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    • 12. 发明授权
    • Asymmetrical MOS channel structure with drain extension
    • 具有漏极延伸的非对称MOS沟道结构
    • US06534787B2
    • 2003-03-18
    • US09768312
    • 2001-01-23
    • Sheng Teng Hsu
    • Sheng Teng Hsu
    • H01L29786
    • H01L29/66659H01L21/26586H01L21/823807H01L21/84H01L27/1203H01L29/4908H01L29/7835H01L29/78624
    • A method of forming a MOS transistor without a lightly doped drain (LDD) region between the channel region and drain is provided. The channel region and a drain extension are formed from two separate tilted ion implantation processes, after the deposition of the gate electrode. The tilted implantation forms a relatively short channel length, with respect to the length of the gate electrode. The position of the channel is offset, and directly adjoins the source. A second tilted implant process forms a drain extension region under the gate electrode, adjacent the drain. Elimination of LDD areas reduces the number of masking and doping steps required to manufacture a transistor. Further, the drain extension area promotes transistor performance, by eliminating source resistance. At the same time, sufficient doping of the drain extension area insures that the drain resistance through the drain extension remains low. This drain extension acts to more evenly distribute electric fields so that large breakdown voltages are possible. In this manner, larger Id currents and faster switching speeds are obtained. A MOS transistor having a short, offset channel and drain extension formed through dual tilted ion implants is also provided.
    • 提供了一种形成在沟道区和漏极之间没有轻掺杂漏极(LDD)区的MOS晶体管的方法。 在栅电极沉积之后,沟槽区和漏极延伸由两个分开的倾斜离子注入工艺形成。 相对于栅电极的长度,倾斜注入形成相对短的沟道长度。 通道的位置偏移,并直接与源相邻。 第二倾斜注入工艺在栅电极下方形成漏极延伸区域,与漏极相邻。 消除LDD面积减少了制造晶体管所需的掩模和掺杂步骤的数量。 此外,漏极扩展区域通过消除源极电阻来促进晶体管的性能。 同时,漏极扩展区的充分掺杂确保通过漏极延伸的漏极电阻保持较低。 这种漏极扩展用于更均匀地分布电场,使得可以实现大的击穿电压。 以这种方式,获得更大的Id电流和更快的开关速度。 还提供了通过双倾斜离子植入物形成的具有短的偏移沟道和漏极延伸的MOS晶体管。
    • 17. 发明授权
    • Electro-optical device
    • 电光装置
    • US06236064B1
    • 2001-05-22
    • US08470598
    • 1995-06-06
    • Akira MaseMasaaki Hiroki
    • Akira MaseMasaaki Hiroki
    • H01L29786
    • H01L27/124G02F1/13624G02F2001/136245H01L27/1214H01L29/4908
    • A liquid-crystal electro-optical device capable of compensating for the operation of any malfunctioning one of TFTs (thin-film transistors) existing within the device if such a malfunction occurs. Plural complementary TFT configurations are provided per pixel electrode. Each complementary TFT configuration consists of at least one p-channel TFT and at least one n-channel TFT. The input and output terminals of the plural complementary TFT configurations are connected in series. One of the input and output terminals is connected to the pixel electrode, while the other is connected to a first signal line. All the gate electrodes of the p-channel and n-channel TFTs included in said plural complementary TFT configurations are connected to a second signal line.
    • 如果发生这种故障,则能够补偿设备内存在的任何故障的TFT(薄膜晶体管)的操作的液晶电光器件。 每像素电极提供多个互补TFT配置。 每个互补TFT配置由至少一个p沟道TFT和至少一个n沟道TFT组成。 多个互补TFT结构的输入和输出端子串联连接。 输入和输出端之一连接到像素电极,而另一个连接到第一信号线。 包括在所述多个互补TFT配置中的p沟道和n沟道TFT的所有栅电极连接到第二信号线。
    • 19. 发明授权
    • Thin film transistor array and driving circuit structure
    • 薄膜晶体管阵列和驱动电路结构
    • US06818922B2
    • 2004-11-16
    • US10249342
    • 2003-04-02
    • Hsin-Ming Chen
    • Hsin-Ming Chen
    • H01L29786
    • H01L27/1288H01L27/1255
    • A thin film transistor array and driving circuit structure fabricated on a substrate. The structure comprises a plurality of scanning lines, a plurality of signaling lines, a plurality of thin film transistors, a plurality of pixel electrodes, a plurality of storage capacitors and a plurality of CMOS transistors. Each thin film transistor includes a polysilicon layer, a source/drain terminal, an N+ doped thin film, a gate and a gate insulation layer. The polysilicon layer is formed on the substrate and the source/drain terminal is formed over the polysilicon layer. The N+ doped thin film is positioned between the polysilicon layer and the source/drain terminal. The gate is formed over the polysilicon layer and the gate insulation layer is positioned between the polysilicon layer and the gate.
    • 薄膜晶体管阵列和驱动电路结构制造在基板上。 该结构包括多个扫描线,多个信令线,多个薄膜晶体管,多个像素电极,多个存储电容器和多个CMOS晶体管。 每个薄膜晶体管包括多晶硅层,源极/漏极端子,N +掺杂薄膜,栅极和栅极绝缘层。 多晶硅层形成在衬底上,源极/漏极端子形成在多晶硅层上。 N +掺杂的薄膜位于多晶硅层和源极/漏极端子之间。 栅极形成在多晶硅层上,栅极绝缘层位于多晶硅层和栅极之间。