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21. 发明授权

US07451936B2 Module for contactless chip cards or identification systems 有权
标题翻译：非接触式芯片卡或识别系统模块
公开(公告)号：US07451936B2
公开(公告)日：2008-11-18
申请号：US11479295
申请日：2006-06-30
申请人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
发明人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
IPC分类号： G06K19/05
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.
摘要翻译：用于非接触式芯片卡或识别系统的模块，具有第一天线接触条和第二天线接触条，每个具有第一表面和背离第一表面的第二表面;半导体芯片，具有至少两个触点，至少一个接触接触连接第一天线接触条的第一表面和至少一个另外的触点接触连接第二天线接触条的第一表面和至少一个粘合膜条，其至少部分地覆盖两者的第一表面所述第一天线接触条和所述第二天线接触条，所述至少一个粘合膜条布置在被所述半导体芯片覆盖的所述第一和第二天线接触条的区域的外侧。

22. 发明申请

US20060243812A1 Module for contactless chip cards or identification systems 有权
公开(公告)号：US20060243812A1
公开(公告)日：2006-11-02
申请号：US11479295
申请日：2006-06-30
申请人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
发明人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
IPC分类号： G06K19/06
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.

23. 发明申请

US20050061661A1 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive 审中-公开
标题翻译：用于已经导电的涂层结构的电沉积装置和电沉积系统
公开(公告)号：US20050061661A1
公开(公告)日：2005-03-24
申请号：US10916308
申请日：2004-08-11
申请人： Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher , Andreas Karl
发明人： Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher , Andreas Karl
IPC分类号： C25D5/18 , C25D7/06 , H05K1/00 , H05K3/24 , C25D17/00
CPC分类号： C25D5/18 , C25D7/0614 , C25D7/0657 , H05K1/0393 , H05K3/241
摘要： Electrodeposition device for electrodepositing an electrically conductive layer on a substrate having an electrolyte bath in which an anode device and at least one contact-making unit are arranged, each contact-making unit having a plurality of electrically conductive regions of which at least one is connected cathodically and at least one is connected anodically.
摘要翻译：电沉积装置，用于在具有阳极装置和至少一个接触制造单元的电解质浴的基底上电沉积导电层，每个接触制备单元具有至少一个连接的多个导电区域阴极和至少一个阳极连接。

24. 发明授权

US10047874B2 Magnetic valve 有权
公开(公告)号：US10047874B2
公开(公告)日：2018-08-14
申请号：US14129341
申请日：2012-05-08
申请人： Andreas Karl , Reinhard Fink , Dirk Foerch
发明人： Andreas Karl , Reinhard Fink , Dirk Foerch
IPC分类号： F16K31/06 , B60T8/36
摘要： A magnetic valve includes a valve component and a valve body that engages around a region of the valve component in a hood-like manner and in a sealing manner in at least one sealing region. A flow chamber is formed between the valve body and an end face of the valve component. The valve component has an axially running through-channel with a constant cross-section which passes through the end face and which opens into the flow chamber so as to form an axial duct for a fluid. The valve body has a through-opening that is fluidically connected to the flow chamber and is configured to be closed by a closing element that is movably arranged on a valve body face that faces away from the flow chamber. The end face is configured as a type of lip seal ring.

25. 发明申请

US20120313029A1 VALVE FOR CONTROLLING A FLUID 审中-公开
标题翻译：用于控制流体的阀
公开(公告)号：US20120313029A1
公开(公告)日：2012-12-13
申请号：US13491719
申请日：2012-06-08
申请人： Andreas Karl , Andreas Lechler , Jens Norberg
发明人： Andreas Karl , Andreas Lechler , Jens Norberg
IPC分类号： F16K1/36
CPC分类号： B60T8/363 , F16K1/36 , F16K29/00
摘要： A valve for controlling a fluid includes a valve seat and a closing body which has a spherical-cap-shaped end region and which is configured to open up and close off a passage at the valve seat. The closing body is rotatably mounted on a bearing and has at least one contouring formed on a surface of the closing body. The contouring is configured to set the closing body in rotation.
摘要翻译：用于控制流体的阀包括阀座和封闭体，该阀座具有球形帽状的端部区域，并且构造成在阀座处开通和关闭通道。闭合体可旋转地安装在轴承上并且具有形成在闭合体的表面上的至少一个轮廓。轮廓被配置成使闭合体旋转。

