专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US09409383B2 Layer-specific energy distribution delamination 有权
标题翻译：层比能量分布分层
公开(公告)号：US09409383B2
公开(公告)日：2016-08-09
申请号：US12408636
申请日：2009-03-20
申请人： Casey J. Feinstein , Silvio Grespan , Kuo-Hua Sung , John Z. Zhong , Lynn Youngs
发明人： Casey J. Feinstein , Silvio Grespan , Kuo-Hua Sung , John Z. Zhong , Lynn Youngs
IPC分类号： B29C63/00 , B32B43/00 , B26D7/10 , B26D1/547 , B26D3/28 , G02F1/13 , G02F1/1333 , G06F3/0354 , B32B7/12 , B32B37/16 , B32B38/16 , B23K26/00 , B23K26/06 , B32B38/00 , B26D7/08 , B26D1/00 , B32B37/18 , B32B38/04 , B32B37/12
CPC分类号： B32B43/006 , B23K26/00 , B23K26/06 , B23K26/0604 , B23K26/50 , B23K26/57 , B26D1/547 , B26D3/28 , B26D3/282 , B26D7/086 , B26D7/10 , B26D2001/0013 , B26D2001/006 , B32B7/12 , B32B37/12 , B32B37/16 , B32B37/18 , B32B38/0004 , B32B38/16 , B32B2038/045 , B32B2310/022 , B32B2310/028 , B32B2310/0806 , B32B2310/0825 , B32B2310/0843 , B32B2310/0862 , B32B2457/20 , G02F1/1309 , G02F1/133308 , G02F1/13338 , G06F3/03547 , G06F2200/1634 , G06F2200/1635 , Y10T156/1153 , Y10T156/1158 , Y10T156/1184 , Y10T156/1911 , Y10T156/1917 , Y10T156/1967
摘要： Delamination of a laminated multilayer stack is provided by generating a layer-specific energy distribution in the stack during delamination. A localized energy transferrer can generate localized heating, cooling heating, cooling, or other form of energy absorption or transmission, in a bonding layer of a multilayer stack. Localized energy transfer can include thermal energy transfer, such as heating and/or cooling, acoustic energy transfer, such as applying ultrasonic energy, electromagnetic energy transfer, such as applying laser light, directed microwaves, etc. Localized energy transfer can generate a layer-specific energy distribution that can weaken the bonding layer while reducing damage to other layers of the stack.
摘要翻译：通过在分层期间在堆叠中产生层特定的能量分布来提供层压多层叠层的分层。局部能量转移器可以在多层叠层的粘合层中产生局部加热，冷却加热，冷却或其它形式的能量吸收或传输。局部能量转移可以包括诸如加热和/或冷却之类的热能传递，诸如施加超声波能量的声能传递，诸如施加激光的电磁能量传递，定向微波等。局部能量传递可以产生层 - 比能量分布可以削弱结合层，同时减少对堆叠的其它层的损伤。

12. 发明申请

US20160163571A1 APPARATUS FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER 有权
标题翻译：从地面半导体波形去除环形加固边缘的装置
公开(公告)号：US20160163571A1
公开(公告)日：2016-06-09
申请号：US14903741
申请日：2014-07-10
申请人： MECHATRONIC SYSTEMTECHNIK GMBH
发明人： Walter SCHOBER
IPC分类号： H01L21/67 , H01L21/683
CPC分类号： H01L21/67132 , B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L2221/68381 , Y10T156/1132 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1944 , Y10T156/1967
摘要： An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support.
摘要翻译：一种从与地面半导体晶片相接合的环形加强件的边缘与粘合地连接到弹性载体膜并经由载体膜固定到圆周晶片框架的装置包括一个保持装置，用于将半导体晶片保持在支撑体的支撑表面上的开口，以及分离装置，其包括用于将加强边缘与载体膜一体地分离的装置。为了能够将加强边缘与载体膜分离而不损坏，保持器装置具有包围支撑件并用于夹紧晶片框架和/或载体膜的夹紧装置，其中夹紧装置与支撑件相互作用拉伸承载膜，并且分离装置具有工具引导件，该工具引导件具有用于在分隔工具在载体膜和加强件边缘之间移动的分割工具，以便将加强边缘与通过夹持装置和支撑件的相互作用拉伸的载体膜分离成一体。

