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    • 22. 发明授权
    • Semiconductor devices including gate structures and leakage barrier oxides
    • 包括栅极结构和漏电阻氧化物的半导体器件
    • US07772637B2
    • 2010-08-10
    • US12401087
    • 2009-03-10
    • Woong-Hee SohnChang-Won LeeSun-Pil YounGil-Heyun ChoiByung-Hak LeeJong-Ryeol YooHee-Sook Park
    • Woong-Hee SohnChang-Won LeeSun-Pil YounGil-Heyun ChoiByung-Hak LeeJong-Ryeol YooHee-Sook Park
    • H01L21/00
    • H01L21/28273H01L29/42324
    • Methods of forming a semiconductor device may include forming a tunnel oxide layer on a semiconductor substrate, forming a gate structure on the tunnel oxide layer, forming a leakage barrier oxide, and forming an insulating spacer. More particularly, the tunnel oxide layer may be between the gate structure and the substrate, and the gate structure may include a first gate electrode on the tunnel oxide layer, an inter-gate dielectric on the first gate electrode, and a second gate electrode on the inter-gate dielectric with the inter-gate dielectric between the first and second gate electrodes. The leakage barrier oxide may be formed on sidewalls of the second gate electrode. The insulating spacer may be formed on the leakage barrier oxide with the leakage barrier oxide between the insulating spacer and the sidewalls of the second gate electrode. In addition, the insulating spacer and the leakage barrier oxide may include different materials. Related structures are also discussed.
    • 形成半导体器件的方法可以包括在半导体衬底上形成隧道氧化物层,在隧道氧化物层上形成栅极结构,形成漏电阻氧化物,并形成绝缘衬垫。 更具体地,隧道氧化物层可以在栅极结构和衬底之间,并且栅极结构可以包括隧道氧化物层上的第一栅极电极,第一栅电极上的栅极间电介质和第二栅电极 所述栅极间电介质与所述第一和第二栅电极之间的栅极间电介质。 漏电阻氧化物可以形成在第二栅电极的侧壁上。 绝缘间隔物可以在绝缘隔离物和第二栅电极的侧壁之间的泄漏阻挡氧化物形成在漏电阻氧化物上。 此外,绝缘间隔物和漏电阻氧化物可以包括不同的材料。 还讨论了相关结构。
    • 23. 发明申请
    • Semiconductor Devices Including Gate Structures and Leakage Barrier Oxides
    • 包括栅极结构和漏极氧化物的半导体器件
    • US20090173986A1
    • 2009-07-09
    • US12401087
    • 2009-03-10
    • Woong-Hee SohnChang-Won LeeSun-Pil YounGil-Heyun ChoiByung-Hak LeeJong-Ryeol YooHee-Sook Park
    • Woong-Hee SohnChang-Won LeeSun-Pil YounGil-Heyun ChoiByung-Hak LeeJong-Ryeol YooHee-Sook Park
    • H01L29/788
    • H01L21/28273H01L29/42324
    • Methods of forming a semiconductor device may include forming a tunnel oxide layer on a semiconductor substrate, forming a gate structure on the tunnel oxide layer, forming a leakage barrier oxide, and forming an insulating spacer. More particularly, the tunnel oxide layer may be between the gate structure and the substrate, and the gate structure may include a first gate electrode on the tunnel oxide layer, an inter-gate dielectric on the first gate electrode, and a second gate electrode on the inter-gate dielectric with the inter-gate dielectric between the first and second gate electrodes. The leakage barrier oxide may be formed on sidewalls of the second gate electrode. The insulating spacer may be formed on the leakage barrier oxide with the leakage barrier oxide between the insulating spacer and the sidewalls of the second gate electrode. In addition, the insulating spacer and the leakage barrier oxide may include different materials. Related structures are also discussed.
    • 形成半导体器件的方法可以包括在半导体衬底上形成隧道氧化物层,在隧道氧化物层上形成栅极结构,形成漏电阻氧化物,并形成绝缘衬垫。 更具体地,隧道氧化物层可以在栅极结构和衬底之间,并且栅极结构可以包括隧道氧化物层上的第一栅极电极,第一栅电极上的栅极间电介质和第二栅电极 所述栅极间电介质与所述第一和第二栅电极之间的栅极间电介质。 漏电阻氧化物可以形成在第二栅电极的侧壁上。 绝缘间隔物可以在绝缘隔离物和第二栅电极的侧壁之间的泄漏阻挡氧化物形成在漏电阻氧化物上。 此外,绝缘间隔物和漏电阻氧化物可以包括不同的材料。 还讨论了相关结构。
    • 26. 发明申请
    • Methods of forming gate structures for semiconductor devices and related structures
    • 形成半导体器件和相关结构的栅极结构的方法
    • US20060081916A1
    • 2006-04-20
    • US11221062
    • 2005-09-07
    • Woong-Hee SohnChang-Won LeeSun-Pil YounGil-Heyun ChoiByung-Hak LeeJong-Ryeol YooHee-Sook Park
    • Woong-Hee SohnChang-Won LeeSun-Pil YounGil-Heyun ChoiByung-Hak LeeJong-Ryeol YooHee-Sook Park
    • H01L29/788
    • H01L21/28273H01L29/42324
    • Methods of forming a semiconductor device may include forming a tunnel oxide layer on a semiconductor substrate, forming a gate structure on the tunnel oxide layer, forming a leakage barrier oxide, and forming an insulating spacer. More particularly, the tunnel oxide layer may be between the gate structure and the substrate, and the gate structure may include a first gate electrode on the tunnel oxide layer, an inter-gate dielectric on the first gate electrode, and a second gate electrode on the inter-gate dielectric with the inter-gate dielectric between the first and second gate electrodes. The leakage barrier oxide may be formed on sidewalls of the second gate electrode. The insulating spacer may be formed on the leakage barrier oxide with the leakage barrier oxide between the insulating spacer and the sidewalls of the second gate electrode. In addition, the insulating spacer and the leakage barrier oxide may include different materials. Related structures are also discussed.
