专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US09581245B2 Metal seal for ultra high vacuum system 有权
标题翻译：超高真空系统金属密封
公开(公告)号：US09581245B2
公开(公告)日：2017-02-28
申请号：US13437107
申请日：2012-04-02
申请人： Qingpo Xi , Tao Li , Feng Cao , Fumin He , Zhongwei Chen
发明人： Qingpo Xi , Tao Li , Feng Cao , Fumin He , Zhongwei Chen
IPC分类号： F16L23/20 , F16J15/08
CPC分类号： F16J15/0881 , F16L23/20
摘要： A metal seal flange assembly for a vacuum system is presented. Its metal gasket has a crossectional shape that is an irregular hexagon with two acute angles between the longest side and the second- and third-longest sides, respectively. The longest side of the irregular hexagon is the vertical inner wall of the metal gasket. This design can reduce the normal force required to seal the metal seal flange assembly and reduce the number of bolts needed, enabling use in a limited working space.
摘要翻译：提出了一种用于真空系统的金属密封法兰组件。其金属垫片的横截面形状是不规则六边形，分别在最长侧和第二和第三最长边之间具有两个锐角。不规则六边形的最长边是金属垫片的垂直内壁。这种设计可以减少密封金属密封凸缘组件所需的法向力，并减少所需的螺栓数量，从而在有限的工作空间中使用。

12. 发明授权

US09494856B1 Method and system for fast inspecting defects 有权
标题翻译：快速检查缺陷的方法和系统
公开(公告)号：US09494856B1
公开(公告)日：2016-11-15
申请号：US13154483
申请日：2011-06-07
申请人： Wei Fang , Jack Jau
发明人： Wei Fang , Jack Jau
IPC分类号： G03F1/84 , H05K1/00 , G03F1/00 , G06T7/00 , G01N21/956
CPC分类号： G03F1/84 , G01N21/9501 , G01N21/95607 , G01N23/2251 , G03F1/144 , G03F1/86 , G03F7/7065 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/30141 , G06T2207/30148 , H05K1/00
摘要： A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.
摘要翻译：用于检查缺陷的方法和系统将扫描的原始数据保存为原始图像，从而节省重复扫描的时间，并通过使用相同的方式检查原始图像中的可疑缺陷和其他感兴趣的区域，从而实现更快的缺陷检查和降低错误率不同的图像处理算法具有相同或不同的参数。

13. 发明授权

US09485846B2 Method and system for inspecting an EUV mask 有权
标题翻译：检查EUV面罩的方法和系统
公开(公告)号：US09485846B2
公开(公告)日：2016-11-01
申请号：US14575102
申请日：2014-12-18
申请人： Hermes Microvision Inc.
发明人： Guochong Weng , Youjin Wang , Chiyan Kuan , Chung-Shih Pan
IPC分类号： G01N23/00 , H05F3/02 , H01J37/20 , G01N23/225 , H01J37/02
CPC分类号： G01N23/2251 , H01J37/026 , H01J37/20 , H01J37/28 , H01J2237/004 , H01J2237/0041 , H01J2237/0044 , H01J2237/2007 , H01J2237/2008 , H01J2237/202 , H01J2237/2448 , H01J2237/2602 , H01J2237/2811 , H01J2237/2813 , H05F3/02
摘要： A structure for grounding an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for grounding an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and back side. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUV mask is grounded. The reflective surface of the EUV mask on a continuously moving stage is scanned by using the electron beam simultaneously. The moving direction of the stage is perpendicular to the scanning direction of the electron beam.
摘要翻译：提供一种用于接地极紫外线掩模（EUV掩模）的结构，用于通过电子束检查工具在检查期间对EUV掩模进行放电。用于将EUV掩模接地的结构包括至少一个接地引脚以接触EUV掩模上的导电区域，其中EUV掩模可以在侧壁或/或背侧上具有另外的导电层。通过使用电子束检查系统来增强EUV掩模的检查质量，因为EUV掩模上的累积充电是接地的。通过同时使用电子束扫描连续移动台上的EUV掩模的反射表面。舞台的移动方向垂直于电子束的扫描方向。