26. 发明申请

US20100084474A1 DOCUMENT FOR PERSONAL IDENTIFICATION AND A METHOD FOR PRODUCING A DOCUMENT FOR PERSONAL IDENTIFICATION 有权
标题翻译：用于个人身份识别的文档和用于生成用于个人身份识别的文档的方法
公开(公告)号：US20100084474A1
公开(公告)日：2010-04-08
申请号：US12570993
申请日：2009-09-30
申请人： Matthias Gruenauer , Andreas Karl , Andreas Mueller-Hipper , Frank Pueschner , Peter Scherl
发明人： Matthias Gruenauer , Andreas Karl , Andreas Mueller-Hipper , Frank Pueschner , Peter Scherl
IPC分类号： G06K19/07 , B32B37/00
CPC分类号： G06K19/07749 , B32B38/10 , B32B2305/347 , B32B2425/00 , B32B2519/02 , Y10T156/10
摘要： A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.
摘要翻译：一种用于个人识别的文档，具有包括以下部件的芯片模块：芯片和引线框架，其中芯片连接到引线框架，外盖，其中外盖连接到应答器基板。芯片模块的第一部件连接到外盖，并且芯片模块的第二部件以这样的方式连接到应答器基板，使得在分离外盖和应答器基板的情况下，第一部件芯片模块与芯片模块的第二组件分离。

27. 发明授权

US07192509B2 Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam 失效
标题翻译：用于制造泡沫金属结构的方法，金属泡沫和具有载体基底和金属泡沫的布置
公开(公告)号：US07192509B2
公开(公告)日：2007-03-20
申请号：US11062318
申请日：2005-02-18
申请人： Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
发明人： Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
IPC分类号： C25D1/08 , C23C28/02 , C22C2/02
CPC分类号： C23C18/2086 , C23C18/1644 , C23C18/1653 , C25D5/56 , Y10T428/12063
摘要： Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.
摘要翻译：制造泡沫金属结构的方法，包括以下步骤：提供具有发泡结构的非导电基材，将导电颗粒施加到基材上，使得导电颗粒固定在基材的整个表面上，特别是固定在每个将该预处理基板导入电镀装置，在该电镀装置中，在导电性粒子上形成均匀的金属层。

28. 发明授权

US07100836B2 Module for contactless chip cards or identification systems 有权
标题翻译：非接触式芯片卡或识别系统模块
公开(公告)号：US07100836B2
公开(公告)日：2006-09-05
申请号：US11001781
申请日：2004-12-01
申请人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
发明人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
IPC分类号： G06K19/06
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.
摘要翻译：用于非接触式芯片卡或识别系统的模块，具有第一天线接触条和第二天线接触条，每个具有第一表面和背离第一表面的第二表面;半导体芯片，具有至少两个触点，至少一个接触接触连接第一天线接触条的第一表面和至少一个另外的触点接触连接第二天线接触条的第一表面和至少一个粘合膜条，其至少部分地覆盖两者的第一表面所述第一天线接触条和所述第二天线接触条，所述至少一个粘合膜条布置在被所述半导体芯片覆盖的所述第一和第二天线接触条的区域的外侧。

29. 发明申请

US20050194259A1 Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam 失效
标题翻译：用于制造泡沫金属结构的方法，金属泡沫和具有载体基底和金属泡沫的布置
公开(公告)号：US20050194259A1
公开(公告)日：2005-09-08
申请号：US11062318
申请日：2005-02-18
申请人： Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
发明人： Andreas Karl , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
IPC分类号： C23C18/16 , C23C18/20 , C25D3/00 , C25D5/56
CPC分类号： C23C18/2086 , C23C18/1644 , C23C18/1653 , C25D5/56 , Y10T428/12063
摘要： Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.
摘要翻译：制造泡沫金属结构的方法，包括以下步骤：提供具有发泡结构的非导电基材，将导电颗粒施加到基材上，使得导电颗粒固定在基材的整个表面上，特别是固定在每个将该预处理基板导入电镀装置，在该电镀装置中，在导电性粒子上形成均匀的金属层。

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