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21. 发明申请

US20080251788A1 Wafer-level package having test terminal 失效
标题翻译：晶圆级封装有测试端子
公开(公告)号：US20080251788A1
公开(公告)日：2008-10-16
申请号：US12155783
申请日：2008-06-10
申请人： Shigeyuki Maruyama
发明人： Shigeyuki Maruyama
IPC分类号： H01L23/482
CPC分类号： H01L22/32 , G01R31/2831 , G01R31/2884 , H01L24/19 , H01L24/20 , H01L24/94 , H01L24/96 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24137 , H01L2224/24195 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要： A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip terminals and non test chip terminals, at least one external connection terminal, at least one redistribution trace provided on the semiconductor wafer, at least one testing member, and an insulating material. A first end of the redistribution trace is connected to one of the test chip terminals and a second end of said redistribution trace is extended out to a position offset from the chip terminals. The testing member is provided in an outer region of the semiconductor chip circuit forming region, and the second end of the redistribution trace is connected to the testing member.
摘要翻译：晶片级封装包括具有至少一个半导体芯片电路形成区域的半导体晶片，每个半导体芯片电路形成区域各自包括半导体芯片电路，每个半导体芯片电路分别具有测试芯片端子和非测试芯片端子，至少一个外部连接端子，至少一个再分布迹线半导体晶片，至少一个测试构件和绝缘材料。再分配迹线的第一端连接到测试芯片端子之一，并且所述再分布迹线的第二端延伸到与芯片端子偏移的位置。测试构件设置在半导体芯片电路形成区域的外部区域中，再分布迹线的第二端连接到测试构件。

22. 发明授权

US07309996B2 Contactor for electronic components and test method using the same 有权
标题翻译：电子元件接触器和使用相同的测试方法
公开(公告)号：US07309996B2
公开(公告)日：2007-12-18
申请号：US10854172
申请日：2004-05-27
申请人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuke Koizumi , Takumi Kumatabara , Keisuke Fukuda
发明人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuke Koizumi , Takumi Kumatabara , Keisuke Fukuda
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R1/0441
摘要： A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要翻译：公开了一种被配置为电连接到电子部件的端子的接触器。连接器包括与电子部件的端子接触的多个接触电极和各自由导电性弹性体构成的多个弹性电极。弹性电极产生用于将接触电极压靠在电子部件的端子上的按压力。接触电极可与弹性电极分离。

23. 发明授权

US07276924B2 Electrical connecting method 有权
标题翻译：电气连接方式
公开(公告)号：US07276924B2
公开(公告)日：2007-10-02
申请号：US10937401
申请日：2004-09-10
申请人： Shigeyuki Maruyama , Toru Nishino
发明人： Shigeyuki Maruyama , Toru Nishino
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R31/2875 , G01R1/0735
摘要： An electrical connecting method has the step of bringing a contact member connected to an electric circuit into contact with a terminal of an electronic part. A desired processing is performed by feeding current to the terminal via the contact member. The contact member is then separated from the terminal. When the contact member is brought into contact with the terminal, energy is applied to the contact member or the terminal in order to locally soften a portion of the terminal contacting the contact member. Thereafter, the desired processing is performed, in the state that the contacting portion of the terminal with the contact member is softened so as to reduce the contact resistance and so as to increase the subsequent separatability of the contact member from the terminal.
摘要翻译：电连接方法具有使与电路连接的接触构件与电子部件的端子接触的步骤。通过经由接触构件将电流馈送到端子来执行所需的处理。然后将接触构件与端子分离。当接触构件与端子接触时，能量被施加到接触构件或端子，以便局部软化接触接触构件的端子的一部分。此后，在端子与接触构件的接触部分被软化以便降低接触电阻并且增加接触构件与端子的随后的分离性的状态下进行所需的处理。

24. 发明申请

US20070096761A1 Semiconductor apparatus testing arrangement and semiconductor apparatus testing method 有权
标题翻译：半导体装置测试装置和半导体装置测试方法
公开(公告)号：US20070096761A1
公开(公告)日：2007-05-03
申请号：US11339826
申请日：2006-01-26
申请人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
发明人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
IPC分类号： G01R31/26
CPC分类号： G01R1/0433
摘要： A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
摘要翻译：一种用于测试在半导体衬底上制造的多个半导体器件的半导体器件测试装置，具有布置有多个测试单元的衬底，每个单元包括与半导体器件的电极端子相对应的探针和连接的导体部件用探针。

