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    • 21. 发明授权
    • Heterojunction field effect transistor, method for producing heterojunction field effect transistor, and electronic device
    • 异质结场效应晶体管,异质结场效应晶体管的制造方法和电子器件
    • US08674409B2
    • 2014-03-18
    • US13141449
    • 2009-12-25
    • Takashi InoueHironobu MiyamotoKazuki OtaTatsuo NakayamaYasuhiro OkamotoYuji Ando
    • Takashi InoueHironobu MiyamotoKazuki OtaTatsuo NakayamaYasuhiro OkamotoYuji Ando
    • H01L29/66
    • H01L29/7787H01L29/0843H01L29/2003H01L29/41766H01L29/42316H01L29/66462
    • A heterojunction filed effect transistor with a low access resistance, a low on resistance, and the like, a method for producing a heterojunction filed effect transistor and an electron device are provided. In the heterojunction field effect transistor, an electron transit layer 11 formed of a III-nitride semiconductor is formed on a substrate 10, an electron supply layer 12 formed of a III-nitride semiconductor forms a heterojunction with an upper surface of the electron transit layer 11, a gate electrode 14, a source electrode 15A, and a drain electrode 15B are arranged on the electron supply layer 12, n-type conductive layer regions 13A and 13B each extended from an upper part of the electron transit layer 11 to an upper surface of the electron supply layer 12 are provided in at least a part below the source electrode 15A and a part below the drain electrode 15B, and an n-type impurity concentration at a heterojunction interface of an electron transit layer 11 part of each of the n-type conductive layer regions 13A and 13B with the electron supply layer 12 is 1×1020 cm−3 or more.
    • 提供具有低访问阻抗,低导通电阻等的异质结场效应晶体管,提供了异质结场效应晶体管和电子器件的制造方法。 在异质结场效应晶体管中,在衬底10上形成由III族氮化物半导体形成的电子迁移层11,由III族氮化物半导体形成的电子供给层12与电子迁移层的上表面形成异质结 如图11所示,在电子供给层12上配置有栅电极14,源电极15A和漏电极15B,从电子渡越层11的上部延伸到上部的n型导电层区域13A,13B 电子供给层12的表面设置在源电极15A的下方以及漏电极15B的下方的至少一部分以及电子迁移层11的异质界面的n型杂质浓度 具有电子供给层12的n型导电层区域13A,13B为1×1020cm-3以上。
    • 23. 发明授权
    • Storage controller for wear-leveling and compaction and method of controlling thereof
    • 用于磨损平整和压实的存储控制器及其控制方法
    • US08583859B2
    • 2013-11-12
    • US13154203
    • 2011-06-06
    • Yoko MasuoHironobu MiyamotoWataru Okamoto
    • Yoko MasuoHironobu MiyamotoWataru Okamoto
    • G06F12/16
    • G06F12/0246G06F2212/7211
    • According to one embodiment, a storage controller includes a condition storage, a determination module, a wear-leveling block retainer, and a data transfer controller. The condition storage is provided in a storage including a plurality of blocks, and stores block condition information including at least one of erasure time information indicating when data is erased last time and erasure count information indicating the number of times data is erased. The determination module determines whether there is a block that requires wear leveling based on the block condition information. The wear-leveling block retainer retains block identification information that identifies a block determined to require wear leveling. The data transfer controller performs compaction to transfer data stored in blocks of the storage for collecting the data in a block, and, when the block identification information is retained, transfers data stored in the block identified by the block identification information.
    • 根据一个实施例,存储控制器包括条件存储器,确定模块,磨损均衡块保持器和数据传输控制器。 条件存储被提供在包括多个块的存储器中,并且存储包括指示上次擦除数据的擦除时间信息中的至少一个的块条件信息,以及指示擦除次数数据的擦除计数信息。 确定模块基于块条件信息确定是否存在需要磨损均衡的块。 磨损平整块保持器保持块识别信息,其识别确定为需要磨损均匀化的块。 数据传输控制器执行压缩以将存储在存储器块中的数据传送到块中以收集数据,并且当块识别信息被保留时,传送存储在由块识别信息识别的块中的数据。
    • 25. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20130037868A1
    • 2013-02-14
    • US13548078
    • 2012-07-12
    • Yasuhiro OkamotoTatsuo NakayamaTakashi InoueHironobu Miyamoto
    • Yasuhiro OkamotoTatsuo NakayamaTakashi InoueHironobu Miyamoto
    • H01L29/78H01L21/20
    • H01L29/7787H01L21/02458H01L21/0254H01L29/2003H01L29/205H01L29/41775H01L29/4236H01L29/66462H01L29/7786
    • A semiconductor device includes: a first nitride semiconductor layer; a second nitride semiconductor layer formed over the first nitride semiconductor layer; and a gate electrode facing the second nitride semiconductor layer via a gate insulating film. Because the second nitride semiconductor layer is formed by stacking plural semiconductor layers with their Al composition ratios different from each other, the Al composition ratio of the second nitride semiconductor layer changes stepwise. The semiconductor layers forming the second nitride semiconductor layer are polarized in the same direction so that, among the semiconductor layers, a semiconductor layer nearer to the gate electrode has higher (or lower) intensity of polarization. In other words, the intensities of polarization of the semiconductor layers change with an inclination based on their distances from the gate electrode so that, at each interface between two semiconductor layers, the amount of negative charge becomes larger than that of positive charge.
    • 半导体器件包括:第一氮化物半导体层; 形成在第一氮化物半导体层上的第二氮化物半导体层; 以及经由栅极绝缘膜与第二氮化物半导体层相对的栅电极。 由于第二氮化物半导体层通过堆叠其Al组成比彼此不同的多个半导体层而形成,所以第二氮化物半导体层的Al组成比逐步变化。 形成第二氮化物半导体层的半导体层在相同的方向上极化,使得在半导体层中,更靠近栅电极的半导体层具有较高(或更低)的极化强度。 换句话说,半导体层的极化强度随着与栅电极的距离的倾斜而变化,使得在两个半导体层之间的每个界面处,负电荷的量变得大于正电荷的量。
    • 27. 发明申请
    • SEMICONDUCTOR DEVICE AND FIELD EFFECT TRANSISTOR
    • 半导体器件和场效应晶体管
    • US20120199889A1
    • 2012-08-09
    • US13393002
    • 2010-06-23
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • H01L29/78
    • H01L29/8122H01L29/0657H01L29/2003H01L29/201H01L29/205H01L29/41741H01L29/41766H01L29/4236H01L29/7809H01L29/7812H01L29/7813H01L29/8128
    • Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased.A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.
    • 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。