13. 发明申请

US20160133486A1 Double Layer Release Temporary Bond and Debond Processes and Systems 审中-公开
标题翻译：双层释放临时债券和债券流程和系统
公开(公告)号：US20160133486A1
公开(公告)日：2016-05-12
申请号：US14535822
申请日：2014-11-07
申请人： International Business Machines Corporation
发明人： Paul S. Andry , Russell A. Budd , Bing Dang , Li-Wen Hung , John U. Knickerbocker , Cornelia Kang-I Tsang
IPC分类号： H01L21/56
CPC分类号： H01L21/6835 , B23K26/57 , B32B43/006 , B32B2457/14 , H01L21/67092 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2223/54426 , H01L2223/54453 , H01L2224/94 , H01L2924/10253 , H01L2924/14 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.
摘要翻译：粘合结构包含含有至少一个特征的基底，所述基底具有顶表面; 所述第一释放层覆盖所述基板的顶表面，所述第一释放层吸收具有第一波长的光以被所述光分解; 覆盖第一释放层的粘合剂层和覆盖粘合剂层的第二剥离层。第二释放层吸收具有第二波长的光，以被具有第二波长的光分解。接合结构还包含覆盖第二释放层的手柄衬底，其中手柄衬底对于具有第一波长和第二波长的光基本上是透明的。还公开了一种脱粘方法，用于处理粘合结构以除去和回收用于再次使用的粘合剂层。在另一个实施方案中，多步法可光学地切割和剥离键合结构。

14. 发明授权

US09283598B2 Methods, systems, and devices for radio-frequency assisted removal of sealant 有权
标题翻译：用于射频辅助去除密封剂的方法，系统和装置
公开(公告)号：US09283598B2
公开(公告)日：2016-03-15
申请号：US14282743
申请日：2014-05-20
申请人： The Boeing Company
发明人： Darrin M. Hansen , Carissa Ann Pajel
IPC分类号： B05D3/00 , C08J7/18 , B08B9/08 , B65D53/06
CPC分类号： B29C41/42 , B08B1/00 , B08B7/0035 , B08B7/0071 , B08B9/08 , B29C35/0805 , B29C35/12 , B29C41/003 , B29C41/52 , B29C66/53461 , B29C73/02 , B29C73/26 , B29C73/34 , B29C2035/0811 , B29C2035/0855 , B29C2035/0861 , B29K2085/00 , B29K2105/16 , B29K2505/00 , B29L2031/26 , B29L2031/3076 , B29L2031/7172 , B64C3/34 , B64F5/45 , B65D53/06 , Y10T156/1158 , Y10T156/1917
摘要： Cured sealant may be removed from a substrate if the cured sealant includes a susceptor within its volume. Removal proceeds by exposing the sealant with the susceptor to radio-frequency radiation sufficient to cause dielectric heating in the susceptor and the consequent heating in the cured sealant reduces the bond strength of the cured sealant. The reduced bond-strength sealant may be removed by physical methods, such as scraping etc., much more easily than the original (unexposed) cured sealant. Also disclosed are sealant compositions with susceptor, susceptor tools to introduce susceptor into cured sealant, and handheld radio-frequency heaters to apply radio-frequency radiation to cured sealant.
摘要翻译：如果固化的密封剂在其体积内包括基座，则可以将固化的密封剂从基底上去除。通过用基座将密封剂暴露于足以在基座中引起电介质加热的射频辐射，并且随后在固化的密封剂中的加热降低了固化的密封剂的粘合强度，从而进行去除。还原的粘合强度密封剂可以通过物理方法（例如刮擦等）比原始（未曝光）固化的密封剂容易地除去。还公开了具有基座的密封剂组合物，用于将基座引入固化的密封剂的基座工具以及用于对固化的密封剂施加射频辐射的手持式射频加热器。

