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    • 21. 发明申请
    • SELF ALIGNED STRUCTURES AND DESIGN STRUCTURE THEREOF
    • 自对准结构及其设计结构
    • US20130168822A1
    • 2013-07-04
    • US13343287
    • 2012-01-04
    • William F. CLARK, JR.John J. PEKARIKYun SHIYanli ZHANG
    • William F. CLARK, JR.John J. PEKARIKYun SHIYanli ZHANG
    • H01L29/732G06F17/50H01L21/331
    • H01L29/66272H01L21/8249H01L21/84H01L27/1203H01L29/732
    • Vertical bipolar junction structures, methods of manufacture and design structures. The method includes forming one or more sacrificial structures for a bipolar junction transistor (BJT) in a first region of a chip. The method includes forming a mask over the one or more sacrificial structures. The method further includes etching an opening in the mask, aligned with the one or more sacrificial structures. The method includes forming a trench through the opening and extending into diffusion regions below the one or more sacrificial structures. The method includes forming a base region of the BJT by depositing an epitaxial material in the trench, in contact with the diffusion regions. The method includes forming an emitter contact by depositing a second epitaxial material on the base region within the trench. The epitaxial material for the emitter region is of an opposite dopant type than the epitaxial material of the base region.
    • 垂直双极结结构,制造方法和设计结构。 该方法包括在芯片的第一区域中形成用于双极结型晶体管(BJT)的一个或多个牺牲结构。 该方法包括在一个或多个牺牲结构上形成掩模。 该方法还包括蚀刻掩模中与该一个或多个牺牲结构对准的开口。 该方法包括通过该开口形成沟槽并延伸到一个或多个牺牲结构下方的扩散区域中。 该方法包括通过在沟槽中沉积与扩散区接触的外延材料来形成BJT的基极区域。 该方法包括通过在沟槽内的基极区域上沉积第二外延材料来形成发射极接触。 用于发射极区域的外延材料具有与基极区域的外延材料相反的掺杂剂类型。
    • 22. 发明授权
    • Method and apparatus for improving integrated circuit device performance using hybrid crystal orientations
    • 使用混合晶体取向提高集成电路器件性能的方法和装置
    • US07666720B2
    • 2010-02-23
    • US12100615
    • 2008-04-10
    • John J. PekarikXudong Wang
    • John J. PekarikXudong Wang
    • H01L21/8234
    • H01L21/823807H01L29/045
    • A method of forming a current mirror device for an integrated circuit includes configuring a reference current source; forming a first field effect transistor (FET) in series with the reference current source, the first FET of a first conductivity type formed on a first portion of a substrate having a first crystal lattice orientation; and forming a second FET of the first conductivity type on a second portion of the substrate having a second crystal lattice orientation, with a gate terminal of the first FET coupled to a gate terminal of the second FET, and the gate terminals of the first and second FETs coupled to the reference current source; wherein the carrier mobility of the first FET formed on the first portion of the substrate is different than the carrier mobility of the second FET formed on the second portion of the substrate.
