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11. 发明申请

US20030161123A1 BONDING STRUCTURE FOR BONDING SUBSTRATES BY METAL STUDS 审中-公开
标题翻译：通过金属焊接结合基板的结合结构
公开(公告)号：US20030161123A1
公开(公告)日：2003-08-28
申请号：US10248405
申请日：2003-01-16
发明人： Ho-Ming Tong , Chun-Chi Lee , Jen-Kuang Fang , Min-Lung Huang , Jau-Shoung Chen , Ching-Huei Su , Chao-Fu Weng , Yung-Chi Lee , Yu-Chen Chou , Tsung-Hua Wu , Su Tao
IPC分类号： H05K007/10 , H05K007/12
CPC分类号： H05K7/1061 , H05K3/321 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/0415 , Y02P70/613
摘要： A bonding structure for bonding two substrates by a metal stud includes a first substrate, a second substrate, at least a metal stud and an adhesive. The bonding structure includes a first substrate, a second substrate, at least a metal stud and an adhesive. The metal stud is arranged between the first substrate and the second substrate and attached to the first substrate. The adhesive is applied between the metal stud and the second substrate to electrically connect the metal stud and the second substrate.
摘要翻译：用于通过金属螺柱键合两个基板的接合结构包括第一基板，第二基板，至少金属螺柱和粘合剂。接合结构包括第一基板，第二基板，至少金属螺柱和粘合剂。金属螺柱布置在第一基板和第二基板之间并且附接到第一基板。粘合剂被施加在金属螺柱和第二基板之间以电连接金属螺柱和第二基板。

12. 发明申请

US20030102558A1 Vertical surface mount package utilizing a back-to-back semiconductor device module 失效
公开(公告)号：US20030102558A1
公开(公告)日：2003-06-05
申请号：US10340769
申请日：2003-01-09
发明人： Larry D. Kinsman
IPC分类号： H05K007/12 , H01L023/32
CPC分类号： H01L25/0657 , H01L2225/06517 , H01L2225/0652 , H01L2225/06551 , H01L2225/06555 , H01L2225/06575 , H01L2225/06582 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , Y10T29/49126 , H01L2924/00
摘要： A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the device module. The device module may be secured to a carrier substrate in a substantially perpendicular orientation relative to the former. Solder reflow or a module-securing device can secure the device module to the carrier substrate. An embodiment of a module-securing device comprises an alignment device having one or more receptacles formed therein and intermediate conductive elements that are disposed within the receptacles to establish an electrical connection between the semiconductor devices and the carrier substrate. Another module-securing device comprises a clip-on lead, where one end resiliently biases against a lead of at least one of the semiconductor devices, while the other end connects electrically to a carrier substrate terminal.

13. 发明申请

US20030063447A1 Low inductance multiple resistor EC capacitor pad 失效
公开(公告)号：US20030063447A1
公开(公告)日：2003-04-03
申请号：US10261304
申请日：2002-09-30
申请人： International Business Machines Corporation
发明人： Manfred Cwik , Harald Pross , Rene Frank Schrottenholzer
IPC分类号： H05K007/10 , H05K007/12
CPC分类号： H05K7/1092 , H05K1/0292 , H05K1/0298 , H05K1/113 , H05K2201/09809 , H05K2201/10022 , H05K2201/10356 , H05K2201/10636 , Y02P70/611
摘要： According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.

14. 发明申请

US20020172024A1 Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged 有权
标题翻译：用于封装将半导体管芯连接到衬底的中间导电元件和如此封装的半导体器件的方法
公开(公告)号：US20020172024A1
公开(公告)日：2002-11-21
申请号：US09916197
申请日：2001-07-27
发明人： Chong Chin Hui , Lee Kian Chai , Jason Pittam
IPC分类号： H05K007/10 , H05K007/12
CPC分类号： H01L23/3128 , H01L21/56 , H01L23/13 , H01L23/4985 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A method for packaging semiconductor device assemblies. An assembly is formed which includes a semiconductor die, a tape positioned over the active surface of the die, and a substrate element positioned on an opposite side of the tape from the die. Bond pads of the die are exposed through a slot formed through the tape and an aligned an opening formed through the substrate element facilitate the extension of intermediate conductive elements from the bond pads and through the slot and opening, to corresponding contact areas on the substrate element. One or both ends of the slot extend beyond an outer periphery of the die to facilitate introduction of an encapsulant material into a channel or receptacles defined by the slot, opening, and active surface of the semiconductor die. Prior to encapsulation, the side of the opening of the substrate element is sealed opposite the tape with a coverlay to contain the encapsulant material within the channel or receptacle. Assemblies and packages formed by the method are also disclosed.
摘要翻译：一种用于封装半导体器件组件的方法。形成了一个组件，其包括半导体管芯，位于管芯的有效表面上的带以及位于与管芯相反的带的相对侧上的衬底元件。管芯的接合焊盘通过穿过带形成的槽露出，并且通过衬底元件形成的对准的开口促使中间导电元件从接合焊盘延伸并且通过槽和开口延伸到衬底元件上的对应的接触区域。槽的一端或两端延伸超过管芯的外周，以便于将密封剂材料引入由半导体管芯的槽，开口和有源表面限定的通道或插座中。在封装之前，衬底元件的开口侧面用带有覆盖层的带密封，以将密封剂材料容纳在通道或容器内。还公开了通过该方法形成的组件和封装。