15. 发明申请

US20150208885A1 CYCLONIC SURFACE CLEANING APPARATUS 审中-公开
标题翻译：圆形表面清洁装置
公开(公告)号：US20150208885A1
公开(公告)日：2015-07-30
申请号：US14683026
申请日：2015-04-09
申请人： G.B.D. CORP.
发明人： Wayne Ernest Conrad
IPC分类号： A47L5/24 , A47L9/16
CPC分类号： A47L5/24 , A47L7/0028 , A47L7/0038 , A47L9/122 , A47L9/1608 , A47L9/1625 , A47L9/1641 , A47L9/165 , A47L9/1658 , A47L9/1666 , A47L9/1683 , A47L9/20 , Y10T156/1158 , Y10T428/17 , Y10T428/19 , Y10T428/24488
摘要： A surface cleaning apparatus uses an inverted cyclone. An air flow path extends from a dirty air inlet to a clean air outlet. A suction motor is positioned in the air flow path. The inverted cyclone is downstream from the dirty air inlet in a first cyclonic cleaning stage. The cyclone defines a cyclone chamber having a lower air inlet, a lower air outlet and an upper dirt outlet. An openable dirt collection chamber is in communication with the upper dirt outlet.
摘要翻译：表面清洁装置使用倒置旋流器。空气流动路径从脏空气入口延伸到清洁空气出口。抽吸马达位于空气流动路径中。在第一旋风清洁阶段，反向旋风是从脏空气入口的下游。旋风分离器限定了具有下部空气入口，下部空气出口和上部污物出口的旋风室。可开放的污物收集室与上部污物出口连通。

16. 发明授权

US08999107B2 Laser ashing of polyimide for semiconductor manufacturing 有权
标题翻译：用于半导体制造的聚酰亚胺的激光灰化
公开(公告)号：US08999107B2
公开(公告)日：2015-04-07
申请号：US13285408
申请日：2011-10-31
申请人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
发明人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
IPC分类号： B32B38/10 , H01L21/301 , H01L21/02 , B08B7/00 , B23K26/40 , H01L21/311 , H01L23/00
CPC分类号： H01L24/799 , B08B7/0042 , B23K2103/42 , B23K2103/50 , B32B38/0008 , B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/02076 , H01L21/31127 , H01L24/27 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/05442 , H01L2924/07025 , H01L2924/12042 , H01L2924/3025 , H01L2924/40501 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1158 , Y10T156/1917 , H01L2924/00
摘要： A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
摘要翻译：一种使用结构的半导体制造方法的聚酰亚胺的激光灰化方法，包括通过聚酰亚胺胶粘在半导体芯片上的支撑材料的结构，包括从聚酰亚胺胶释放支撑材料，使得聚酰亚胺胶保持在半导体芯片; 并使用烧蚀激光将半导体芯片上的聚酰亚胺胶粉化。

17. 发明申请

US20150035554A1 WAFER DEBONDING USING MID-WAVELENGTH INFRARED RADIATION ABLATION 有权
标题翻译：使用中波长红外辐射消除的波浪失效
公开(公告)号：US20150035554A1
公开(公告)日：2015-02-05
申请号：US14226966
申请日：2014-03-27
申请人： International Business Machines Corporation
发明人： Bing Dang , John U. Knickerbocker , Cornelia Kang-I Tsang
IPC分类号： H01L21/683 , H01L21/302 , G01R31/26 , B23K26/36
CPC分类号： B23K26/36 , G01R31/2607 , H01L21/302 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/1158 , Y10T156/1917 , Y10T428/265 , Y10T428/30 , Y10T428/31678
摘要： Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation
摘要翻译：提供的结构和方法用于使用包括使用中波长红外辐射激光可消除的一个或多个可释放层的接合结构将处理器晶片临时粘合到器件晶片

