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21. 发明授权

US07808086B2 Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof 有权
标题翻译：引线框及其制造方法以及半导体装置及其制造方法
公开(公告)号：US07808086B2
公开(公告)日：2010-10-05
申请号：US12129297
申请日：2008-05-29
申请人： Akimi Saiki , Hiroyuki Shoji , Gousuke Takahashi , Noriyuki Hasegawa , Fumio Takano , Kouji Sato
发明人： Akimi Saiki , Hiroyuki Shoji , Gousuke Takahashi , Noriyuki Hasegawa , Fumio Takano , Kouji Sato
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L21/4842 , H01L21/561 , H01L23/49503 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/27013 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/181 , Y10T29/49121 , H01L2224/83 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
摘要翻译：本发明包括安装半导体元件的多个安装部分，安装在每个安装部分上的半导体元件电连接的多个电极，连接多个安装部分的角部分和其具有支撑安装部的悬挂引线片和连接多个电极的电极连接片，以及具有形成在引线框架的厚度方向上的凹部的半冲切部和形成在引线框的厚度方向上的突起对应于凹部，并且被密封半导体元件的密封树脂材料覆盖。用于在形成半冲切部的情况下分散应力的应力分散部设置在角部。

22. 发明申请

US20100090604A1 LED DRIVE CIRCUIT, LED ILLUMINATION COMPONENT, LED ILLUMINATION DEVICE, AND LED ILLUMINATION SYSTEM 有权
标题翻译： LED驱动电路，LED照明组件，LED照明装置和LED照明系统
公开(公告)号：US20100090604A1
公开(公告)日：2010-04-15
申请号：US12539241
申请日：2009-08-11
申请人： Yasuhiro Maruyama , Hiroyuki Shoji , Mitsuru Mariyama , Masakazu Ikeda , Hirohisa Warita , Katsumi Inaba , Naoki Fukunaga
发明人： Yasuhiro Maruyama , Hiroyuki Shoji , Mitsuru Mariyama , Masakazu Ikeda , Hirohisa Warita , Katsumi Inaba , Naoki Fukunaga
IPC分类号： H05B37/02
CPC分类号： H05B33/0815 , H05B33/0803 , H05B33/0824
摘要： An LED drive circuit is an LED dive circuit that receives an alternating voltage to drive an LED, and includes a current remove portion that removes a current from a current supply line that supplies an LED drive current to the LED. If an input current to the LED drive circuit is an unnecessary current, the LED does not light because of current removal by the current remove portion. If the input current to the LED drive circuit turns into the LED drive current from the unnecessary current, the current remove portion decreases the amount of current removed.
摘要翻译： LED驱动电路是接收交流电压以驱动LED的LED潜水电路，并且包括电流去除部分，该电流去除部分从电流供应线路去除LED驱动电流到LED的电流。如果到LED驱动电路的输入电流是不需要的电流，则由于电流去除部分的电流去除，LED不亮。如果LED驱动电路的输入电流从不需要的电流变成LED驱动电流，则电流去除部分减少去除的电流量。

23. 发明申请

US20080296746A1 LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF 有权
标题翻译：引导框架及其制造方法及其半导体装置及其制造方法
公开(公告)号：US20080296746A1
公开(公告)日：2008-12-04
申请号：US12129297
申请日：2008-05-29
申请人： Akimi SAIKI , Hiroyuki SHOJI , Gousuke TAKAHASHI , Noriyuki HASEGAWA , Fumio TAKANO , Kouji SATO
发明人： Akimi SAIKI , Hiroyuki SHOJI , Gousuke TAKAHASHI , Noriyuki HASEGAWA , Fumio TAKANO , Kouji SATO
IPC分类号： H01L23/495 , H01R43/00 , H01L21/56
CPC分类号： H01L23/49548 , H01L21/4842 , H01L21/561 , H01L23/49503 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/27013 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/181 , Y10T29/49121 , H01L2224/83 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
摘要翻译：本发明包括安装半导体元件的多个安装部分，安装在每个安装部分上的半导体元件电连接的多个电极，连接多个安装部分的角部分和其具有支撑安装部的悬挂引线片和连接多个电极的电极连接片，以及具有形成在引线框架的厚度方向上的凹部的半冲切部和形成在引线框的厚度方向上的突起对应于凹部，并且被密封半导体元件的密封树脂材料覆盖。用于在形成半冲切部的情况下分散应力的应力分散部设置在角部。

