专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20100000680A1 SEPARATING APPARATUS AND SEPARATING METHOD 有权
标题翻译：分离装置和分离方法
公开(公告)号：US20100000680A1
公开(公告)日：2010-01-07
申请号：US12492620
申请日：2009-06-26
申请人： Yoshihiro INAO , Akihiko Nakamura , Yasumasa Iwata
发明人： Yoshihiro INAO , Akihiko Nakamura , Yasumasa Iwata
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , H01L21/67011 , H01L21/6838 , Y10T156/1111 , Y10T156/1116 , Y10T156/1132 , Y10T156/1137 , Y10T156/1939 , Y10T156/1944
摘要： A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes 3 and 3′ for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes 3 and 3′ has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.
摘要翻译：根据本发明的分离装置包括用于通过抽吸粘附到支撑板的吸板。吸盘具有用于从吸板和支撑板之间的空间排出气体的吸孔3和3'。每个吸孔3和3'的直径不小于0.3mm且不大于支撑板的外径。这使得可以在不破坏晶片的情况下将支撑板与晶片分离。

22. 发明申请

US20090325467A1 Method of Thinning Wafer and Support plate 失效
标题翻译：薄板和支撑板变薄的方法
公开(公告)号：US20090325467A1
公开(公告)日：2009-12-31
申请号：US12309285
申请日：2007-05-24
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译：晶片可以变薄而不发生凹坑。支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。

23. 外观设计

USD544452S1 Supporting plate 有权
标题翻译：支撑板
公开(公告)号：USD544452S1
公开(公告)日：2007-06-12
申请号：US29255496
申请日：2006-03-08
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
设计人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao

24. 发明申请

US20070125495A1 Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate 有权
标题翻译：支撑板的安装装置和安装装置以及支撑板的安装方法
公开(公告)号：US20070125495A1
公开(公告)日：2007-06-07
申请号：US11633604
申请日：2006-12-04
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
IPC分类号： B32B37/00
CPC分类号： B32B38/1841 , B32B37/0046 , B32B2038/1891 , B32B2309/68 , B32B2457/14 , H01L21/68 , H01L21/68742 , Y10T156/17
摘要： An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members.
摘要翻译：一种连接装置，其能够在基板和支撑板的直径基本相同的情况下准确地进行对准，包括用于在其上安装半导体晶片的安装板，用于将支撑板按压到半导体晶片上的按压板，以及一对对准构件。一对对准构件被布置成在水平方向上自由地前后移动，并且用于支撑支撑板的周边的下表面的叶片和用于在支撑板叠置在半导体上的状态下执行定位的推动构件晶片设置在对准构件的顶端。

25. 发明申请

US20070062644A1 Supporting plate, apparatus, and method for stripping supporting plate 审中-公开
标题翻译：支撑板支撑板，装置和方法
公开(公告)号：US20070062644A1
公开(公告)日：2007-03-22
申请号：US11512566
申请日：2006-08-30
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
IPC分类号： B29C63/00
CPC分类号： B29C63/0013 , B29L2031/3425 , Y10T156/1111 , Y10T156/1132 , Y10T156/1928
摘要： A supporting plate which makes it possible to easily strip the supporting plate from a substrate in a short period of time after thinning the substrate. In the supporting plate to which a circuit-formed surface of a substrate is bonded with an adhesive, a first penetrating hole is formed in a substantially central portion of the supporting plate in the thickness direction, grooves connecting with the first penetrating hole are formed on a surface of the supporting plate to be contacted with an adhesive, and a second penetrating hole connecting with the grooves is formed in a peripheral portion of the supporting plate in the thickness direction.
摘要翻译：支撑板，其能够在使基板变薄之后的短时间内容易地从基板剥离支撑板。在基板的电路形成面与粘合剂接合的支撑板中，在厚度方向的支撑板的大致中央部形成有第一贯通孔，与第一贯通孔连结的槽形成在在支撑板的周边部分沿厚度方向形成与粘合剂接触的支撑板的表面和与槽连接的第二贯通孔。

26. 发明申请

US20070054470A1 Method for thinning substrate and method for manufacturing circuit device 有权
标题翻译：薄板化方法及制造电路器件的方法
公开(公告)号：US20070054470A1
公开(公告)日：2007-03-08
申请号：US11517157
申请日：2006-09-07
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
IPC分类号： H01L21/30 , H01L21/461
CPC分类号： H01L21/78 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363
摘要： The object of the present invention is to provide a method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate 1 and the substrate W are joined by using an adhesive layer 2, and a sheet 6 is attached to the supporting plate 1. The surface of the supporting plate 1 to which the sheet 6 has been attached is mounted and fixed by attraction onto an attracting head 7. The surface of the semiconductor wafer W on which no circuit device is formed is ground by a grinder 8 in this state.
摘要翻译：本发明的目的是提供一种用于使基板变薄的方法和用于制造电路装置的方法，其可以防止支撑板的穿透图案被转移到基板的表面，并且防止非 - 发生基板表面的均匀研磨。支撑板1和基板W通过使用粘合剂层2接合，并且片材6附接到支撑板1。已经安装了片材6的支撑板1的表面通过吸引安装并固定到吸引头7上。在该状态下，通过研磨机8将形成有电路装置的半导体晶片W的表面研磨。