15. 发明申请

US20040141298A1 Ball grid array package construction with raised solder ball pads 有权
标题翻译：球栅阵列封装结构，凸起焊球垫
公开(公告)号：US20040141298A1
公开(公告)日：2004-07-22
申请号：US10346277
申请日：2003-01-16
申请人： International Business Machines Corporation
发明人： Paul Marlan Harvey
IPC分类号： H05K007/10 , H05K007/12
CPC分类号： H01L23/49816 , H01L25/0657 , H01L2224/16225 , H01L2225/06513 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K3/3457 , H05K3/4652 , H05K2201/098 , H05K2201/0989 , Y02P70/611 , H01L2224/0401
摘要： The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductive layer, the raised pad having a raised face and a plurality of vertical conductive walls and a BGA solder ball having an average diameter of greater than the width of the raised face, the BGA solder ball being adhered to the raised face and to a substantial portion of the vertical conductive walls.
摘要翻译：本发明提供了一种BGA焊球与具有下层电路层的叠层电路组件的外导电层的互连。本发明包括与外部导电层基本上共面的升高的BGA焊球垫，凸起垫具有凸起面和多个垂直导电壁以及具有大于凸起宽度的平均直径的BGA焊球 BGA焊球粘附到凸起面和垂直导电壁的大部分上。

16. 发明申请

US20030214795A1 Electronic component with bump electrodes, and manufacturing method thereof 有权
标题翻译：具有凸块电极的电子部件及其制造方法
公开(公告)号：US20030214795A1
公开(公告)日：2003-11-20
申请号：US10434151
申请日：2003-05-09
申请人： FUJITSU LIMITED
发明人： Seiki Sakuyama
IPC分类号： H05K007/10 , H05K007/12
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/0401 , H01L2224/05147 , H01L2224/05541 , H01L2224/05557 , H01L2224/05567 , H01L2224/05571 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05618 , H01L2224/0562 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/11334 , H01L2224/1147 , H01L2224/11902 , H01L2224/13005 , H01L2224/13006 , H01L2224/13022 , H01L2224/13099 , H01L2224/13109 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/111 , H05K3/243 , H05K3/3452 , H05K3/3473 , H05K3/3478 , H05K7/1061 , H05K2201/09736 , H05K2203/043 , H05K2203/0568 , H05K2203/0571 , H05K2203/0577 , Y02P70/611 , Y10T29/49147 , Y10T29/49149 , H01L2924/207 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2924/00014 , H01L2924/013
摘要： An electronic component with bump electrodes includes a surface-protecting insulating film of adequate thickness and bump elements of adequate height, and allows the occurrence of open defects in the manufacturing process to be appropriately reduced. An electronic component with bump electrodes (X1) includes a substrate (11), electrode pads (12) provided on the substrate (11), an insulating film (13) that has openings (13a) in correspondence with the electrode pads (12) and is laminated and formed on the substrate (11), electroconductive connecting elements (14) provided on the electrode pads (12) in the openings (13a), and bump elements (15) that are in direct contact with the electroconductive connecting elements (14) and project from the openings (13a).
摘要翻译：具有凸起电极的电子部件包括具有足够厚度的表面保护绝缘膜和足够高度的凸起元件，并且允许适当地减少制造工艺中的开放缺陷的发生。具有凸起电极（X1）的电子部件包括基板（11），设置在基板（11）上的电极焊盘（12），具有对应于电极焊盘（12）的开口（13a）的绝缘膜（13）并且层叠并形成在基板（11）上，设置在开口（13a）中的电极焊盘（12）上的导电连接元件（14）和与导电连接元件直接接触的凸块元件（15） 14）并且从开口（13a）突出。

17. 发明申请

US20030202332A1 Second level packaging interconnection method with improved thermal and reliability performance 审中-公开
标题翻译：二级封装互联方法具有改善的热可靠性能
公开(公告)号：US20030202332A1
公开(公告)日：2003-10-30
申请号：US10393238
申请日：2003-03-20
发明人： Tommi Reinikainen , Pirkka Myllykoski
IPC分类号： H05K007/10 , H05K007/12
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2924/0002 , H05K3/3436 , H05K2201/0212 , H05K2201/094 , H05K2201/10234 , Y02P70/613 , H01L2924/00
摘要： Surface mount packages having a plurality of polymer and metallic contacts (e.g., balls) applied thereon and methods of fabricating and utilizing such packages are provided. The polymer balls are employed to improve mechanical compliance of the package; and the metallic (e.g., copper) balls are employed to improve thermal conduction between the package and a substrate to which the package is attached. The polymer balls can be located on a periphery portion of a package where mechanical and thermal stresses are the highest; and the metallic balls can be located on a middle portion of the package. Thus the present invention improves both mechanical stresses and thermal conductivity of a second level packaging interconnection, which in turn improves reliability of an electronic device.
摘要翻译：提供了具有多个聚合物和施加在其上的金属触点（例如球）的表面贴装封装以及制造和利用这种封装的方法。聚合物球用于提高包装的机械顺从性; 并且使用金属（例如铜）球来改善封装与封装所附接的衬底之间的热传导。聚合物球可以位于机械和热应力最高的包装的周边部分上; 并且金属球可以位于包装的中间部分。因此，本发明改进了第二级封装互连的机械应力和导热性，这又提高了电子设备的可靠性。

