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    • 25. 发明授权
    • Method for generating dense lines on a semiconductor wafer using
phase-shifting and multiple exposures
    • 使用相移和多次曝光在半导体晶片上产生密集线的方法
    • US5407785A
    • 1995-04-18
    • US993228
    • 1992-12-18
    • Pierre Leroux
    • Pierre Leroux
    • G03F1/28G03F1/34G03F7/20G03F7/22G03C5/00
    • G03F1/34G03F1/28G03F7/2022G03F7/2024G03F7/70466
    • Ultra-small equal-width lines and spaces are generated on an integrated circuit wafer using multiple exposures and phase-shifting at the wafer level. In particular, an integrated circuit wafer is coated with a layer of photoresist and then masked using a mask defining a pattern of multiple feature lines arranged at a regular line pitch. The layer of photoresist is then underexposed so as to partially bleach portions of the layer of photoresist in accordance with the pattern. Next, the mask and the integrated circuit wafer are positionally translated relative to one another by a predetermined fraction of the line pitch, and the layer of photoresist is then again underexposed. Developing the photoresist layer creates a stepped profile. The layer of photoresist is then blanket exposed, the stepped profile causing exposure in the vicinity of steps to be retarded. The layer of photoresist is then developed, producing thin lines of photoresist separated by substantially equal spaces of no photoresist.
    • 在集成电路晶片上使用多个曝光和晶片级的相移产生超小的等宽线和间隔。 特别地,集成电路晶片涂覆有一层光致抗蚀剂,然后使用限定以规则线间距布置的多个特征线的图案的掩模进行掩模。 然后光致抗蚀剂层曝光不足,以便根据图案部分地漂白光致抗蚀剂层的部分。 接下来,掩模和集成电路晶片相对于彼此以线间距的预定分数位置地平移,然后光致抗蚀剂层再次曝光不足。 显影光致抗蚀剂层产生阶梯轮廓。 然后,光致抗蚀剂层被橡皮布暴露,阶梯状轮廓导致步骤附近的曝光被延迟。 然后显影光致抗蚀剂层,产生由基本上相等的没有光致抗蚀剂的空间分开的光致抗蚀剂层。
    • 28. 发明授权
    • Measuring the effect of flare on line width
    • 测量耀斑对线宽的影响
    • US07709166B2
    • 2010-05-04
    • US12464731
    • 2009-05-12
    • David ZigerPierre Leroux
    • David ZigerPierre Leroux
    • G03C5/00G03F1/00G03F9/00
    • G03F7/70941G03F1/44G03F1/70G03F7/70591G03F7/70616
    • In photo-lithography, one may assess the effect of flare due to various exposure tools. In an example embodiment, in a photo-lithography process on a photo resist coated substrate, there is a method for determining the effect of flare on line shortening. The method comprises, at a first die position on the substrate and in a first exposure, printing a first mask that includes a flare pattern corresponding to one corner of the first mask, and in a second exposure, printing a second mask that includes another flare pattern corresponding to an opposite corner of the second mask. At a second die position on the substrate, a composite mask pattern based on features of the first mask and the second is printed. The printed patterns are developed and measurements are obtained therefrom. The effect of flare is determined as a function of the measurements.
    • 在光刻中,可以评估由各种曝光工具引起的耀斑的影响。 在一个示例性实施例中,在光刻胶涂覆的基底上的光刻工艺中,存在用于确定火花线对线缩短效果的方法。 该方法包括在基板上的第一裸片位置和第一曝光中,打印包括与第一掩模的一个角相对应的耀斑图案的第一掩模,并且在第二曝光中,打印包括另外的耀斑的第二掩模 图案对应于第二掩模的相对角。 在基板上的第二管芯位置,印刷基于第一​​掩模和第二掩模的特征的复合掩模图案。 显影印刷图案并从中获得测量结果。 火炬的作用是测量的函数。
    • 29. 发明授权
    • Reticle for determining rotational error
    • 用于确定旋转误差的光罩
    • US07442474B2
    • 2008-10-28
    • US11118132
    • 2005-04-29
    • Pierre Leroux
    • Pierre Leroux
    • G03F9/00
    • G03F7/70633G03F9/7003
    • A method for determining rotational error portion of total misalignment error in a stepper. In one embodiment, the method comprises a series of steps in a stepper, starting with the step of receiving a wafer, having a first pattern and an error-free fine alignment target, in the stepper. In another step, the wafer is aligned in the stepper using the error-free fine alignment target. Then a second pattern is created on the wafer overlaying said first pattern. In another step, the rotational error portion of the total misalignment error is determined by measuring the circumferential misalignment between the first pattern and the second pattern.
    • 用于确定步进机中的总失准误差的旋转误差部分的方法。 在一个实施例中,该方法包括步进器中的一系列步骤,从在步进器中接收具有第一图案和无差错精细对准目标的晶片的步骤开始。 在另一步骤中,使用无差错的精细对准靶将晶片对准在步进机中。 然后在覆盖所述第一图案的晶片上产生第二图案。 在另一步骤中,通过测量第一图案和第二图案之间的周向未对准来确定总失准误差的旋转误差部分。