Y02P90/60 , Y02T10/6217 , Y02T10/645 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/0002 , H01L2924/01033 , H01L2224/45099
摘要： A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.
摘要翻译：功率模块包括密封体，其中半导体芯片安装的导体板以暴露的导体板的散热表面的方式被树脂密封，散热构件被布置成面对散热表面以及设置在密封体和散热构件之间的绝缘层。绝缘层具有层叠体，其通过层叠浸渍树脂浸渍的陶瓷热喷涂膜和粘合树脂层而制成，其中混合具有良好导热性的填料，并且被设置成与散热构件接触以及至少全部的散热面，以及设置在散热构件和密封体之间的间隙中以覆盖层叠体的整个周向端部的应力消除树脂部。

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