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11. 发明授权

US06379238B1 Finishing and abrasive tool 失效
标题翻译：精加工和研磨工具
公开(公告)号：US06379238B1
公开(公告)日：2002-04-30
申请号：US09851279
申请日：2001-05-08
申请人： Timothy J. J. Beechey , Mark K. Van Voorhis
发明人： Timothy J. J. Beechey , Mark K. Van Voorhis
IPC分类号： B24D1100
CPC分类号： B24D13/085
摘要： A finishing star or spinner abrasive tool is formed of inner and outer packs of square sheets of abrasive cloth or sandpaper with the inner packs angularly offset from the outer packs on the mandrel axis. Each sheet is formed with discontinuous radial slits extending beyond an unslit center section around a center fastener forming the mandrel drive hole. The slits provide surface flexibility while maintaining sheet integrity as it wears to circular form. An optional backing core is provided in the middle of the tool in the form of a cloth-sisal quilt acting as a cushion backing for the sheets, and which may retain coolant or compound during operation. The tool has longer working life with improved flexibility and working characteristics.
摘要翻译：精整星或旋转研磨工具由内层和外包的研磨布或砂纸形成，内层与心轴上的外包件成角度地偏移。每个片材形成有不连续的径向切口，其围绕形成心轴驱动孔的中心紧固件延伸超过未点燃的中心部分。狭缝提供表面柔性，同时保持片材完整性，因为它穿着圆形。可选的背衬芯在刀具的中间以布片式被子的形式提供，作为用于片材的衬垫背衬，并且在操作期间可以保持冷却剂或复合物。该工具具有更长的使用寿命，提高了灵活性和工作特性。

12. 发明授权

US06354930B1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates 有权
公开(公告)号：US06354930B1
公开(公告)日：2002-03-12
申请号：US09444754
申请日：1999-11-22
申请人： Scott E. Moore
发明人： Scott E. Moore
IPC分类号： B24D1100
CPC分类号： B24B37/26
摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization. Additionally, the selected pattern of micro-features may be reproduced from a master pattern of micro-features to duplicate the selected pattern on several sections of film so that a consistent planarizing surface may be provided for a large number of substrates.

13. 发明授权

US06352471B1 Abrasive brush with filaments having plastic abrasive particles therein 有权
标题翻译：具有丝线的磨料刷，其中具有塑料磨料颗粒
公开(公告)号：US06352471B1
公开(公告)日：2002-03-05
申请号：US09548890
申请日：2000-04-13
申请人： Donna W. Bange , David E. Johnson , Mara E. Liepa , Richard M. Pihl
发明人： Donna W. Bange , David E. Johnson , Mara E. Liepa , Richard M. Pihl
IPC分类号： B24D1100
CPC分类号： A46D1/023 , A46B3/005 , A46B13/003 , A46B13/008 , A46B2200/3093 , A46D1/00 , B24D3/28 , B24D13/10 , B24D13/145 , B24D18/0009 , B29C47/0014 , B29C47/128
摘要： Abrasive filaments including plastic abrasive particles interspersed in a thermoplastic matrix. The abrasive filaments can comprise monofilaments, coextruded core/sheath filaments, and coated preformed cores. Also disclosed are abrasive brush constructions using a plurality of such abrasive filaments mounted on a suitable substrate, and unitary injection molded abrasive brushes. Also disclosed are methods of making such filaments and brushes, and method of using such brushes.
摘要翻译：磨料长丝包括散布在热塑性基质中的塑料磨料颗粒。研磨长丝可以包括单丝，共挤出的芯/皮细丝和涂覆的预制芯。还公开了使用安装在合适的基底上的多个这种磨料细丝的研磨刷结构，以及整体式注塑研磨刷。还公开了制造这种细丝和刷子的方法以及使用这种刷子的方法。

