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1. 发明授权

US07633149B2 Integrated circuit arrangement 有权
标题翻译：集成电路布置
公开(公告)号：US07633149B2
公开(公告)日：2009-12-15
申请号：US10598054
申请日：2005-02-14
申请人： Jurgen Fischer , Manfred Mengel , Frank Puschner
发明人： Jurgen Fischer , Manfred Mengel , Frank Puschner
IPC分类号： H01L23/13
CPC分类号： H01L23/573 , H01L23/13 , H01L29/0657 , H01L2924/0002 , H01L2924/3511 , H01L2924/00
摘要： An integrated circuit arrangement including a nonplanar substrate on which an integrated circuit is formed on at least one side, wherein the side of the substrate which has the integrated circuit is arranged on a carrier and the carrier is produced from a chemically resistant material.
摘要翻译：一种集成电路装置，包括在至少一侧上形成有集成电路的非平面基板，其中具有集成电路的基板的侧面布置在载体上，并且载体由耐化学腐蚀材料制成。

2. 发明授权

US07605453B2 Chip module and chip card 有权
标题翻译：芯片模块和芯片卡
公开(公告)号：US07605453B2
公开(公告)日：2009-10-20
申请号：US11464064
申请日：2006-08-11
申请人： Peter Stampka , Frank Puschner , Erik Heinemann , Birgit Binder
发明人： Peter Stampka , Frank Puschner , Erik Heinemann , Birgit Binder
IPC分类号： H01L23/02
CPC分类号： H01L23/49855 , G06K19/07728 , G06K19/07745 , H01L23/562 , H01L2924/0002 , H01L2924/00
摘要： A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.
摘要翻译：一种芯片模块和具有芯片模块的芯片卡，芯片模块可以弯曲成使得横截面区域沿着弯曲线的最大曲率延伸并平行于芯片模块或芯片卡的一侧。所述模块包括在与所述横截面区域垂直的平面内布置的周围线内的接触区域，所述环绕线路包括与所述横截面区域相邻的第一线路部分和与所述横截面区域相邻的第二线路部分第一行部分。此外，模块包括部件，其被定位成使得部件和第一线部分之间的第一距离大于部件和第二线部分之间的第二距离。

3. 发明申请

US20070034999A1 CHIP MODULE AND CHIP CARD 有权
标题翻译：芯片模块和芯片卡
公开(公告)号：US20070034999A1
公开(公告)日：2007-02-15
申请号：US11464064
申请日：2006-08-11
申请人： Peter Stampka , Frank Puschner , Erik Heinemann , Birgit Binder
发明人： Peter Stampka , Frank Puschner , Erik Heinemann , Birgit Binder
IPC分类号： H01L23/02
CPC分类号： H01L23/49855 , G06K19/07728 , G06K19/07745 , H01L23/562 , H01L2924/0002 , H01L2924/00
摘要： A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.
摘要翻译：一种芯片模块和具有芯片模块的芯片卡，芯片模块可以弯曲成使得横截面区域沿着弯曲线的最大曲率延伸并平行于芯片模块或芯片卡的一侧。所述模块包括在与所述横截面区域垂直的平面内布置的周围线内的接触区域，所述环绕线路包括与所述横截面区域相邻的第一线路部分和与所述横截面区域相邻的第二线路部分第一行部分。此外，模块包括部件，其被定位成使得部件和第一线部分之间的第一距离大于部件和第二线部分之间的第二距离。

4. 发明申请

US20050272249A1 Method and system for producing conductive patterns on a substrate 审中-公开
标题翻译：在基板上制造导电图案的方法和系统
公开(公告)号：US20050272249A1
公开(公告)日：2005-12-08
申请号：US11137698
申请日：2005-05-24
申请人： Andreas Karl , Andreas Muller-Hipper , Frank Puschner , Ewald Simmerlein-Erlbacher
发明人： Andreas Karl , Andreas Muller-Hipper , Frank Puschner , Ewald Simmerlein-Erlbacher
IPC分类号： H05K3/10 , H05K3/18 , H05K3/24 , H01L21/4763
CPC分类号： G06K19/07749 , H05K3/102 , H05K3/184 , H05K3/246 , H05K2201/0224 , H05K2203/0315
摘要： A method of producing a conductive pattern on a substrate, including the steps of providing a surface of the substrate with a conductive layer, which is formed by providing the surface of the substrate at least partly with conductive particles, by directly using the adhesive power of the surface of the substrate, applying a passivation layer to the conductive layer, the passivation layer being formed as a negative image of the conductive pattern, and forming the conductive pattern in the regions not covered by the passivation layer.
摘要翻译：一种在基板上制造导电图案的方法，包括以下步骤：通过直接使用导电图案的粘合力，提供基板的表面，该导电层是通过至少部分地提供导电颗粒来提供基板的表面而形成的衬底的表面，向导电层施加钝化层，钝化层形成为导电图案的负像，并且在未被钝化层覆盖的区域中形成导电图案。

5. 发明授权

US07451936B2 Module for contactless chip cards or identification systems 有权
标题翻译：非接触式芯片卡或识别系统模块
公开(公告)号：US07451936B2
公开(公告)日：2008-11-18
申请号：US11479295
申请日：2006-06-30
申请人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
发明人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
IPC分类号： G06K19/05
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.
摘要翻译：用于非接触式芯片卡或识别系统的模块，具有第一天线接触条和第二天线接触条，每个具有第一表面和背离第一表面的第二表面;半导体芯片，具有至少两个触点，至少一个接触接触连接第一天线接触条的第一表面和至少一个另外的触点接触连接第二天线接触条的第一表面和至少一个粘合膜条，其至少部分地覆盖两者的第一表面所述第一天线接触条和所述第二天线接触条，所述至少一个粘合膜条布置在被所述半导体芯片覆盖的所述第一和第二天线接触条的区域的外侧。

6. 发明申请

US20060243812A1 Module for contactless chip cards or identification systems 有权
公开(公告)号：US20060243812A1
公开(公告)日：2006-11-02
申请号：US11479295
申请日：2006-06-30
申请人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
发明人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
IPC分类号： G06K19/06
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.