18. 发明授权

US08943855B2 Methods for laser cutting articles from ion exchanged glass substrates 有权
标题翻译：从离子交换玻璃基板激光切割制品的方法
公开(公告)号：US08943855B2
公开(公告)日：2015-02-03
申请号：US13387790
申请日：2010-08-27
申请人： Sinue Gomez , Lisa Anne Moore , Sergio Tsuda
发明人： Sinue Gomez , Lisa Anne Moore , Sergio Tsuda
IPC分类号： C03B33/02 , C03B33/04 , C03B33/09
CPC分类号： C03B33/0222 , C03B33/04 , C03B33/091 , Y10T156/1158
摘要： A method of cutting an article (172) from a chemically strengthened glass substrate (110) includes generating a pulsed laser beam (108) from a laser source (106). The pulsed laser beam (108) may have a pulse duration of less than about 1000 fs and an output wavelength such that the chemically strengthened glass substrate (110) is substantially transparent to the pulsed laser beam (108). The pulsed laser beam (108) may be focused to form a beam waist (109) that is positioned in the same horizontal plane as an inner tensile region (124) of the chemically strengthened glass substrate (110). The beam waist (109) may be translated in a first pass along a cut line (116), wherein the beam waist (109) traverses an edge (111) of the chemically strengthened glass substrate. The beam waist (113) may then be translated in a second pass along the cut line (116) such that a crack (119) propagates from the edge (113) along the cut line (116) ahead of the translated beam waist (109) during the second pass.
摘要翻译：从化学强化玻璃基板（110）切割物品（172）的方法包括从激光源（106）产生脉冲激光束（108）。脉冲激光束（108）可以具有小于约1000fs的脉冲持续时间和输出波长，使得化学强化的玻璃基板（110）对脉冲激光束（108）基本上是透明的。脉冲激光束（108）可以被聚焦以形成位于与化学强化玻璃基板（110）的内部拉伸区域（124）相同的水平平面内的光束腰部（109）。梁腰（109）可以沿着切割线（116）沿第一道次平移，其中梁腰（109）穿过化学强化的玻璃基板的边缘（111）。然后可以沿着切割线（116）在第二道次中平移梁腰（113），使得裂缝（119）沿着切割线（116）从边缘（113）沿平移的梁腰（109）前方传播）。

19. 发明授权

US08919412B2 Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers 有权
标题翻译：临时粘合半导体晶片的热滑脱离装置
公开(公告)号：US08919412B2
公开(公告)日：2014-12-30
申请号：US12760973
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
发明人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10 , H01L21/67 , B32B43/00 , H01L21/683 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.
摘要翻译：用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动控制。顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而使得器件晶片分离并从载体晶片滑离。

20. 发明申请

US20140166209A1 LAMINATE AND METHOD FOR SEPARATING THE SAME 审中-公开
标题翻译：层压体及其分离方法
公开(公告)号：US20140166209A1
公开(公告)日：2014-06-19
申请号：US14183988
申请日：2014-02-19
申请人： Tokyo Ohka Kogyo Co., Ltd.
发明人： Hirofumi Imai , Koki Tamura , Atsushi Kubo , Takahiro Yoshioka , Yasushi Fujii , Yoshihiro Inao
IPC分类号： B32B43/00
CPC分类号： B32B43/006 , B32B38/10 , B32B2310/0825 , B32B2457/14 , C08G77/14 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , Y10T156/1158 , Y10T156/1195 , Y10T428/31663
摘要： A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.
摘要翻译：包括透射红外线的支撑体的层压体; 由支撑体支撑的基板; 粘合层，支撑体和基板通过该粘合层彼此附接; 以及分离层，其位于所述支撑体的与所述基板的表面相连的表面上，并且由具有红外线吸收结构的化合物制成。目标物紧密地附着并支撑在层压板中，同时确保支撑物与目标的容易分离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式