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21. 发明授权

US08146902B2 Hybrid composite wafer carrier for wet clean equipment 失效
标题翻译：用于湿式清洁设备的混合复合晶片载体
公开(公告)号：US08146902B2
公开(公告)日：2012-04-03
申请号：US11743516
申请日：2007-05-02
申请人： Wing Lau Cheng , Helen Cheng, legal representative , Arnold Kholodenko
发明人： Wing Lau Cheng , Arnold Kholodenko
IPC分类号： B23Q3/00
CPC分类号： B32B5/26 , B32B5/28 , B32B27/04 , H01L21/67051 , H01L21/67346 , H01L21/67748 , H01L21/68764 , Y10S269/90 , Y10S269/901 , Y10T428/237 , Y10T428/24995 , Y10T428/31515
摘要： A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.
摘要翻译：描述了当通过使载体通过由上下接近头形成的弯月面而被处理时用于支撑基板的载体结构。载体包括具有开口尺寸的接收基板的框架和用于在开口内支撑基板的多个支撑销，该开口略大于基板，使得基板和开口之间存在间隙。框架包括复合芯，顶片，底片，顶片和芯之间的芳族聚酰胺织物层，以及在底片和芯之间的第二层芳族聚酰胺织物。顶片和底片由聚合物材料形成。还描述了一种制造方法。

22. 发明授权

US06795292B2 Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber 失效
标题翻译：用于调节半导体晶片处理室中的处理套件的温度的装置
公开(公告)号：US06795292B2
公开(公告)日：2004-09-21
申请号：US09861984
申请日：2001-05-15
申请人： Dennis Grimard , Arnold Kholodenko , Alex Veytser , Senh Thach , Wing Cheng
发明人： Dennis Grimard , Arnold Kholodenko , Alex Veytser , Senh Thach , Wing Cheng
IPC分类号： H01G2300
CPC分类号： H01L21/67109 , H01L21/67103
摘要： An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein. The waste ring is disposed over the peripheral flange defining a gap therebetween, and circumscribes the chuck. The collar is chucked to the waste ring, and the waste ring is chucked to a pedestal support. Moreover, the waste ring and pedestal each have a gas delivery system therein for regulating the temperature of the collar.
摘要翻译：一种用于减少半导体晶片处理室中副产物形成的装置。在第一实施例中，该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘。套环设置在周边凸缘之上，限定了它们之间的第一间隙，并限制卡盘。加热器元件嵌入在轴环内并且适于连接到电源。在第二实施例中，该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘以及嵌入其中的加热器元件的套环。套环设置在周边凸缘上方以在其间形成间隙并限制卡盘。此外，其中具有气体输送系统的基座设置在卡盘和轴环的下方。在第三实施例中，该装置包括具有夹紧电极和径向延伸的周边凸缘，套环和具有嵌入其中的加热器元件的废料环的卡盘。废环设置在周边凸缘之上，限定了它们之间的间隙，并且围绕卡盘。将衣领卡在废物环上，将废物环卡在基座支架上。此外，废环和底座各自具有用于调节套环温度的气体输送系统。

23. 发明授权

US06572814B2 Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas 失效
标题翻译：制造具有用于分配传热气体的小直径气体分配端口的半导体晶片支撑卡盘装置的方法
公开(公告)号：US06572814B2
公开(公告)日：2003-06-03
申请号：US09866353
申请日：2001-05-24
申请人： Shamouil Shamoulian , Arnold Kholodenko , Senh Thach , Wing Cheng
发明人： Shamouil Shamoulian , Arnold Kholodenko , Senh Thach , Wing Cheng
IPC分类号： B22F704
CPC分类号： H02N13/00 , Y10T29/49149
摘要： A method of fabricating a semiconductor wafer support chuck apparatus having a first sintered layer and a second sintered layer. The method comprising the steps of providing the first sintered layer having a plurality of gas distribution ports and providing the second sintered layer having a plurality of grooves. The first sintered layer is stacked on top of the second sintered layer, where a diffusion bonding layer is disposed between the first sintered layer and the second sintered layer. Thereafter, the stacked first and second sintered layers are resintered such that the diffusion bonding layer joins the first and second sintered layers together to form a semiconductor wafer support apparatus.
摘要翻译：一种制造具有第一烧结层和第二烧结层的半导体晶片支撑卡盘装置的方法。该方法包括以下步骤：提供具有多个气体分配端口的第一烧结层，并提供具有多个凹槽的第二烧结层。第一烧结层堆叠在第二烧结层的顶部，在第一烧结层和第二烧结层之间设置扩散接合层。然后，堆叠的第一和第二烧结层重新烧结，使得扩散接合层将第一和第二烧结层与第二烧结层结合在一起形成半导体晶片支撑装置。

