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    • 22. 发明申请
    • Tunable inter-digital capacitor and method of manufacturing the same
    • 可调式数字量电容器及其制造方法
    • US20080049375A1
    • 2008-02-28
    • US11789311
    • 2007-04-24
    • Young Chul Lee
    • Young Chul Lee
    • H01G4/00
    • H01G7/06Y10T29/43
    • Provided are a tunable inter-digital capacitor (IDC) and a method of manufacturing the same. The tunable IDC includes: a first dielectric layer formed on a substrate and having electrode pattern grooves of an IDC including a ground line and a signal line formed therein; electrode metal patterns formed in the electrode pattern grooves of the IDC including the ground line and the signal line formed in the first dielectric layer; and a second dielectric layer formed on an upper surface of the first dielectric layer to cover all of the electrode metal patterns except for parts of the ground and signal lines. Therefore, it is possible to increase tunability of the IDC and reduce drive voltage.
    • 提供可调谐的数字间电容器(IDC)及其制造方法。 可调谐IDC包括:第一电介质层,其形成在基板上,并且具有IDC的电极图案槽,所述电极图案槽包括形成在其中的接地线和信号线; 形成在包括接地线的IDC的电极图案凹槽中的电极金属图案和形成在第一介电层中的信号线; 以及形成在所述第一电介质层的上表面上的第二电介质层,以覆盖除了所述接地和信号线的部分之外的所有电极金属图案。 因此,可以提高IDC的可调性并降低驱动电压。
    • 23. 发明申请
    • Platen assembly, apparatus having the platen assembly and method of polishing a wafer using the platen assembly
    • 压板组件,具有压板组件的装置和使用压板组件抛光晶片的方法
    • US20070184759A1
    • 2007-08-09
    • US11702854
    • 2007-02-06
    • Young-Chul Lee
    • Young-Chul Lee
    • B24B7/30B24B21/00
    • B24B37/12B24B21/08
    • In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders extends in a first direction on an entire surface of the platen and is spaced apart by a uniform distance, and the first bladders apply pressure to the polishing belt. A plurality of second bladders extends in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and is positioned between the first bladders, and the second bladders apply pressure to the polishing belt. The pressures of the bladders are individually controlled by pressure controllers. Various pressures are individually applied different portions of the polishing belt by the bladders.
    • 在用于抛光装置的压板组件中,压板支撑在抛光过程中与物体接触的抛光带,使得压板在抛光过程中在抛光带上提供压力。 多个第一气囊在压板的整个表面上沿第一方向延伸并且间隔开均匀的距离,并且第一气囊向抛光带施加压力。 多个第二气囊在压板表面的中间部分的第一方向上延伸,位于压板的中心部分和周边部分之间,并且位于第一气囊之间,并且第二气囊向抛光带施加压力。 气囊的压力由压力控制器单独控制。 通过气囊分别施加各种压力的抛光带的不同部分。
    • 25. 发明申请
    • Fluorescent material coating apparatus and method of coating fluorescent substance using the same
    • 荧光材料涂布装置及使用其的荧光物质的涂布方法
    • US20060198947A1
    • 2006-09-07
    • US11363352
    • 2006-02-27
    • Young-Chul LeeDong-Gil KimSung-Jung KimJeon-Gu KimHong-Lae Cho
    • Young-Chul LeeDong-Gil KimSung-Jung KimJeon-Gu KimHong-Lae Cho
    • B05D5/06B05D5/12
    • B05D7/22B05D3/0254B05D2254/04
    • There is provided a fluorescent material coating apparatus for a fluorescent lamp. The fluorescent material coating apparatus includes a cassette on which a plurality of glass tubes are detachably mounted, a delivery member having a delivery chamber communicating with first ends of the glass tubes, a negative pressure generating unit for allowing fluorescent solution to be drawn into the glass tubes by generating a negative pressure in the glass tubes communicating with the delivery chamber by lowering the pressure of the delivery chamber, a dry air supplying unit for supplying dry air to the delivery chamber to dry the fluorescent solution applied on inner surfaces of the glass tubes, a solution tank containing the fluorescent solution and disposed below the glass tubes mounted on the cassette, and a moving unit for allowing lower end portions of the glass tubes mounted in the delivery chamber to be dipped into the fluorescent solution contained in the solution tank.