14. 发明授权

US06319108B1 Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece 有权
标题翻译：包含多孔陶瓷研磨复合材料的金属粘结磨料制品及其使用方法来磨损工件
公开(公告)号：US06319108B1
公开(公告)日：2001-11-20
申请号：US09350580
申请日：1999-07-09
申请人： Negus B. Adefris , Carl P. Erickson
发明人： Negus B. Adefris , Carl P. Erickson
IPC分类号： B24D1100
CPC分类号： B24D3/10 , B24B7/20 , B24D3/06 , B24D11/001 , C09K3/1409
摘要： An abrasive article is provided comprising a rigid backing having a first major surface and a second major surface; a plurality of ceramic abrasive composites each comprising a plurality of abrasive particles distributed throughout a porous ceramic matrix; and at least one metal coating which affixes the ceramic abrasive composites to at least one major surface of the backing.
摘要翻译：提供了一种磨料制品，其包括具有第一主表面和第二主表面的刚性背衬; 多个陶瓷磨料复合材料，每个陶瓷磨料复合材料包括分布在整个多孔陶瓷基体中的多个磨料颗粒; 以及至少一种金属涂层，其将陶瓷磨料复合材料固定在背衬的至少一个主表面上。

15. 发明授权

US06261168B1 Chemical mechanical planarization or polishing pad with sections having varied groove patterns 失效
公开(公告)号：US06261168B1
公开(公告)日：2001-07-17
申请号：US09316166
申请日：1999-05-21
申请人： Alan J. Jensen , Brian S. Thornton
发明人： Alan J. Jensen , Brian S. Thornton
IPC分类号： B24D1100
CPC分类号： B24B37/26 , B24B21/04 , B24D11/001 , B24D11/04
摘要： A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

16. 发明授权

US06213858B1 Belts for polishing semiconductors 有权
标题翻译：皮带用于抛光半导体
公开(公告)号：US06213858B1
公开(公告)日：2001-04-10
申请号：US09427108
申请日：1999-10-26
申请人： Brian Lombardo
发明人： Brian Lombardo
IPC分类号： B24D1100
CPC分类号： B24B37/11 , B24B21/04 , B24D11/005 , B24D11/06
摘要： A seamless, composite belt that is designed to maintain a substantially flat surface in the span between two rollers. The belts typically have one or more polymer layers, including the polishing layer, and one or more supporting woven or non-woven layers. The belts have the necessary balance between down-cupping and up-cupping forces achieved by: 1) varying the relative thickness of the different polymer and supporting layers in the belt, 2) varying the relative hardness or rigidity of the different layers in the belt, 3) varying the temperatures at which the different layers are formed, 4) varying the compositions of supporting layers, and 5) prestressing one or more of the composite layers. The belts are particularly useful in chemical mechanical polishing of semiconductor wafers.
摘要翻译：一种无缝复合带，其设计用于在两个辊之间的跨度中保持基本平坦的表面。带通常具有一个或多个聚合物层，包括抛光层和一个或多个支撑机织层或非编织层。带子具有通过以下方式实现的下拉杯和拔罐力之间的必要平衡：1）改变带中不同聚合物和支撑层的相对厚度，2）改变带中不同层的相对硬度或刚度，3）改变形成不同层的温度，4）改变支撑层的组成，以及5）对一个或多个复合层进行预应力。这些带在半导体晶片的化学机械抛光中特别有用。

17. 发明授权

US06797190B2 Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same 有权
标题翻译：用于化学机械抛光装置的晶片载体组件和使用其的抛光方法
公开(公告)号：US06797190B2
公开(公告)日：2004-09-28
申请号：US10383983
申请日：2003-03-06
申请人： Chia-Lin Hsu , Art Yu , Shih-Hsun Hsu , Hsueh-Chung Chen
发明人： Chia-Lin Hsu , Art Yu , Shih-Hsun Hsu , Hsueh-Chung Chen
IPC分类号： B24D1100
CPC分类号： B24B37/30
摘要： A wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same are provided. The present wafer carrier assembly comprises a first plate, a second plate and a flexible membrane. The first plate has a plurality of protrusions formed on a bottom surface thereof and the second plate has a plurality of apertures passing through. Each of the protrusions is matched with one of the apertures to enable the first plate and the second plate to detachably combine together. The flexible membrane is positioned under the second plate and contacts it. A surface of the flexible membrane opposite to the surface of the flexible membrane contacting the second plate provides a wafer-receiving surface.
摘要翻译：提供了一种用于化学机械抛光装置的晶片载体组件和使用其的抛光方法。本晶片载体组件包括第一板，第二板和柔性膜。第一板具有在其底表面上形成的多个突起，并且第二板具有穿过的多个孔。每个突起与其中一个孔匹配，以使得第一板和第二板能够可拆卸地组合在一起。柔性膜定位在第二板下方并与其接触。与柔性膜的与第二板接触的表面相对的柔性膜的表面提供了晶片接收表面。