24. 发明授权

US06538872B1 Electrostatic chuck having heater and method 失效
标题翻译：具有加热器和方法的静电吸盘
公开(公告)号：US06538872B1
公开(公告)日：2003-03-25
申请号：US09307214
申请日：2001-11-05
申请人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
发明人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
IPC分类号： H01G2300
CPC分类号： H01L21/6833 , H01L21/67103
摘要： An electrostatic chuck 55 for holding a substrate 30 comprises an electrostatic member 100 made from a dielectric 115 covering an electrode 105 that is chargeable to electrostatically hold the substrate 30. A base 175 that includes a heater 235 is joined to the electrostatic member 100. The base may be made from a composite material, such as a porous ceramic infiltrated with the metal, and may be joined to the electrostatic member by a bond layer.
摘要翻译：用于保持基板30的静电卡盘55包括由覆盖电极105的电介质115制成的静电构件100，电极105可充电以静电保持基板30.包括加热器235的基座175与静电构件100接合。基底可以由复合材料制成，例如渗透有金属的多孔陶瓷，并且可以通过接合层与静电部件接合。

25. 发明授权

US06464795B1 Substrate support member for a processing chamber 失效
标题翻译：用于处理室的基板支撑构件
公开(公告)号：US06464795B1
公开(公告)日：2002-10-15
申请号：US09563573
申请日：2000-05-03
申请人： Semyon Sherstinsky , Calvin Augason , Leonel A. Zuniga , Jun Zhao , Talex Sajoto , Leonid Selyutin , Joseph Yudovsky , Maitreyee Mahajani , Steve G. Ghanayem , Tai T. Ngo , Arnold Kholodenko
发明人： Semyon Sherstinsky , Calvin Augason , Leonel A. Zuniga , Jun Zhao , Talex Sajoto , Leonid Selyutin , Joseph Yudovsky , Maitreyee Mahajani , Steve G. Ghanayem , Tai T. Ngo , Arnold Kholodenko
IPC分类号： G23C1600
CPC分类号： C23C16/45521 , C23C16/4586 , H01L21/67109 , H01L21/6838 , H01L21/68785
摘要： A support member for supporting a substrate in a process chamber, the support member having a substrate support surface with one or more isolated recessed areas. A vacuum channel and a gas channel are formed in the support member along a common plane and are coupled to a vacuum source and gas source respectively. The gas channel comprises two or more concentrically disposed annular gas channels encompassing the vacuum channel. The vacuum channel is coupled to the support surface, and in particular to the one or more recessed areas, by a plurality of conduits. A portion of the conduits is disposed diametrically exterior to at least one of the annular gas channels and communicates with the vacuum channel via bypass channels.
摘要翻译：一种用于在处理室中支撑衬底的支撑构件，所述支撑构件具有具有一个或多个隔离的凹陷区域的衬底支撑表面。真空通道和气体通道沿着公共平面形成在支撑构件中，并且分别耦合到真空源和气体源。气体通道包括包围真空通道的两个或更多个同心设置的环形气体通道。真空通道由多个管道联接到支撑表面，特别是连接到一个或多个凹陷区域。导管的一部分沿直径设置在至少一个环形气体通道的外部，并通过旁通通道与真空通道连通。

26. 发明授权

US06414834B1 Dielectric covered electrostatic chuck 有权
标题翻译：介质覆盖静电卡盘
公开(公告)号：US06414834B1
公开(公告)日：2002-07-02
申请号：US09596108
申请日：2000-06-16
申请人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
发明人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
IPC分类号： H02N1300
CPC分类号： H01J37/321 , C23C16/4586 , H01J2237/2001 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck 100 useful for holding a substrate 55 in a high density plasma, comprises an electrode 110 at least partially covered by a semiconducting dielectric 115, wherein the semiconducting dielectric 115 may have an electrical resistance of from about 5×109 &OHgr;cm to about 8×1010 &OHgr;cm.
摘要翻译：用于将衬底55保持在高密度等离子体中的静电卡盘100包括至少部分被半导体电介质115覆盖的电极110，其中半导体电介质115可具有约5×10 9欧姆到约8×10 10欧姆·厘米的电阻。