24. 发明申请

US20080079407A1 PWM Signal Generating Circuit and Power Supply Apparatus Comprising Such PWM Signal Generating Circuit 有权
标题翻译：包括这种PWM信号发生电路的PWM信号发生电路和电源设备
公开(公告)号：US20080079407A1
公开(公告)日：2008-04-03
申请号：US11865743
申请日：2007-10-02
申请人： Takae Shimada , Fumikazu Takahashi , Hiroyuki Shoji , Yoshihide Takahashi , Wataru Mochizuki
发明人： Takae Shimada , Fumikazu Takahashi , Hiroyuki Shoji , Yoshihide Takahashi , Wataru Mochizuki
IPC分类号： G05F1/40
CPC分类号： H03K7/08
摘要： To provide a power supply apparatus having high control resolution of an output power. A PWM signal generating circuit includes: a non-inverting element 31, and an inverting element 32; and further includes a counter 11 for performing count operation in response to rising of a clock signal, a counter 12 for performing count operation in response to falling of the clock signal, comparison circuits 21, 22, and a multiplexer 20. These circuit elements are controlled by PWM control means 10. As another circuit element, the PWM signal generating circuit includes a logical sum element 33. The PWM signal generating circuit serves to arbitrarily change both period and logic “H” time of a PWM signal to be outputted at a time interval which is one half of the clock period. Thus, there is provided a power supply apparatus in which resolution of a PWM signal has been improved within a broad duty range, and fine control of an output power has been performed within a broad output power range.
摘要翻译：提供具有输出功率的高控制分辨率的电源装置。 PWM信号发生电路包括：非反相元件31和反相元件32; 并且还包括用于响应于时钟信号的上升执行计数操作的计数器11，用于响应于时钟信号的下降执行计数操作的计数器12，比较电路21,22和多路复用器20.这些电路元件由PWM控制装置10控制。作为另一个电路元件，PWM信号产生电路包括逻辑和元件33.WPM信号发生电路用于任意地改变要在a输出的PWM信号的周期和逻辑“H”时间时间间隔是时钟周期的一半。因此，提供了一种在广泛的占空比范围内改善了PWM信号的分辨率并且在宽输出功率范围内执行输出功率的精细控制的电源装置。

25. 发明授权

US07268611B2 Semiconductor device and memory card using same 有权
标题翻译：半导体器件和存储卡使用相同
公开(公告)号：US07268611B2
公开(公告)日：2007-09-11
申请号：US10524087
申请日：2003-08-08
申请人： Mutsumi Kikuchi , Noboru Akiyama , Hiroyuki Shoji , Fumio Murabayashi , Akihiko Kanouda , Takashi Sase , Koji Tateno
发明人： Mutsumi Kikuchi , Noboru Akiyama , Hiroyuki Shoji , Fumio Murabayashi , Akihiko Kanouda , Takashi Sase , Koji Tateno
IPC分类号： G05F1/10
CPC分类号： G11C5/147 , H01L27/0688 , H01L27/08 , H02M3/156 , H02M2001/007
摘要： A semiconductor device capable of achieving downsizing without reducing the power supply efficiency and capable of reducing switching noises and a memory card using the same are disclosed. The device comprises a plurality of stages of voltage booster circuits for potentially raising a power supply voltage up to a final output voltage, a voltage control unit for controlling an output voltage at a nearby location of the final stage, and one or more internal elements to which the final output voltage is supplied. A primary voltage booster circuit at the first stage includes an inductance element, a switching element, a diode and a driver circuit. At a metal core part of the inductance element, a metal wiring line is used, which was formed by use of a fabrication process of semiconductor integrated circuits, while employing for its core part an inter-wiring layer dielectric film that was formed using the fabrication process. In addition, the switching element and the diode are arranged so that portions thereof are disposed beneath the inductance element.
摘要翻译：公开了能够实现小型化而不降低电源效率并且能够降低开关噪声的半导体器件和使用其的存储卡。该装置包括用于潜在地提高最终输出电压的电源电压的多级升压电路，用于控制最后级的附近位置处的输出电压的电压控制单元和一个或多个内部元件其提供最终输出电压。第一级的初级升压电路包括电感元件，开关元件，二极管和驱动器电路。在电感元件的金属芯部分，使用通过使用半导体集成电路的制造工艺形成的金属布线，同时使用其核心部分使用该制造形成的布线层电介质膜处理。此外，开关元件和二极管被布置成使得其部分设置在电感元件下方。