18. 发明授权

US06758734B2 Coated abrasive article 有权
标题翻译：涂层磨料制品
公开(公告)号：US06758734B2
公开(公告)日：2004-07-06
申请号：US10100693
申请日：2002-03-18
申请人： Ehrich J. Braunschweig , Daidre L. Syverson , Edward J. Woo
发明人： Ehrich J. Braunschweig , Daidre L. Syverson , Edward J. Woo
IPC分类号： B24D1100
CPC分类号： B24D3/28
摘要： Coated abrasive articles comprise a backing and an abrasive layer, wherein at the abrasive layer comprises a reaction product of components comprising polyfunctional acrylate, alicyclic polyepoxide, and aromatic polyepoxide having an average epoxy functionality of at least 2.5.
摘要翻译：涂覆的磨料制品包括背衬和研磨层，其中在研磨层包括具有平均环氧官能度至少为2.5的多官能丙烯酸酯，脂环族聚环氧化物和芳族聚环氧化物的组分的反应产物。

19. 发明授权

US06722249B2 Method of fabricating a polishing pad having an optical window 有权
标题翻译：制造具有光学窗口的抛光垫的方法
公开(公告)号：US06722249B2
公开(公告)日：2004-04-20
申请号：US10011358
申请日：2001-11-06
申请人： Kyle W. David
发明人： Kyle W. David
IPC分类号： B24D1100
CPC分类号： B24B37/205 , B24B49/12 , Y10T83/0304 , Y10T83/0311 , Y10T83/04 , Y10T83/6584 , Y10T83/6588
摘要： A method of fabricating a polishing pad in which a pad material includes a polishing layer overlying a substantially optically transparent backing layer is subjected to a process in which an optical window is formed in the pad material by removing a portion of the polishing layer and exposing an underlying portion of the substantially optically transparent backing layer. Prior to forming the optical window, the polishing layer is bonded to the backing layer to form a sealed interface, then a portion of the polishing layer is mechanically cut away from the backing layers. Since the backing layer is not pierced during the removal process, a liquid, such as an aqueous polishing slurry, cannot leak through the optical window and on to underlying portions of a polishing apparatus to which the pad material is mounted.
摘要翻译：一种制造抛光垫的方法，其中衬垫材料包括覆盖在基本上光学透明的背衬层上的抛光层，其中通过去除抛光层的一部分并暴露出基本上光学透明的背衬层的下面部分。在形成光学窗口之前，将抛光层结合到背衬层以形成密封界面，然后将抛光层的一部分机械地切离背衬层。由于在除去过程中背衬层不被刺穿，所以诸如水性抛光浆料的液体不能通过光学窗口泄漏到衬垫材料安装到的抛光设备的下面部分上。

20. 发明授权

US06652370B2 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates 有权
标题翻译：微电子基板机械和化学机械平面化的方法和装置
公开(公告)号：US06652370B2
公开(公告)日：2003-11-25
申请号：US10167102
申请日：2002-06-10
申请人： Scott E. Moore
发明人： Scott E. Moore
IPC分类号： B24D1100
CPC分类号： B24B37/26
摘要： A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized orpolished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization. Additionally, the selected pattern of micro-features may be reproduced from a master pattern of micro-features to duplicate the selected pattern on several sections of film so that a consistent planarizing surface may be provided for a large number of substrates.
摘要翻译：一种用于机械和/或化学机械平面化微电子衬底的方法和装置。在根据本发明的原理的一个实施例中，微电子衬底在具有薄膜和在膜上的多个微特征的平坦化介质上被平坦化或抛光。膜可以是基本上不能平坦化溶液的不可压缩的片材或织物，并且微特征可以以薄膜上的选定图案配置，以限制平坦化溶液流过衬底下的膜的表面的流体流动。例如，微特征可以被配置成具有多个支撑点的选定图案和至少一个空腔，以在平坦化期间将溶液基本上邻接的均匀分布在基底下。此外，可以从微特征的主图案再现所选择的微特征图案，以在多个薄膜部分上复制所选择的图案，使得可以为大量基板提供一致的平坦化表面。

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