27. 发明授权

US06893172B2 Developing apparatus and developing method 失效
标题翻译：开发设备和开发方法
公开(公告)号：US06893172B2
公开(公告)日：2005-05-17
申请号：US10780010
申请日：2004-02-17
申请人： Akihiko Nakamura , Yoshihiro Inao
发明人： Akihiko Nakamura , Yoshihiro Inao
IPC分类号： G03F7/30 , G03D5/00 , H01L21/027 , B05C11/02 , B05D3/12
CPC分类号： G03D5/00
摘要： A developing apparatus which enables the time necessary for a development reaction to be shortened and permits uniform development includes a chuck device with a support portion whose top surface is a horizontal surface and a spinner disposed in the middle of this support portion. The support portion and the spinner are provided within an antiscattering cup. A groove which vacuum adsorbs a substrate W to be treated is formed on the top surface of the spinner, a pipe which forms a circulation path is disposed within the groove formed on the top surface of the support portion, and a cleaning nozzle which cleans a developing solution which has flown behind the rear surface of the substrate W is disposed in a position which is nearest to the inside diameter of the top surface of the support portion. On the other hand, in a nozzle device, a spray nozzle is attached to a horizontally reciprocating arm via a columnar support. A developing solution pipe and an air supply pipe are inserted into this spray nozzle and a temperature-regulated developing solution from the developing solution supply pipe is spouted in mist form from the bottom end of the spray nozzle.
摘要翻译：能够缩短展开反应所需的时间并且允许均匀显影的显影装置包括具有顶表面是水平表面的支撑部分和设置在该支撑部分中间的旋转器的卡盘装置。支撑部分和旋转器设置在防雾杯内。真空吸附待处理基板W的槽形成在旋转器的上表面上，形成循环路径的管布置在形成在支撑部分的顶表面上的槽内，并且清洁喷嘴已经流过基板W的后表面后方的显影液被配置在最靠近支撑部的上表面的内径的位置。另一方面，在喷嘴装置中，喷嘴通过柱状支撑件附接到水平往复臂。将显影溶液管和供气管插入该喷嘴中，并且来自显影液供给管的温度调节显影液从雾喷嘴的底端喷出。

28. 发明授权

US08931535B2 Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate 有权
标题翻译：支撑板的安装装置和安装装置以及支撑板的安装方法
公开(公告)号：US08931535B2
公开(公告)日：2015-01-13
申请号：US13369448
申请日：2012-02-09
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
IPC分类号： B32B37/10 , B32B38/18 , H01L21/68 , H01L21/687 , B32B37/00
CPC分类号： B32B38/1841 , B32B37/0046 , B32B2038/1891 , B32B2309/68 , B32B2457/14 , H01L21/68 , H01L21/68742 , Y10T156/17
摘要： An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.
摘要翻译：用粘合剂将支撑板附着在基板的表面上的安装方法包括以下步骤：将粘合剂施加到基板的表面，加热然后冷却基板，使基板和支撑板的中心定位成与并且通过在压力降低的气氛中将粘合剂将支撑板推压到基板上而形成层状结构。在定位步骤中，在将支承后端放置在基板上之后，由于将粘合剂施加于基板的表面，所以可以在附着时精细地调整支撑板和半导体晶片的对准，然后将基板被加热和冷却。

29. 发明授权

US08426543B2 Adhesive composition and adhesive film 有权
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US08426543B2
公开(公告)日：2013-04-23
申请号：US12516363
申请日：2007-09-27
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
IPC分类号： C08F20/10
CPC分类号： C09J133/04 , C09J7/381 , C09J125/14 , C09J135/06 , C09J2203/326 , C09J2205/114 , C09J2425/00 , C09J2433/00 , H01L21/6835 , H01L2221/6834 , H01L2924/30105 , Y10T428/2852 , Y10T428/2891
摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.
摘要翻译：作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物，具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

30. 发明授权

US07849905B2 Stripping device and stripping apparatus 有权
标题翻译：剥离装置和剥离装置
公开(公告)号：US07849905B2
公开(公告)日：2010-12-14
申请号：US11633499
申请日：2006-12-04
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
IPC分类号： B29C63/00 , B29C65/00 , B32B37/00 , B32B41/00 , B32B38/04 , B65C9/40 , G05G15/00 , B31F1/28 , B26D5/00
CPC分类号： H01L21/67225 , H01L21/67092 , H01L21/68764 , Y10S156/93 , Y10S156/941 , Y10T156/107 , Y10T156/108 , Y10T156/1111 , Y10T156/1944
摘要： A stripping apparatus has a simplified structure for stripping a supporting plate from a layered structure, occupies less space, and strips a supporting plate in a shorter period of time. The stripping apparatus comprises a transfer robot, a cassette, a stripping device and a cleaning device which surround the transfer robot. The stripping device comprises a chucking plate for attracting and retaining a layered structure, and a stripping plate for stripping the supporting plate from the layered structure. The chucking plate is constructed so as to be rotated by 180° within a vertical plane, elevated and lowered in a vertical direction in a state of retaining the layered structure.
摘要翻译：剥离装置具有用于从分层结构剥离支撑板的简化结构，占用更少的空间，并且在更短的时间段内剥离支撑板。剥离装置包括传送机器人，盒，剥离装置和围绕传送机器人的清洁装置。剥离装置包括用于吸引和保持层状结构的夹持板，以及用于从分层结构剥离支撑板的剥离板。夹持板被构造成在保持层状结构的状态下在垂直平面内旋转180°，在垂直方向上升高和降低。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式