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    • 22. 发明授权
    • Positive resist composition and resist pattern forming method
    • 正抗蚀剂组合物和抗蚀剂图案形成方法
    • US08206887B2
    • 2012-06-26
    • US11914451
    • 2006-04-26
    • Takako HirosakiDaiju ShionoTaku Hirayama
    • Takako HirosakiDaiju ShionoTaku Hirayama
    • G03C1/00G03F7/00
    • G03F7/0392G03F7/0045G03F7/0397
    • A positive resist composition includes a base material component (A) which exhibits increased alkali solubility under an action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the base material component (A) contains a compound (A1) in which phenolic hydroxyl groups in a polyhydric phenol compound (a) containing two or more phenolic hydroxyl groups and having a molecular weight of 300 to 2,500 are protected with acid dissociable, dissolution inhibiting groups, and the compound (A1) exhibits a standard deviation (sn) of the number of protective groups per molecule of less than 1, or exhibits a standard deviation (sp) of a protection ratio (mol %) per molecule of less than 16.7.
    • 正型抗蚀剂组合物包括在酸作用下表现出增加的碱溶解性的基材组分(A)和暴露时产生酸的酸产生剂组分(B),其中所述基材组分(A)含有化合物 (A1),其中含有两个或多个酚羟基并且分子量为300〜2500的多元酚化合物(a)中的酚羟基被酸解离的溶解抑制基团保护,化合物(A1)表现出 每分子保护基团数目的标准偏差(sn)小于1,或每分子保护率(mol%)的标准偏差(sp)小于16.7。
    • 24. 发明授权
    • Base material for pattern-forming material, positive resist composition and method of resist pattern formation
    • 用于图案形成材料的基材,正型抗蚀剂组合物和抗蚀图案形成方法
    • US07923192B2
    • 2011-04-12
    • US10590046
    • 2005-02-08
    • Taku HirayamaDaiju ShionoTasuku MatsumiyaYohei Kinoshita
    • Taku HirayamaDaiju ShionoTasuku MatsumiyaYohei Kinoshita
    • G03C1/00G03F7/00G03F1/00
    • G03F7/0045G03F7/0392
    • A base material for a pattern-forming material, a positive resist composition, and a method of resist pattern formation that are capable of forming a high resolution pattern with reduced levels of LER. The base material includes a low molecular weight compound (X1), which is formed from a polyhydric phenol compound (x) that contains two or more phenolic hydroxyl groups and satisfies the conditions (1), (2), and (3) described below, wherein either a portion of, or all of, the phenolic hydroxyl groups are protected with acid dissociable, dissolution inhibiting groups: (1) a molecular weight within a range from 300 to 2,500, (2) a molecular weight dispersity of no more than 1.5, and (3) an ability to form an amorphous film using a spin coating method. Alternatively, the base material includes a protected material (Y1), which is formed from a polyhydric phenol compound (y) that contains two or more phenolic hydroxyl groups and has a molecular weight within a range from 300 to 2,500, in which a predetermined proportion of the phenolic hydroxyl groups are protected with acid dissociable, dissolution inhibiting groups.
    • 用于图案形成材料的基材,正型抗蚀剂组合物和抗蚀剂图案形成方法,其能够形成具有降低的LER水平的高分辨率图案。 基材包含由含有两个以上酚羟基的多元酚化合物(x)形成并满足下述条件(1),(2)和(3)的低分子量化合物(X1) 其中酚羟基的一部分或全部被酸解离,溶解抑制基团保护:(1)分子量在300-2,500范围内,(2)分子量分散度不大于 1.5,和(3)使用旋涂法形成非晶膜的能力。 或者,基材包含由多元酚化合物(y)形成的保护材料(Y1),所述多元酚化合物(y)含有两个或更多个酚羟基并且具有300-2,500的分子量,其中预定比例 的酚羟基被酸解离,溶解抑制基团保护。
    • 27. 发明授权
    • Positive resist composition, method for resist pattern formation and compound
    • 抗蚀剂组合物,抗蚀剂图案形成方法和化合物
    • US07504196B2
    • 2009-03-17
    • US11884748
    • 2006-02-09
    • Daju ShionoTaku HirayamaHideo Hada
    • Daju ShionoTaku HirayamaHideo Hada
    • G03F7/004G03F7/30
    • G03F7/0045Y10S430/106
    • A positive resist composition that includes a base material component (A) that contains an acid-dissociable, dissolution-inhibiting group and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the base material component (A) contains a compound (A1), in which either a portion of, or all of, hydrogen atoms of phenolic hydroxyl groups within a polyhydric phenol compound, which has two or more phenolic hydroxyl groups, a molecular weight of 300 to 2,500, and is represented by a general formula (I) shown below, have been substituted with an acid-dissociable, dissolution-inhibiting group (II) represented by a general formula (II) shown below.
    • 一种正性抗蚀剂组合物,其包含含有酸解离的溶解抑制基团并且在酸的作用下表现出增加的碱溶解性的基材成分(A)和暴露时产生酸的酸产生剂成分(B),其中 基材成分(A)含有具有两个以上酚羟基的多元酚化合物中的酚羟基的一部分或全部氢原子的一部分或全部的化合物(A1),其分子量为 300〜2500,由下述通式(I)表示,用下述通式(II)表示的酸解离性溶解抑制基团(II)代替。