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21. 发明授权

US08037996B2 Transfer apparatus for handling electronic components 有权
标题翻译：用于处理电子部件的传送装置
公开(公告)号：US08037996B2
公开(公告)日：2011-10-18
申请号：US12348508
申请日：2009-01-05
申请人： Chi Wah Cheng , Wang Lung Tse , Chi Hang Leung
发明人： Chi Wah Cheng , Wang Lung Tse , Chi Hang Leung
IPC分类号： B65G25/00
CPC分类号： B65G47/918 , B65G47/91 , H01L21/67271
摘要： An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.
摘要翻译：用于传送多个电子部件的装置包括一排拾取头，其操作以从第一位置同时拾取电子部件并将其放置在第二位置。此外，存在一种驱动机构，其可操作地驱动拾取头相对于彼此在与行列拾取头的长度平行的方向上相对移动，从而调节拾取头的间距宽度。

22. 发明授权

US07495759B1 Damage and wear detection for rotary cutting blades 有权
标题翻译：旋转切割刀片的损伤和磨损检测
公开(公告)号：US07495759B1
公开(公告)日：2009-02-24
申请号：US11877099
申请日：2007-10-23
申请人： Chi Wah Cheng , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Lap Kei Eric Chow
IPC分类号： G01N21/00 , B24B49/00
CPC分类号： B23D59/001 , B24B27/06 , B24B49/12 , G01N2021/151
摘要： A method of detecting wear and damage to a rotary cutting blade for singulating a substrate is provided comprising the steps of providing a sensor to locate a first detecting position at an edge of the blade and performing dicing with the blade while the sensor is maintained substantially at the first detecting position for detecting damage to the blade. Subsequently, an extent of wear of the blade is determined by driving the sensor in the direction of the blade to locate a second detecting position at the edge of the blade as a diameter of the blade is reduced due to dicing. Thereafter, while dicing is performed with the blade, the sensor is maintained substantially at the second detecting position for detecting damage to the blade.
摘要翻译：提供一种检测用于单个基板的旋转切割刀片的磨损和损坏的方法，包括以下步骤：提供传感器以在刀片的边缘定位第一检测位置，并且在传感器基本保持在基座上时与刀片进行切割用于检测对刀片的损坏的第一检测位置。随后，通过沿着刀片的方向驱动传感器来确定刀片的磨损程度，以便由于切割而使刀片的直径减小，从而将刀片的边缘处的第二检测位置定位。此后，当用刀片进行切割时，传感器基本上保持在第二检测位置，用于检测刀片的损坏。

23. 发明申请

US20080101894A1 SINGULATION HANDLER SYSTEM FOR ELECTRONIC PACKAGES 有权
标题翻译：电子包装的单机处理系统
公开(公告)号：US20080101894A1
公开(公告)日：2008-05-01
申请号：US11925091
申请日：2007-10-26
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
IPC分类号： B65H3/00
CPC分类号： H01L21/67092
摘要： A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.
摘要翻译：提供了一种用于电子包装条的分切处理系统，其包括位于加载位置附近的加载器，用于提供用于分割的未卷曲包装条带和用于安装未卷曲包装条的切割夹具。切割夹具可以在加载位置和切片位置之间移动，在该切割位置，条带由分割引擎分割。该系统还包括用于保持已经从切割夹具移除并且以固定的相对定向输送单个包装的单个包装的缓冲舟。组合拾取头可操作以将多个单独包装从缓冲舟同时转移到旋转转塔装置，并且提供卸载器用于将分离的包装从旋转转塔装置传送到其中可分离包装的容器。