26. 发明授权

US07234231B2 Method of manufacturing a lead frame 有权
标题翻译：制造引线框架的方法
公开(公告)号：US07234231B2
公开(公告)日：2007-06-26
申请号：US10974910
申请日：2004-10-28
申请人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： H01R43/00
CPC分类号： H01L23/49565 , H01L21/4842 , H01L24/45 , H01L24/48 , H01L25/167 , H01L31/12 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/01038 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/3025 , Y10T29/49117 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/5111 , H01L2924/00014 , H01L2924/00012
摘要： A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the tie bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames, in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.
摘要翻译：光耦合装置的制造方法包括：准备细长的引线框架，多个连接杆放置在一对侧轨之间，所述多个连接杆彼此平行地彼此平行，以便与多个的引线端子以交错的形式被放置成正交地穿过连接杆，并且横向地切割细长的引线框架以制备多个带状引线框架，使得一个每个连接条的每个侧轨的切割端的长度大于从每个连接条引导端子的突出长度。

27. 发明授权

US07187073B2 Resin-molded package with cavity structure 失效
标题翻译：具有腔体结构的树脂模制包装
公开(公告)号：US07187073B2
公开(公告)日：2007-03-06
申请号：US11186794
申请日：2005-07-22
申请人： Hiroyuki Shoji
发明人： Hiroyuki Shoji
IPC分类号： H01L23/12
CPC分类号： H01L23/10 , H01L23/49861 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/16152 , H01L2924/16315 , H01L2924/30107 , Y10S206/832 , H01L2224/45015 , H01L2924/207
摘要： A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap defining a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.
摘要翻译：包装包括：具有脊状周边部分和由脊状周边部分限定的中心部分的基底。半导体芯片安装在中心部分上。多个引线电耦合到半导体芯片并从中心部分向外穿透基板。封装还包括限定容纳半导体芯片的空腔的盖。盖具有与脊状周边部的基板接合面接合的盖接合面。盖接合面和基板接合面的水平高于中央部。

28. 发明申请

US20060176719A1 Soft switching DC-DC converter 失效
标题翻译：软开关DC-DC转换器
公开(公告)号：US20060176719A1
公开(公告)日：2006-08-10
申请号：US11348348
申请日：2006-02-07
申请人： Junpei Uruno , Hiroyuki Shoji , Akihiko Kanouda , Yasuo Kaminaga
发明人： Junpei Uruno , Hiroyuki Shoji , Akihiko Kanouda , Yasuo Kaminaga
IPC分类号： H02M7/04 , H02M5/42
CPC分类号： H02M3/158 , H02M2001/342 , Y02B70/1425 , Y02B70/1491
摘要： The present invention relates to a soft switching DC-DC converter. A soft switching DC-DC converter comprises a first switching element having a first terminal connected to an input side and having a control terminal for controlling a main electric current; a first diode having a first terminal connected to a second terminal of this first switching element; a primary coil of a transformer having primary and secondary coils, connected to the second terminal of the first switching element; a second diode having a first terminal connected to the first terminal of the first switching element; a second switching element having a first terminal connected to the second terminal of this second diode; and the secondary coil of the transformer, having a first terminal connected to a second terminal of this second switching element, and having a second terminal connected to the second terminal of the first switching element. The soft switching DC-DC converter allows a substantial reduction of the loss in the capacitor operation, by including a resonant circuit composed of a transformer.
摘要翻译：本发明涉及一种软开关DC-DC转换器。软开关DC-DC转换器包括：第一开关元件，其具有连接到输入侧的第一端子，并具有用于控制主电流的控制端子; 第一二极管，具有连接到该第一开关元件的第二端子的第一端子; 变压器的初级线圈，其具有连接到第一开关元件的第二端子的初级和次级线圈; 第二二极管，具有连接到第一开关元件的第一端子的第一端子; 第二开关元件，其具有连接到该第二二极管的第二端子的第一端子; 和变压器的次级线圈，其具有连接到该第二开关元件的第二端子的第一端子，并且具有连接到第一开关元件的第二端子的第二端子。通过包括由变压器组成的谐振电路，软开关DC-DC转换器允许电容器操作中的损耗显着降低。