7. 发明申请

US20050239237A1 Method for producing a BGA chip module and BGA chip module 审中-公开
标题翻译：制造BGA芯片模块和BGA芯片模块的方法
公开(公告)号：US20050239237A1
公开(公告)日：2005-10-27
申请号：US11112739
申请日：2005-04-22
申请人： Frank Puschner , Wolfgang Schindler , Gunter Tutsch
发明人： Frank Puschner , Wolfgang Schindler , Gunter Tutsch
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/60 , H01L23/498 , H01L23/50 , H05K3/34
CPC分类号： H05K3/3436 , H01L23/49816 , H01L23/49827 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K2201/0394 , H05K2201/09472 , Y02P70/613 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： BGA chip module and method for producing the BGA chip module by providing a carrier, forming holes at points at which bonding points of the BGA chip module are to be produced, forming metallization areas on an upper side of the carrier and covering the holes, connecting bonding points of a chip to the metallization areas, and introducing bonding elements into the holes.
摘要翻译： BGA芯片模块和通过提供载体制造BGA芯片模块的方法，在要制造BGA芯片模块的接合点的点处形成孔，在载体的上侧形成金属化区域并覆盖孔将芯片的接合点连接到金属化区域，并将结合元件引入孔中。

8. 发明授权

US07100836B2 Module for contactless chip cards or identification systems 有权
标题翻译：非接触式芯片卡或识别系统模块
公开(公告)号：US07100836B2
公开(公告)日：2006-09-05
申请号：US11001781
申请日：2004-12-01
申请人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
发明人： Frank Puschner , Andreas Muller-Hipper , Andreas Karl
IPC分类号： G06K19/06
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.
摘要翻译：用于非接触式芯片卡或识别系统的模块，具有第一天线接触条和第二天线接触条，每个具有第一表面和背离第一表面的第二表面;半导体芯片，具有至少两个触点，至少一个接触接触连接第一天线接触条的第一表面和至少一个另外的触点接触连接第二天线接触条的第一表面和至少一个粘合膜条，其至少部分地覆盖两者的第一表面所述第一天线接触条和所述第二天线接触条，所述至少一个粘合膜条布置在被所述半导体芯片覆盖的所述第一和第二天线接触条的区域的外侧。

9. 发明申请

US20060043575A1 Chip module 审中-公开
标题翻译：芯片模块
公开(公告)号：US20060043575A1
公开(公告)日：2006-03-02
申请号：US11216457
申请日：2005-08-30
申请人： Andreas Muller-Hipper , Frank Puschner
发明人： Andreas Muller-Hipper , Frank Puschner
IPC分类号： H01L23/12 , H01L23/28
CPC分类号： G06K19/07745 , G06K19/07728 , H01L23/24 , H01L23/49503 , H01L23/4951 , H01L23/49551 , H01L23/49855 , H01L23/562 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16245 , H01L2924/00014 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A chip module including a chip having an integrated circuit and a stiffening element which is connected to the chip. The stiffening element includes a first part which extends parallel to the connection plane of the chip, and at least one second part which extends at an angle to the plane. The chip is connected in a force-fitting manner to the first part of the stiffening element.
摘要翻译：一种芯片模块，包括具有集成电路的芯片和连接到芯片的加强元件。加强元件包括平行于芯片的连接平面延伸的第一部分和与该平面成一定角度延伸的至少一个第二部分。芯片以加力方式连接到加强元件的第一部分。

10. 发明授权

US07159786B2 Data carrier card 有权
标题翻译：数据载体卡
公开(公告)号：US07159786B2
公开(公告)日：2007-01-09
申请号：US10925882
申请日：2004-08-23
申请人： Jurgen Fischer , Herbert Palm , Frank Puschner , Josef Willer
发明人： Jurgen Fischer , Herbert Palm , Frank Puschner , Josef Willer
IPC分类号： G06K19/06
CPC分类号： G06K19/07747 , G06K19/07743 , H01L2224/48091 , H01L2924/00014
摘要： Data carrier card having a card body of a flat form and having a recess, a carrier, a chip arranged on the carrier and inserted in the recess of the card body, external contact elements arranged on the carrier and electrically connected to the chip via conductor runs, and a cover covering the recess in operative connection with the carrier such that the carrier is held along the bottom in the recess, wherein the external contact elements and the chip are arranged on a same side of the carrier.
摘要翻译：数据载体卡具有扁平形式的卡体，并且具有凹槽，载体，布置在载体上的芯片并插入卡体的凹部中，外部接触元件布置在载体上并电连接到芯片通孔导体并且覆盖与载体可操作地连接的凹部的盖，使得载体沿着凹部中的底部保持，其中外部接触元件和芯片布置在载体的同一侧上。

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