    • 形成半导体器件的方法可以包括在半导体衬底上形成隧道氧化物层,在隧道氧化物层上形成栅极结构,形成漏电阻氧化物,并形成绝缘衬垫。 更具体地,隧道氧化物层可以在栅极结构和衬底之间,并且栅极结构可以包括隧道氧化物层上的第一栅极电极,第一栅电极上的栅极间电介质和第二栅电极 所述栅极间电介质与所述第一和第二栅电极之间的栅极间电介质。 漏电阻氧化物可以形成在第二栅电极的侧壁上。 绝缘间隔物可以在绝缘隔离物和第二栅电极的侧壁之间的泄漏阻挡氧化物形成在漏电阻氧化物上。 此外,绝缘间隔物和漏电阻氧化物可以包括不同的材料。 还讨论了相关结构。
    • 27. 发明授权
    • Methods of forming field effect transistors having metal silicide gate electrodes
    • 形成具有金属硅化物栅电极的场效应晶体管的方法
    • US07416968B2
    • 2008-08-26
    • US11230586
    • 2005-09-20
    • Hyun-Su KimJong-Ho YunByung-Hak LeeEun-Ji JungGil-Heyun Choi
    • Hyun-Su KimJong-Ho YunByung-Hak LeeEun-Ji JungGil-Heyun Choi
    • H01L21/336H01L21/3205
    • H01L21/28097H01L21/823835H01L29/4975H01L29/665H01L29/66545
    • Methods of forming field effect transistors according to embodiments of the invention include forming a conductive gate electrode (e.g., polysilicon gate electrode) on a semiconductor substrate and forming a first metal layer on the conductive gate electrode. This first metal layer may include a material selected from a group consisting of nickel, cobalt, titanium, tantalum and tungsten. The first metal layer and the conductive gate electrode are thermally treated for a sufficient duration to convert a first portion of the conductive gate electrode into a first metal silicide region. The first metal layer and the first metal silicide region are then removed to expose a second portion of the conductive gate electrode. A second metal layer is then formed on the second portion of the conductive gate electrode. This second metal layer may include a material selected from a group consisting of nickel, cobalt, titanium, tantalum and tungsten. The second metal layer and the second portion of the conductive gate electrode are thermally treated for a sufficient duration to thereby convert the second portion of the conductive gate electrode into a second metal silicide region.
    • 根据本发明的实施例的形成场效应晶体管的方法包括在半导体衬底上形成导电栅电极(例如,多晶硅栅电极),并在导电栅电极上形成第一金属层。 该第一金属层可以包括选自镍,钴,钛,钽和钨的材料。 对第一金属层和导电栅电极进行热处理足够的时间以将导电栅电极的第一部分转换成第一金属硅化物区域。 然后去除第一金属层和第一金属硅化物区域以暴露导电栅电极的第二部分。 然后在导电栅电极的第二部分上形成第二金属层。 该第二金属层可以包括选自镍,钴,钛,钽和钨的材料。 第二金属层和导电栅电极的第二部分被热处理足够的持续时间,从而将导电栅电极的第二部分转换成第二金属硅化物区域。
    • 28. 发明申请
    • Methods of forming field effect transistors having metal silicide gate electrodes
    • 形成具有金属硅化物栅电极的场效应晶体管的方法
    • US20060091436A1
    • 2006-05-04
    • US11230586
    • 2005-09-20
    • Hyun-Su KimJong-Ho YunByung-Hak LeeEun-Ji JungGil-Heyun Choi
    • Hyun-Su KimJong-Ho YunByung-Hak LeeEun-Ji JungGil-Heyun Choi
    • H01L29/94
    • H01L21/28097H01L21/823835H01L29/4975H01L29/665H01L29/66545
    • Methods of forming field effect transistors according to embodiments of the invention include forming a conductive gate electrode (e.g., polysilicon gate electrode) on a semiconductor substrate and forming a first metal layer on the conductive gate electrode. This first metal layer may include a material selected from a group consisting of nickel, cobalt, titanium, tantalum and tungsten. The first metal layer and the conductive gate electrode are thermally treated for a sufficient duration to convert a first portion of the conductive gate electrode into a first metal silicide region. The first metal layer and the first metal silicide region are then removed to expose a second portion of the conductive gate electrode. A second metal layer is then formed on the second portion of the conductive gate electrode. This second metal layer may include a material selected from a group consisting of nickel, cobalt, titanium, tantalum and tungsten. The second metal layer and the second portion of the conductive gate electrode are thermally treated for a sufficient duration to thereby convert the second portion of the conductive gate electrode into a second metal silicide region.
    • 根据本发明的实施例的形成场效应晶体管的方法包括在半导体衬底上形成导电栅电极(例如,多晶硅栅电极),并在导电栅电极上形成第一金属层。 该第一金属层可以包括选自镍,钴,钛,钽和钨的材料。 对第一金属层和导电栅电极进行热处理足够的时间以将导电栅电极的第一部分转换成第一金属硅化物区域。 然后去除第一金属层和第一金属硅化物区域以暴露导电栅电极的第二部分。 然后在导电栅电极的第二部分上形成第二金属层。 该第二金属层可以包括选自镍,钴,钛,钽和钨的材料。 第二金属层和导电栅电极的第二部分被热处理足够的持续时间,从而将导电栅电极的第二部分转换成第二金属硅化物区域。