18. 发明申请

US20030043558A1 Mounting structure of high-frequency wiring board 失效
公开(公告)号：US20030043558A1
公开(公告)日：2003-03-06
申请号：US10228163
申请日：2002-08-26
发明人： Takayuki Shirasaki
IPC分类号： H05K007/10 , H05K007/12
CPC分类号： H05K1/0243 , H01L23/66 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H05K3/3436 , H05K2201/10734 , H01L2224/45015 , H01L2924/207
摘要： The invention is a mounting structure of a high-frequency wiring board in which when a pitch between a conductive connecting member connected to a high-frequency signal electrode pad of a high-frequency wiring board and a conductive connecting member connected to a ground electrode pad adjacent thereto is denoted by A and a maximum diameter of these conductive connecting members in sections parallel to the lower face of the high-frequency wiring board is denoted by B, A/Bnull2 is satisfied, and a space L1 between the lower face of the high-frequency wiring board and the upper face of the external electric circuit board is one sixteenth or less of a wavelength of high-frequency signals processed by a high-frequency semiconductor element.

19. 发明申请

US20020179326A1 Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics 有权
标题翻译：连接器装置和相关方法由具有物理存储特性的材料形成
公开(公告)号：US20020179326A1
公开(公告)日：2002-12-05
申请号：US09870039
申请日：2001-05-30
发明人： Cristian Tabacutu
IPC分类号： H05K007/12 , H05K007/10 , H05K007/06
CPC分类号： H05K3/308 , H01R4/01 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914
摘要： A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of an electrically-conductive material which exhibits physical-memory characteristics. The pin member is initially configured into a memory configuration and thereafter reconfigured into an alternate reconfiguration. The alternate configuration is selected to facilitate mounting of the circuit component upon the substrate. Thereafter, the pin member is heated to beyond a deformation threshold temperature. When at such temperature, the pin member becomes reconfigured into the memory configuration. Through appropriate selection of the memory configuration, heating of the pin member causes connection of the circuit component with the substrate.
摘要翻译：一种用于将电路部件连接到诸如印刷电路板的基板的连接器和相关方法。连接器由具有物理存储特性的导电材料形成的多个销构件中的一个形成。引脚构件最初配置为存储器配置，然后重新配置为备用重新配置。选择替代配置以便于将电路部件安装在基板上。此后，将销构件加热到超过变形阈值温度。当在这样的温度下，销构件被重新配置成存储器配置。通过适当地选择存储器配置，引脚构件的加热导致电路部件与衬底的连接。

20. 发明申请

US20020006035A1 Compact electronic circuit unit having circulator, manufactured with high productivity 失效
标题翻译：具有循环器的紧凑型电子电路单元，生产率高
公开(公告)号：US20020006035A1
公开(公告)日：2002-01-17
申请号：US09904950
申请日：2001-07-12
申请人： Alps Electric Co., Ltd
发明人： Yuichi Shimizu , Nobuhiko Suzuki
IPC分类号： H05K007/02 , H05K007/04 , H05K007/10 , H05K007/12
CPC分类号： H01P1/387 , H05K1/095 , H05K1/165 , H05K1/182 , H05K3/4611 , H05K2201/0187 , H05K2201/086 , H05K2201/09254 , H05K2201/10416 , H05K2203/0545
摘要： An electronic circuit unit having a circulator is formed of a circuit board made by laminating a plurality of dielectric substrates; first, second, and third central conductors disposed at intervals of 120 degrees on a plurality of dielectric substrates and partially intersecting in the upper and lower directions; a magnet and a ferrite member disposed above and below the intersection of the central conductors; a first yoke 10 covering the outside of the magnet; and a second yoke 11 covering the outside of the ferrite member. One end of each of the central conductors serves as an input and output terminal, and the ends are disposed at intervals of 120 degrees. Adjacent input and output terminals are connected by inductive elements.
摘要翻译：具有循环器的电子电路单元由层叠多个电介质基板而制成的电路基板形成，第一中心导体，第二中心导体和第三中心导体，其设置在多个电介质基板上的120度的间隔，并且在上下方向上部分相交; 设置在所述中心导体的交叉点的上方和下方的磁体和铁氧体部件; 覆盖磁体外部的第一磁轭10; 以及覆盖铁氧体部件外侧的第二磁轭11。每个中心导体的一端用作输入和输出端子，并且端部以120度的间隔设置。相邻的输入和输出端子通过电感元件连接。

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