29. 发明授权

US06270712B1 Molding die and marking method for semiconductor devices 失效
标题翻译：半导体器件的成形模具和标记方法
公开(公告)号：US06270712B1
公开(公告)日：2001-08-07
申请号：US09248142
申请日：1999-02-09
申请人： Hiroyuki Shoji , Kazuo Kusuda , Tsuneo Matsumura
发明人： Hiroyuki Shoji , Kazuo Kusuda , Tsuneo Matsumura
IPC分类号： B29C4502
CPC分类号： B29C45/14655 , B29C33/424 , B29C45/372 , H01L21/565 , H01L23/544 , H01L24/45 , H01L24/48 , H01L31/167 , H01L2223/54406 , H01L2223/54473 , H01L2223/54486 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
摘要： An object of the invention is to eliminate a marking process and shorten the time and decrease the cost required for changing contents of marking. An uneven mask is mounted, using a mask set jig, on a mark surface die of the molding die for forming a resin mold package of a semiconductor device. The mark surface die is formed with jig-fixing grooves for mounting the mask set jig. The uneven mask is formed with protrusions and recesses corresponding to the contents of marking to be attached to the surface of the resin mold package. The contents of marking can thus be attached simultaneously with the molding process, and therefore the marking process after molding can be omitted. In accordance with the contents of marking, the uneven mask can be replaced. The time and cost required for changing the contents of marking can thus be reduced.
摘要翻译：本发明的目的是消除标记过程并缩短时间并降低改变标记内容所需的成本。使用掩模组装夹具将不均匀的掩模安装在用于形成半导体器件的树脂模制包装的成型模具的标记表面模具上。标记面模具形成有用于安装掩模组装夹具的夹具固定槽。不均匀掩模形成有与要附着到树脂模包装表面上的标记内容物相对应的突出部和凹部。因此，标记的内容可以与成型工艺同时附着，因此可以省略成型后的标记处理。根据标记的内容，可以更换不均匀的面膜。因此可以减少改变标记内容所需的时间和成本。

30. 发明申请

US20140191576A1 ELECTRIC STORAGE SYSTEM 审中-公开
标题翻译：电力储存系统
公开(公告)号：US20140191576A1
公开(公告)日：2014-07-10
申请号：US14122616
申请日：2012-05-25
申请人： Mitsutoshi Honda , Masahiro Iwamura , Motoo Futami , Hiroyuki Shoji , Takeshi Inoue
发明人： Mitsutoshi Honda , Masahiro Iwamura , Motoo Futami , Hiroyuki Shoji , Takeshi Inoue
IPC分类号： H02J1/10
CPC分类号： H02J1/102 , H01M10/482 , H02J7/1423 , H02J7/345 , H02M3/158 , Y02T10/7005 , Y02T10/7022 , Y10T307/516
摘要： An electric storage system includes at least two types of electric storage cells. A first electric storage unit is configured from a first electric storage cell, and a second electric storage unit is configured from a second electric storage cell. The first and second electric storage units are electrically connected to each other through a current controlling circuit.
摘要翻译：电存储系统包括至少两种类型的蓄电单元。第一蓄电单元由第一蓄电单元构成，第二蓄电单元由第二蓄电单元构成。第一和第二蓄电单元通过电流控制电路彼此电连接。

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