    • 提供了一种用于荧光灯的荧光材料涂覆装置。 荧光材料涂布装置包括:多个玻璃管可拆卸地安装在其上的盒,具有与玻璃管的第一端连通的输送室的输送构件,用于使荧光溶液被吸入玻璃的负压产生单元 通过降低输送室的压力而在与输送室连通的玻璃管中产生负压的管;干空气供给单元,用于向输送室供给干燥空气以干燥施加在玻璃管的内表面上的荧光溶液 包含荧光溶液并设置在安装在盒上的玻璃管下方的溶液罐,以及用于使安装在输送室中的玻璃管的下端部浸入溶液罐中所含荧光溶液的移动单元。
    • 26. 发明授权
    • Method of fabricating a semiconductor device
    • 制造半导体器件的方法
    • US06511890B2
    • 2003-01-28
    • US09421090
    • 1999-10-19
    • Sung-Kye ParkYoung-Chul Lee
    • Sung-Kye ParkYoung-Chul Lee
    • H01L21331
    • H01L21/76828H01L29/6659
    • The present invention related to a method of fabricating a semiconductor device which prevents short channel hump due to the moisture in an insulating interlayer. The present invention includes the steps of forming a trench typed field oxide layer defining an active area in a field area of a semiconductor substrate of a first conductive type, forming a gate to the direction of device width wherein a gate oxide layer is inserted between the gate and semiconductor substrate, forming impurity regions in the semiconductor substrate at both sides of the gate by ion implantation with impurities of a second conductive type, forming an insulating interlayer covering the gate on the semiconductor substrate, and removing moisture contained in the insulating interlayer by thermal treatment.
    • 本发明涉及一种制造半导体器件的方法,该半导体器件防止由绝缘中间层中的水分导致的短沟道隆起。 本发明包括以下步骤:在第一导电类型的半导体衬底的场区域中形成限定有源区的沟槽型场氧化物层,在器件宽度方向上形成栅极,其中栅氧化层插入在 栅极和半导体衬底,通过具有第二导电类型的杂质的离子注入在栅极两侧的半导体衬底中形成杂质区,形成覆盖半导体衬底上的栅极的绝缘层,以及通过 热处理。
    • 29. 发明授权
    • Apparatus for guiding and aligning semiconductor chip package
    • 用于引导和对准半导体芯片封装的装置
    • US08628069B2
    • 2014-01-14
    • US12659717
    • 2010-03-18
    • Young-Chul Lee
    • Young-Chul Lee
    • B23Q1/25
    • G01R31/2893
    • Provided is an apparatus for guiding and aligning a semiconductor chip package. The apparatus may include an insert, a plate above the insert, and an adapter. The insert may be configured to house various sizes of semiconductor chip packages. The plate may be configured to move vertically with respect to the insert. The adapter may be coupled to the plate and may be configured to guide at least one semiconductor chip package into the insert and to perform alignment of the at least one semiconductor chip package. In accordance with example embodiments, the at least one semiconductor chip package may have a size corresponding to at least one of the various sizes.
    • 提供一种用于引导和对准半导体芯片封装的装置。 该装置可以包括插入件,插入件上方的板和适配器。 插入件可以被配置成容纳各种尺寸的半导体芯片封装。 板可以被配置为相对于插入件垂直移动。 适配器可以耦合到板并且可以被配置为将至少一个半导体芯片封装引导到插入件中并且执行至少一个半导体芯片封装的对准。 根据示例实施例,所述至少一个半导体芯片封装可以具有对应于各种尺寸中的至少一个的尺寸。