24. 发明授权

US06109501A Radial wire bonder and selectable side view inspection system 有权
标题翻译：径向焊线机和可选侧视检测系统
公开(公告)号：US06109501A
公开(公告)日：2000-08-29
申请号：US233732
申请日：1999-01-11
申请人： Chi Wah Cheng , Ka On Yue , Chiu Fai Wong
发明人： Chi Wah Cheng , Ka On Yue , Chiu Fai Wong
IPC分类号： H01L21/00 , H01L21/607 , H01L21/66 , B23K20/10
CPC分类号： H01L24/85 , H01L24/78 , H01L22/12 , H01L2224/05554 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/49171 , H01L2224/78301 , H01L2224/78901 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L24/45 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181
摘要： A wire bonding machine having a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.
摘要翻译：一种具有提供五个运动方向或自由度的引线接合头的引线接合机。径向移动方向支持引线接合工艺，并且在引线接合的产生期间减少引线接合器的移动质量。引线接合机还包括可选侧视检查系统。通过一组光学部件，可以从侧视图或俯视图选择性地观看组装过程。组装过程的侧视图提供了可以通过照相机监视的线接合质量的改进分析。

25. 发明授权

US09618573B2 Test handler that picks up electronic devices for testing and an orientation-changing apparatus for use in a test handler 有权
公开(公告)号：US09618573B2
公开(公告)日：2017-04-11
申请号：US14603251
申请日：2015-01-22
申请人： Shing Kai Yip , Chi Wah Cheng
发明人： Shing Kai Yip , Chi Wah Cheng
IPC分类号： G01R31/01 , G01R31/28 , G01R1/067 , G01R31/26 , G01R1/00 , G01N1/00
CPC分类号： G01R31/2891 , G01N1/00 , G01N2201/00 , G01R1/00 , G01R1/06705 , G01R31/26 , G01R31/2893
摘要： A test handler comprises an orientation changing device having a device holder for holding electronic devices, the device holder having a vertical rotary axis. A conveying device is operative to convey electronic devices to the device holder, and a rotary motor connected to the device holder is operative to rotate the device holder about the vertical rotary axis to change an orientation of the electronic device held on it. A rotary turret of the test handler has a plurality of pick heads arranged on the rotary turret, and each pick head is configured to pick up electronic devices from the device holder.

26. 发明授权

US09508570B2 Singulation apparatus and method 有权
标题翻译：分割装置和方法
公开(公告)号：US09508570B2
公开(公告)日：2016-11-29
申请号：US14058396
申请日：2013-10-21
申请人： Chi Wah Cheng , Eric Lap Kei Chow , Joseph Hoi Shuen Tang , Chun Kit Liu
发明人： Chi Wah Cheng , Eric Lap Kei Chow , Joseph Hoi Shuen Tang , Chun Kit Liu
IPC分类号： H01L21/67 , B28D5/02 , H01L21/687
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , H01L21/68764
摘要： A singulation apparatus and method including: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device with members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device with members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being configured and arranged for cutting the workpiece.
摘要翻译：一种切割装置和方法，包括：至少一个卡盘站，工件可固定到该夹持站上，所述至少一个卡盘站构造成沿着进给方向移动; 在所述至少一个卡盘站上方延伸的桥，所述桥具有与所述第一侧相对的第一侧和第二侧; 第一切割装置，其具有安装到桥上并且可沿着第一侧横向于进给方向独立地移动的构件; 以及第二切割装置，其具有安装到所述桥接件并且可沿着所述第二侧面横向于所述进给方向独立地移动，所述第一和第二切割装置被构造和布置成用于切割所述工件。

27. 发明授权

US08709916B2 Laser processing method and apparatus 有权
标题翻译：激光加工方法及装置
公开(公告)号：US08709916B2
公开(公告)日：2014-04-29
申请号：US13541865
申请日：2012-07-05
申请人： Chi Hang Kwok , Chi Wah Cheng , Lap Kei Chow
发明人： Chi Hang Kwok , Chi Wah Cheng , Lap Kei Chow
IPC分类号： H01L21/304 , H01L21/268
CPC分类号： B23K26/0853 , B23K26/40 , B23K26/53 , B23K2103/50
摘要： A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.
摘要翻译：公开了一种激光加工方法，包括以下步骤：将激光束导向工件; 并且实现激光束和工件之间的相对运动。特别地，将激光束引导到工件的步骤包括将激光束聚焦在工件内直到在工件内形成内部损伤，并且裂纹从内部损伤传播到工件的至少一个表面以形成表面裂纹在工件上。此外，实现激光束和工件之间的相对运动的步骤使得工件上的表面裂纹沿着工件上的分离线传播。还公开了一种激光加工装置。

