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    • 24. 发明授权
    • Ultrasonic cleaning method, and ultrasonic cleaning apparatus
    • 超声波清洗方法和超声波清洗装置
    • US08512476B2
    • 2013-08-20
    • US12716479
    • 2010-03-03
    • Kimihisa KanekoKunihiko YoshiokaMinoru Imaeda
    • Kimihisa KanekoKunihiko YoshiokaMinoru Imaeda
    • B08B3/12
    • B08B3/12B08B3/048
    • The frequency and power of ultrasonic waves is adjusted to materialize the relation 0.04f−20.0≦P≦0.09f−7.5, wherein f (kHz) is the frequency of the ultrasonic waves and P (W/L) is the power per unit fluid volume obtained by dividing the power (W) of the ultrasonic waves by the volume (L) of a cleaning fluid. The discharge condition of the cleaning fluid by a pump is adjusted such that the proportion (C5) of the brightness of the fluid when 5 seconds has passed since the state wherein both an ultrasonic wave irradiation means and a bubble supply means are concurrently operating to the brightness of the fluid when no bubbles exist in the fluid is 0.75 or less. The coalition and crush of bubbles due to the irradiation of ultrasonic waves are suppressed, and the both actions can be utilized for a long period.
    • 调整超声波的频率和功率,以实现0.04f-20.0 @ P @ 0.09f-7.5的关系,其中f(kHz)是超声波的频率,P(W / L)是每单位流体的功率 通过将超声波的功率(W)除以清洁液体积(L)而获得的体积。 调整清洗液的排出状态,使得当从超声波照射装置和气泡供给装置两者同时操作到另一个状态时,经过5秒的流体的亮度的比例(C5) 液体中没有气泡时流体的亮度为0.75以下。 抑制由于超声波照射引起的气泡的联合和粉碎,并且这两种动作可以长时间使用。
    • 25. 发明授权
    • Apparatus for mass-producing silicon-based thin film and method for mass-producing silicon-based thin film
    • 用于批量生产硅基薄膜的装置和用于批量生产硅基薄膜的方法
    • US07927982B2
    • 2011-04-19
    • US12411528
    • 2009-03-26
    • Minoru ImaedaYuichiro ImanishiTakao Saito
    • Minoru ImaedaYuichiro ImanishiTakao Saito
    • H01L21/00H01L21/31H01L21/469
    • H01J37/32027C23C14/566C23C16/4401C23C16/54H01J37/32018H01J37/32045H01J37/32568
    • A silicon-based thin film mass-producing apparatus, including transparent electrodes placed to face in parallel to corresponding counter electrodes with a space therebetween, and silicon-based thin films are deposited on the transparent electrodes by feeding a raw material gas for depositing the silicon-based thin films into the chamber and by applying a DC pulse voltage to the counter electrodes to generate plasma. Unlike methods in which a radio frequency voltage is intermittently applied to perform discharge, a high plasma density distribution does not occur, and in-plane film thickness distribution does not occur. Furthermore, since the DC pulse voltage rises sharply, the ON period can be shortened. As a result, generation of a sheath ceases in the transient state before reaching the steady state, and the thickness of the sheath is small, which allows the space between the counter and transparent electrodes to decrease.
    • 通过供给用于沉积硅的原料气体,在透明电极上沉积硅基薄膜质量产生装置,其包括与其间具有空间的相应对置电极平行放置的透明电极和硅基薄膜 的薄膜进入室,并通过向对电极施加DC脉冲电压以产生等离子体。 不同于间歇地施加射频电压以进行放电的方法,不会发生高等离子体密度分布,并且不会发生面内膜厚分布。 此外,由于直流脉冲电压急剧上升,因此能够缩短接通时间。 结果,在达到稳定状态之前,鞘的产生在瞬态停止,并且护套的厚度小,这允许计数器和透明电极之间的空间减小。
    • 27. 发明授权
    • Method and apparatus for manufacturing group III nitride crystals
    • 制造III族氮化物晶体的方法和装置
    • US07833346B2
    • 2010-11-16
    • US11685933
    • 2007-03-14
    • Minoru ImaedaYoshimasa KondoIchiro Okazaki
    • Minoru ImaedaYoshimasa KondoIchiro Okazaki
    • C30B19/00C30B7/00C30B28/06
    • C30B29/403C30B7/00C30B9/10C30B19/02Y10T117/1032
    • There is provided a group III nitride crystal growth method capable of obtaining a material which is a GaN substrate of low defect density capable of being used as a power semiconductor substrate and in which characteristics of n-type and p-type requested for formation of transistor or the like. A growth method of group III nitride crystals includes: forming a mixed melt containing at least group III element and a flux formed of at least one selected from the group consisting of-alkaline metal and alkaline earth metal, in a reaction vessel; and growing group III nitride crystals from the mixed melt and a substance containing at least nitrogen, wherein after immersing a plurality of seed crystal substrates placed in an upper part of the reaction vessel in which the mixed melt is formed, into the mixed melt to cause crystal growth, the plurality of seed crystal substrates are pulled up above the mixed melt.
    • 提供了能够获得能够用作功率半导体衬底的低缺陷密度的GaN衬底的材料的III族氮化物晶体生长方法,其中形成晶体管所需的n型和p型的特性 或类似物。 III族氮化物晶体的生长方法包括:在反应容器中形成含有至少III族元素的混合熔体和由选自碱金属和碱土金属的至少一种形成的焊剂; 和来自混合熔体的III族氮化物晶体和至少含有氮的物质,其中将放置在其中形成混合熔体的反应容器的上部的多个晶种衬底浸入混合熔体中,使得 晶体生长,将多个晶种基板拉高到混合熔体上方。
    • 30. 发明授权
    • Method of processing a substrate made of a ferroelectric single crystalline material
    • 处理由铁电单晶材料制成的基板的方法
    • US06687448B2
    • 2004-02-03
    • US09250190
    • 1999-02-16
    • Makoto IwaiTatsuo KawaguchiMinoru Imaeda
    • Makoto IwaiTatsuo KawaguchiMinoru Imaeda
    • G02B610
    • G02B6/1345G02F1/3558G02F1/3775
    • A method of processing a substrate made of a ferroelectric single crystalline material, including the steps of forming a desired proton-exchanged layer in the substrate by proton-exchanging a portion of the substrate, and selectively removing the proton-exchanged layer to form a concave ditch structure in the ferroelectric single crystalline substrate, wherein the desired proton-exchange layer is formed by using an acid containing a lithium salt as a proton-exchanging source, the surface of the substrate from which the concave ditch structure is formed is an X-cut surface or a Z-cut surface, as a main surface, of the ferroelectric single crystalline material used as the substrate, and the concave ditch structure has a recessed portion with its depth equal to or larger than its half opening width.
    • 一种处理由铁电单晶材料制成的衬底的方法,包括以下步骤:通过质子交换衬底的一部分在衬底中形成所需的质子交换层,并选择性地除去质子交换层以形成凹陷 铁电单晶衬底中的沟槽结构,其中通过使用含有锂盐作为质子交换源的酸形成所需的质子交换层,形成凹沟结构的衬底的表面是X射线, 切割面或作为基板的铁电单晶材料的主表面的Z切割面,并且凹沟结构具有深度等于或大于其半开口宽度的凹部。