27. 发明授权

US6151203A Connectors for an electrostatic chuck and combination thereof 有权
标题翻译：静电吸盘连接器及其组合
公开(公告)号：US6151203A
公开(公告)日：2000-11-21
申请号：US212000
申请日：1998-12-14
申请人： Shamouil Shamouilian , Ananda Kumar , Arnold Kholodenko , Dennis S. Grimard , Liang Guo Wang , Gerhard Schneider , Michael G. Chafin , Semyon Kats , Alexander Veytser , Senh Thach
发明人： Shamouil Shamouilian , Ananda Kumar , Arnold Kholodenko , Dennis S. Grimard , Liang Guo Wang , Gerhard Schneider , Michael G. Chafin , Semyon Kats , Alexander Veytser , Senh Thach
IPC分类号： H01L21/68 , H01L21/683 , H01R13/05 , H02N13/00
CPC分类号： H01L21/6833 , H02N13/00 , H01R13/052
摘要： A semiconductor wafer chuck for retaining a semiconductor wafer during semiconductor wafer processing in a semiconductor wafer processing system including a connector connecting DC chucking voltage and RF biasing power to an electrode embedded in the body of the chuck. The connector for the chuck includes two or more members joined by resilient banana connections. The connector may be adapted for use as a high temperature connector for an electrostatic chuck operated at an elevated temperature and such connector includes a thermal impedance for reducing the heat transferred from the chuck to the bottom of the connector.
摘要翻译：一种用于在半导体晶片处理系统中保持半导体晶片的半导体晶片卡盘，该半导体晶片处理系统包括将DC夹持电压和RF偏压功率连接到嵌入在卡盘的主体中的电极的连接器。用于卡盘的连接器包括通过弹性香蕉连接件连接的两个或多个构件。连接器可以适用于用于在高温下操作的静电卡盘的高温连接器，并且这种连接器包括用于减少从卡盘传递到连接器底部的热量的热阻抗。

28. 发明授权

US6094334A Polymer chuck with heater and method of manufacture 失效
标题翻译：带加热器的聚合物卡盘和制造方法
公开(公告)号：US6094334A
公开(公告)日：2000-07-25
申请号：US261083
申请日：1999-03-02
申请人： Surinder S. Bedi , Shamouil Shamouilian , Syed H. Askari , Arnold Kholodenko , Jon T. Clinton , Alexander M. Veytser , Liang-Guo Wang , You Wang
发明人： Surinder S. Bedi , Shamouil Shamouilian , Syed H. Askari , Arnold Kholodenko , Jon T. Clinton , Alexander M. Veytser , Liang-Guo Wang , You Wang
IPC分类号： H01L21/683 , H01G23/00
CPC分类号： H01L21/6833
摘要： An electrostatic chuck 20 for holding a substrate 25 in a process chamber 30 comprises an electrostatic member 115 comprising a polymer 120 covering an electrode 125, the polymer 120 having a receiving surface 135 for receiving the substrate 25. A heater 130 abutting the polymer 120 is provided to heat the substrate 25 during processing of the substrate 25. The heater 130 has a resistance that is sufficiently low to heat the substrate 25 without causing excessive thermal degradation of the polymer 120.
摘要翻译：用于将基板25保持在处理室30中的静电卡盘20包括包括覆盖电极125的聚合物120的静电部件115，聚合物120具有用于接收基板25的接收表面135.邻接聚合物120的加热器130是提供用于在基板25的加工期间加热基板25.加热器130具有足够低的电阻以加热基板25而不引起聚合物120的过度热降解。