25. 发明申请

US20060245161A1 Temperature control method and temperature control device 有权
标题翻译：温度控制方法和温度控制装置
公开(公告)号：US20060245161A1
公开(公告)日：2006-11-02
申请号：US11350894
申请日：2006-02-10
申请人： Shigeyuki Maruyama , Hiroshi Misawa , Naohito Kohashi
发明人： Shigeyuki Maruyama , Hiroshi Misawa , Naohito Kohashi
IPC分类号： H05K7/20
CPC分类号： G01R31/2874 , H01L2924/0002 , H01L2924/00
摘要： In a temperature control method, a controlled part is arranged to contact a first principal surface of a heat conduction part. The heat conduction part has the first principal surface and a second principal surface opposite to the first principal surface. The first principal surface has a configuration corresponding to a configuration of the controlled part. The second principal surface has an area larger than an area of the first principal surface. At least one of a heating unit and a cooling unit is driven to set the controlled part at a predetermined temperature. The heating unit and the cooling unit are disposed on the second principal surface of the heat conduction part so that the heating unit and the cooling unit are arranged side by side.
摘要翻译：在温度控制方法中，受控部件布置成接触导热部分的第一主表面。导热部分具有第一主表面和与第一主表面相对的第二主表面。第一主表面具有对应于受控部件的构造的构造。第二主表面的面积大于第一主表面的面积。驱动加热单元和冷却单元中的至少一个以将受控部件设定在预定温度。加热单元和冷却单元设置在导热部分的第二主表面上，使得加热单元和冷却单元并排布置。

26. 发明授权

US07112889B1 Semiconductor device having an alignment mark formed by the same material with a metal post 有权
公开(公告)号：US07112889B1
公开(公告)日：2006-09-26
申请号：US09577932
申请日：2000-05-25
申请人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
发明人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
IPC分类号： H01L23/544
CPC分类号： H01L22/12 , G01R31/2891 , H01L21/67282 , H01L21/6838 , H01L22/32 , H01L23/544 , H01L24/97 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5448 , H01L2223/54493 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , Y10T29/49998 , Y10T279/11 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

27. 发明授权

US07038477B2 Contactor having conductive particles in a hole as a contact electrode 失效
公开(公告)号：US07038477B2
公开(公告)日：2006-05-02
申请号：US11023530
申请日：2004-12-29
申请人： Shigeyuki Maruyama , Susumu Kida , Naoyuki Watanabe , Takafumi Hashitani , Ei Yano , Ichiro Midorikawa
发明人： Shigeyuki Maruyama , Susumu Kida , Naoyuki Watanabe , Takafumi Hashitani , Ei Yano , Ichiro Midorikawa
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/0483 , G01R1/06711 , G01R1/06755 , G01R1/07314 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.

28. 发明申请

US20050225342A1 Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece 有权
标题翻译：制造具有电路侧接触片和测试板侧接触片的半导体器件测试接触器的方法
公开(公告)号：US20050225342A1
公开(公告)日：2005-10-13
申请号：US11147167
申请日：2005-06-08
申请人： Shigeyuki Maruyama , Hirohisa Matsuki
发明人： Shigeyuki Maruyama , Hirohisa Matsuki
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , H01L21/66 , H01R11/01 , H01R33/76 , H01R43/00 , H05K3/32 , H01L21/302
CPC分类号： G01R1/0408 , G01R1/073 , H05K3/326 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/49217 , Y10T29/49218
摘要： A contactor is placed between a semiconductor device and a test board. A contact electrode of the contactor electrically connects the semiconductor device to the test board. The contact electrode is formed of a conductive layer provided on an insulating substrate. The contact electrode comprises a first contact piece which contacts a terminal of the semiconductor device, a second contact piece which contacts an electrode of the test board, and a connecting portion which electrically connects the first contact piece and the second contact piece.
摘要翻译：接触器放置在半导体器件和测试板之间。接触器的接触电极将半导体器件电连接到测试板。接触电极由设置在绝缘基板上的导电层形成。接触电极包括接触半导体器件的端子的第一接触片，与测试板的电极接触的第二接触片和电连接第一接触片和第二接触片的连接部。

29. 发明授权

US06939142B2 Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece 失效
标题翻译：具有电路侧接触片和测试板侧接触片的半导体器件测试接触器
公开(公告)号：US06939142B2
公开(公告)日：2005-09-06
申请号：US09739288
申请日：2000-12-19
申请人： Shigeyuki Maruyama , Hirohisa Matsuki
发明人： Shigeyuki Maruyama , Hirohisa Matsuki
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , H01L21/66 , H01R11/01 , H01R33/76 , H01R43/00 , H05K3/32 , H01R12/00
CPC分类号： G01R1/0408 , G01R1/073 , H05K3/326 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/49217 , Y10T29/49218
摘要： A contactor is placed between a semiconductor device and a test board. A contact electrode of the contactor electrically connects the semiconductor device to the test board. The contact electrode is formed of a conductive layer provided on an insulating substrate. The contact electrode includes a first contact piece which contacts a terminal of the semiconductor device, a second contact piece which contacts an electrode of the test board, and a connecting portion which electrically connects the first contact piece and the second contact piece.
摘要翻译：接触器放置在半导体器件和测试板之间。接触器的接触电极将半导体器件电连接到测试板。接触电极由设置在绝缘基板上的导电层形成。接触电极包括与半导体器件的端子接触的第一接触片，与测试板的电极接触的第二接触片和将第一接触片和第二接触片电连接的连接部。

30. 发明授权

US06924174B2 Method of attaching electronic component and electronic component attaching tool 失效
公开(公告)号：US06924174B2
公开(公告)日：2005-08-02
申请号：US10655030
申请日：2003-09-05
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： H01R33/76 , B25B27/14 , H01R43/00 , H05K7/10 , H05K13/04 , H01L21/44
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

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