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    • 13. 发明授权
    • CVD of integrated Ta and TaNx films from tantalum halide precursors
    • 来自卤化钽前体的集成Ta和TaNx膜的CVD
    • US06410432B1
    • 2002-06-25
    • US09300632
    • 1999-04-27
    • John J. HautalaJohannes F. M. Westendorp
    • John J. HautalaJohannes F. M. Westendorp
    • C23C1608
    • H01L21/76843C23C16/08C23C16/34
    • A chemical vapor deposition (CVD) method for depositing high quality conformal tantalum/tantalum nitride (Ta/TaNx) bilayer films from inorganic tantalum pentahalide (TaX5) precursors and nitrogen is described. The inorganic tantalum halide precursors are tantalum pentafluoride (TaF5), tantalum pentachloride (TaCl5) and tantalum pentabromide (TaBr5). A TaX5 vapor is delivered into a heated reaction chamber. The vapor is combined with a process gas to deposit a Ta film and a process gas containing nitrogen to deposit a TaNx film on a substrate that is heated to 300° C.-500° C. The deposited Ta/TaNx bilayer film is useful for integrated circuits containing copper films, especially in small high aspect ratio features. The high conformality of these films is superior to films deposited by PVD.
    • 描述了一种用于从无机钽五卤化物(TaX5)前体和氮沉积高质量保形钽/氮化钽(Ta / TaNx)双层膜的化学气相沉积(CVD)方法。 无机卤化钽前体是五氟化钽(TaF5),五氯化钽(TaCl5)和五溴化钽(TaBr5)。 将TaX5蒸气输送到加热的反应室中。 将蒸气与处理气体结合以沉积Ta膜和含有氮的工艺气体,以将TaNx膜沉积在加热至300℃-500℃的基底上。沉积的Ta / TaNx双层膜可用于 包含铜膜的集成电路,特别是在小高宽比特征中。 这些膜的高共形性优于PVD沉积的膜。
    • 14. 发明授权
    • Device and method for preparing and/or coating the surfaces of hollow construction elements
    • 用于制备和/或涂覆中空构造元件表面的装置和方法
    • US06180170B2
    • 2001-01-30
    • US09125655
    • 1998-08-21
    • Valentin GrossmannHorst PillhoeferMartin Thoma
    • Valentin GrossmannHorst PillhoeferMartin Thoma
    • C23C1608
    • C23C10/06C23C10/48Y10S118/10Y10S118/11
    • In a method for preparing and/or coating the surfaces of metallic hollow structural elements that have at least two connection openings between their outer and inner surfaces, first and second reaction gas mixtures (I, II) are prepared by reaction gas sources for treating the outer and inner surfaces of the hollow structural elements. The first reaction gas mixture (I) is guided over the outer surfaces and thereafter over the inner surfaces of the structural elements, and then the second reaction gas mixture (II) is guided over the inner surfaces and thereafter over the outer surfaces of the structural elements. An apparatus for carrying out the method includes a reaction vessel enclosing an outer reaction space, a central holding pipe arranged in the reaction vessel and enclosing an inner space, and hollow support arms removably attached on the holding pipe to extend radially outwardly therefrom. Each structural element is mounted on a hollow support arm so that one of the connection openings communicates with the inner space through the hollow support arm and the other one of the connection openings communicates with the outer reaction space.
    • 在用于制备和/或涂覆在其外表面和内表面之间具有至少两个连接开口的金属中空结构元件的表面的方法中,第一和第二反应气体混合物(I,II)由反应气体源制备,用于处理 中空结构元件的外表面和内表面。 第一反应气体混合物(I)被引导在外表面上,然后在结构元件的内表面上引导,然后第二反应气体混合物(II)被引导到内表面上,然后在结构的外表面上引导 元素。 用于执行该方法的装置包括:包围外部反应空间的反应容器,布置在反应容器中并包围内部空间的中央保持管,以及可拆卸地附接在保持管上的径向向外延伸的中空支撑臂。 每个结构元件安装在中空支撑臂上,使得一个连接开口通过中空支撑臂与内部空间连通,另一个连接开口与外部反应空间连通。