    • 形成用于集成电路的电流镜装置的方法包括:配置参考电流源; 形成与参考电流源串联的第一场效应晶体管(FET),形成在具有第一晶格取向的衬底的第一部分上的第一导电类型的第一FET; 以及在具有第二晶格取向的衬底的第二部分上形成具有第一导电类型的第二FET,其中第一FET的栅极端耦合到第二FET的栅极端子,以及第一FET的栅极端子 耦合到参考电流源的第二FET; 其中形成在衬底的第一部分上的第一FET的载流子迁移率不同于形成在衬底的第二部分上的第二FET的载流子迁移率。
    • 23. 发明授权
    • Integrated circuit having pairs of parallel complementary FinFETs
    • 具有成对的并联互补FinFET的集成电路
    • US07517806B2
    • 2009-04-14
    • US11186748
    • 2005-07-21
    • Andres BryantWilliam F. Clark, Jr.David M. FriedMark D. JaffeEdward J. NowakJohn J. PekarikChristopher S. Putnam
    • Andres BryantWilliam F. Clark, Jr.David M. FriedMark D. JaffeEdward J. NowakJohn J. PekarikChristopher S. Putnam
    • H01L21/302
    • H01L21/84H01L21/3086H01L21/3088H01L21/823821H01L27/1203H01L29/66795H01L29/785Y10S438/947
    • A method and structure for an integrated circuit structure that utilizes complementary fin-type field effect transistors (FinFETs) is disclosed. The invention has a first-type of FinFET which includes a first fin, and a second-type of FinFET which includes a second fin running parallel to the first fin. The invention also has an insulator fin positioned between the source/drain regions of the first first-type of FinFET and the second-type of FinFET. The insulator fin has approximately the same width dimensions as the first fin and the second fin, such that the spacing between the first-type of FinFET and the second-type of FinFET is approximately equal to the width of one fin. The invention also has a common gate formed over channel regions of the first-type of FinFET and the second-type of FinFET. The gate includes a first impurity doping region adjacent the first-type of FinFET and a second impurity doping region adjacent the second-type of FinFET. The differences between the first impurity doping region and the second impurity doping region provide the gate with different work functions related to differences between the first-type of FinFET and the second-type of FinFET. The first fin and the second fin have approximately the same width.
    • 公开了利用互补翅片型场效应晶体管(FinFET)的集成电路结构的方法和结构。 本发明具有包括第一鳍片的第一类型的FinFET和包括与第一鳍片平行的第二鳍片的第二类型的FinFET。 本发明还具有位于第一第一类型FinFET的源极/漏极区域和第二类型FinFET之间的绝缘体鳍片。 绝缘体鳍片具有与第一鳍片和第二鳍片大致相同的宽度尺寸,使得第一类型的FinFET和第二类型的FinFET之间的间隔大致等于一个鳍片的宽度。 本发明还具有形成在第一类型FinFET和第二类型FinFET的沟道区上的公共栅极。 栅极包括与第一类型的FinFET相邻的第一杂质掺杂区域和与第二类型的FinFET相邻的第二杂质掺杂区域。 第一杂质掺杂区域和第二杂质掺杂区域之间的差异为栅极提供与第一类型FinFET和第二类型FinFET之间的差异有关的不同功函数。 第一鳍片和第二鳍片具有大致相同的宽度。
    • 26. 发明授权
    • Self aligned structures and design structure thereof
    • 自对准结构及其设计结构
    • US08552532B2
    • 2013-10-08
    • US13343287
    • 2012-01-04
    • William F. Clark, Jr.John J. PekarikYun ShiYanli Zhang
    • William F. Clark, Jr.John J. PekarikYun ShiYanli Zhang
    • H01L29/1004
    • H01L29/66272H01L21/8249H01L21/84H01L27/1203H01L29/732
    • Vertical bipolar junction structures, methods of manufacture and design structures. The method includes forming one or more sacrificial structures for a bipolar junction transistor (BJT) in a first region of a chip. The method includes forming a mask over the one or more sacrificial structures. The method further includes etching an opening in the mask, aligned with the one or more sacrificial structures. The method includes forming a trench through the opening and extending into diffusion regions below the one or more sacrificial structures. The method includes forming a base region of the BJT by depositing an epitaxial material in the trench, in contact with the diffusion regions. The method includes forming an emitter contact by depositing a second epitaxial material on the base region within the trench. The epitaxial material for the emitter region is of an opposite dopant type than the epitaxial material of the base region.
    • 垂直双极结结构,制造方法和设计结构。 该方法包括在芯片的第一区域中形成用于双极结型晶体管(BJT)的一个或多个牺牲结构。 该方法包括在一个或多个牺牲结构上形成掩模。 该方法还包括蚀刻掩模中与该一个或多个牺牲结构对准的开口。 该方法包括通过该开口形成沟槽并延伸到一个或多个牺牲结构下方的扩散区域中。 该方法包括通过在沟槽中沉积与扩散区接触的外延材料来形成BJT的基极区域。 该方法包括通过在沟槽内的基极区域上沉积第二外延材料来形成发射极接触。 用于发射极区域的外延材料具有与基极区域的外延材料相反的掺杂剂类型。