29. 发明授权

US5356158A Resilient rotary seal with projecting edge 失效
标题翻译：具有突出边缘的弹性旋转密封
公开(公告)号：US5356158A
公开(公告)日：1994-10-18
申请号：US985082
申请日：1992-12-02
申请人： Brian Simmons , Michael S. Rivkin , Arnold Kholodenko
发明人： Brian Simmons , Michael S. Rivkin , Arnold Kholodenko
IPC分类号： F16J15/34
CPC分类号： F16J15/3436 , F16J15/3456 , F16J15/3472 , F16J15/3496 , Y10S277/938
摘要： A seal for preventing leakage around a rotary shaft extending through a structural casing comprising an annular stationary rigid seal secured to the structural casing for surrounding the rotary shaft. The stationary rigid seal has a smooth sealing surface for establishing a seal, and a resilient rotary seal adapted to be secured to the rotary shaft and having an annular projecting edge for contacting the smooth sealing surface under a biased pressure to form a seal in conjunction therewith. The projecting edge is formed by the convergence of inner and outer forward surfaces. A radial surface extends to the inner concentric forward surface from a torque point at its forward cylindrical base. An outer rearward surface extends to the outer concentric forward surface from a pivot point at its rearward cylindrical base. The outer forward surface forms an angle with the central axis of the seal in a plane through the central axis of the seal of from 40.degree. to 60.degree.. The inner concentric forward surface and the outer rearward surface forms angles with the central axis of the seal in a plane through the central axis of the seal which are individually within the range of from 45.degree. to 60.degree.. A line extending in a plane through the central axis of the seal from the pivot point to the projecting edge is within the range of from 16.degree. to 21.degree..
摘要翻译：一种用于防止在延伸穿过结构外壳的旋转轴周围泄漏的密封件，该密封件包括固定到结构外壳上用于包围旋转轴的环形静止刚性密封件。固定的刚性密封件具有用于建立密封件的光滑的密封表面，以及适于固定到旋转轴上且具有环形突出边缘的弹性旋转密封件，用于在偏压下与平滑的密封表面接触以形成与其结合的密封件。突出的边缘由内外前方的会聚形成。径向表面从其前圆柱形基座处的扭矩点延伸到内同心向前表面。外后表面从其后圆柱形基座处的枢转点延伸到外同心向前表面。外部前表面在密封件的中心轴线在40°至60°的平面内与密封件的中心轴线形成一个角度。内同心向前表面和外后表面在密封件的中心轴线的平面内与密封件的中心轴线形成角度，该中心轴线分别在45°至60°的范围内。从平面穿过密封件的中心轴线从枢轴点延伸到突出边缘的线在16°至21°的范围内。

30. 发明申请

US20100230243A1 Wafer Carrier Drive Apparatus and Method for Operating the Same 有权
标题翻译：晶圆载体驱动装置及其操作方法
公开(公告)号：US20100230243A1
公开(公告)日：2010-09-16
申请号：US12786868
申请日：2010-05-25
申请人： Arnold Kholodenko , Anwar Husain , George Khait
发明人： Arnold Kholodenko , Anwar Husain , George Khait
IPC分类号： H01L21/677 , B65G35/00 , B65G47/00
CPC分类号： H01L21/67748 , H01L21/67706 , H01L21/67709
摘要： A drive rail includes a sealed interior cavity and an exterior drive surface that extends along a length of the drive rail. A first magnetic member is disposed within the interior cavity and adjacent to a surface of the interior cavity that is immediately opposite the exterior drive surface. A drive mechanism is disposed within the interior cavity and in connection with the first magnetic member, and is configured to move the first magnetic member within the interior cavity along the length of the drive rail, such that the first magnetic member remains immediately opposite the exterior drive surface. The first magnetic member is configured to magnetically couple through the exterior drive surface to a wafer carrier disposed adjacent to the exterior drive surface. Movement of the first magnetic member within the interior cavity along the drive rail causes corresponding movement of the wafer carrier along the exterior drive surface.
摘要翻译：驱动轨道包括密封的内部空腔和沿驱动轨道的长度延伸的外部驱动表面。第一磁性构件设置在内部空腔内并且邻近内部空腔的与外部驱动表面相对的表面。驱动机构设置在内部空腔内并与第一磁性构件连接，并且构造成沿着驱动轨道的长度移动内部空腔内的第一磁性构件，使得第一磁性构件保持与外部的立即相对驱动面。第一磁性构件被配置为通过外部驱动表面磁耦合到邻近外部驱动表面设置的晶片载体。第一磁性构件沿着驱动轨道在内腔内的移动导致晶片载体沿着外部驱动表面的相应移动。

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