28. 发明授权

US08011058B2 Singulation handler system for electronic packages 有权
标题翻译：电子封装的分割处理系统
公开(公告)号：US08011058B2
公开(公告)日：2011-09-06
申请号：US11925091
申请日：2007-10-26
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Ming Cheong Kary Tse
IPC分类号： A47L5/38
CPC分类号： H01L21/67092
摘要： A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.
摘要翻译：提供了一种用于电子包装条的分切处理系统，其包括位于加载位置附近的加载器，用于提供用于分割的未卷曲包装条带和用于安装未卷曲包装条的切割夹具。切割夹具可以在加载位置和切片位置之间移动，在该切割位置，条带由分割引擎分割。该系统还包括用于保持已经从切割夹具移除并且以固定的相对定向输送单个包装的单个包装的缓冲舟。组合拾取头可操作以将多个单独包装从缓冲舟同时转移到旋转转塔装置，并且提供卸载器用于将分离的包装从旋转转塔装置传送到其中可分离包装的容器。

29. 发明授权

US07726540B2 Apparatus and method for arranging devices for processing 有权
标题翻译：用于处理装置的装置和方法
公开(公告)号：US07726540B2
公开(公告)日：2010-06-01
申请号：US11301064
申请日：2005-12-12
申请人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , See Lok Chan
发明人： Chi Wah Cheng , Hoi Shuen Joseph Tang , Tim Wai Tony Mak , See Lok Chan
IPC分类号： B23K1/14 , B23K5/22 , H01R43/00
CPC分类号： B23K3/087 , B23K2101/42 , G01R31/2893 , Y10T29/53261
摘要： An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
摘要翻译：提供了一种用于布置用于处理其表面上具有表面成分的半导体器件的装置。包括用于接触半导体器件的表面的一组突起的器件支撑件在平面上支撑半导体器件。突起被布置和定位成使得它们避免与表面上的表面部件接触。为了夹持支撑在平面上的半导体器件，具有第一组夹具的夹持装置被配置为沿着第一轴夹持半导体器件，并且第二组夹具被配置为沿着垂直于第二轴的夹持半导体器件到第一轴。

30. 发明授权

US07190446B2 System for processing electronic devices 有权
标题翻译：电子设备处理系统
公开(公告)号：US07190446B2
公开(公告)日：2007-03-13
申请号：US10741862
申请日：2003-12-19
申请人： Chi Wah Cheng , Hoi Fung Tsang , Chi Yat Yeung , Wang Lung Alan Tse
发明人： Chi Wah Cheng , Hoi Fung Tsang , Chi Yat Yeung , Wang Lung Alan Tse
IPC分类号： G01N21/00
CPC分类号： G01R31/2893 , G01N21/956
摘要： A system is provided for processing electronic devices, and in particular for handling, inspecting, sorting and offloading the same. An apparatus for inspecting an electronic device comprises a holder for supporting the electronic device and a driving mechanism for moving the electronic device between an onloading position where the electronic device is placed onto the holder and an offloading position where the electronic device is removed from the holder. A first optical system between the onloading and offloading positions is configured to inspect a first surface of the electronic device while it is supported by the holder, Concurrently or subsequently, a second optical system between the onloading and offloading positions is configured to inspect a second surface of the electronic device that is opposite to the first surface while it is supported by the holder.
摘要翻译：提供一种用于处理电子设备的系统，特别是用于处理，检查，分类和卸载它们的系统。一种用于检查电子装置的装置包括一个用于支撑该电子装置的支架和一个驱动机构，用于使电子装置在电子装置放置在保持架上的装载位置和电子装置从支架上移出的卸载位置之间移动。负载和卸载位置之间的第一光学系统被配置为在由所述保持器支撑的同时检查所述电子设备的第一表面，并且所述第二光学系统在所述上载位置和卸载位置之间并行地或后续地被配置为检查所述第二表面与第一表面相对的电子设备。

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