14. 发明授权

US09436988B2 Method and system of classifying defects on a wafer 有权
标题翻译：在晶片上分类缺陷的方法和系统
公开(公告)号：US09436988B2
公开(公告)日：2016-09-06
申请号：US14325802
申请日：2014-07-08
申请人： Hermes-Microvision, Inc.
发明人： Wei Fang , Zhaoli Zhang , Jack Jau
IPC分类号： G06K9/00 , G06T7/00
CPC分类号： G06T7/0008 , G06T7/001 , G06T2207/20081 , G06T2207/30148
摘要： A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.
摘要翻译：提供了在具有相同芯片和相应系统的晶片上分类缺陷的方法。在接收到通过使用带电粒子束扫描晶片形成的图像之后，检查这些图像，使得发现缺陷图像和无缺陷图像。然后，将无缺陷图像转换为芯片的模拟布局，或者使用数据库来提供芯片的模拟布局。最后，通过将图像与芯片的模拟布局进行比较来分类缺陷图像上的缺陷。系统有一些模块分别对应于该方法的步骤。

15. 发明授权

US09431209B2 Apparatus of plural charged particle beams with multi-axis magnetic lenses 有权
标题翻译：具有多轴磁性透镜的多个带电粒子束的装置
公开(公告)号：US09431209B2
公开(公告)日：2016-08-30
申请号：US14833583
申请日：2015-08-24
申请人： Hermes-Microvision, Inc.
发明人： Weiming Ren , Xuerang Hu , Xuedong Liu , Zhongwei Chen
IPC分类号： H01J37/00 , H01J37/141 , H01J37/147 , H01J37/28
CPC分类号： H01J37/141 , H01J37/1475 , H01J37/28 , H01J2237/141 , H01J2237/1508 , H01J2237/1526 , H01J2237/28 , H01J2237/2817
摘要： A new apparatus of plural charged particle beams with multi-axis magnetic lenses is provided, which comprises a plurality of sub-columns The apparatus employs two modified multi-axis magnetic lenses, and magnetic sub-lenses thereof therefore function as the objective lenses and the condenser lenses of all the sub-columns respectively. The plurality of sub-columns can perform the same function or different functions required for observing a surface of a specimen, such as high-throughput inspection and high-resolution review of interested features thereon. Accordingly, the apparatus can be used as a yield management tool in semiconductor manufacturing industry.
摘要翻译：提供了具有多轴磁透镜的多个带电粒子束的新装置，其包括多个子列。该装置采用两个改进的多轴磁性透镜，并且其磁性子透镜因此用作物镜，并且所有子列的聚光透镜分别。多个子列可以执行用于观察样本表面所需的相同功能或不同的功能，例如高通量检测和对其感兴趣的特征的高分辨率检查。因此，该装置可以用作半导体制造业的屈服管理工具。

16. 发明授权

US09330987B2 Hot spot identification, inspection, and review 有权
标题翻译：热点识别，检查和审查
公开(公告)号：US09330987B2
公开(公告)日：2016-05-03
申请号：US14481247
申请日：2014-09-09
申请人： Hermes-Microvision, Inc.
发明人： Steve Lin , Wei Fang , Eric Ma , Zhonghua Dong , Jon Chiang , Yan Zhao , Chester Kuo , Zhongwei Chen
IPC分类号： H01J37/26 , H01L21/00 , G03F7/00 , H01L21/66 , G03F7/20 , G03F1/86
CPC分类号： H01L22/12 , G03F1/86 , G03F7/7065 , H01J2237/103 , H01J2237/221 , H01J2237/2817
摘要： A method for identifying, inspecting, and reviewing all hot spots on a specimen is disclosed by using at least one SORIL e-beam tool. A full die on a semiconductor wafer is scanned by using a first identification recipe to obtain a full die image of that die and then design layout data is aligned and compared with the full die image to identify hot spots on the full die. Threshold levels used to identify hot spots can be varied and depend on the background environments close thereto, materials of the specimens, defect types, and design layout data. A second recipe is used to selectively inspect locations of all hot spots to identify killers, and then killers can be reviewed with a third recipe.
摘要翻译：通过使用至少一个SORIL电子束工具来公开用于识别，检查和检查试样上的所有热点的方法。通过使用第一识别配方扫描半导体晶片上的全裸片以获得该裸片的完整裸片图像，然后将设计布局数据对准并与全裸片图像进行比较，以识别全裸片上的热点。用于识别热点的阈值水平可以变化并且取决于靠近的背景环境，样本的材料，缺陷类型和设计布局数据。使用第二个方法来选择性地检查所有热点的位置以识别杀手，然后用第三个配方来检查杀手。

17. 发明授权

US09251581B1 Methods for promoting semiconductor manufacturing yield and classifying defects during fabricating a semiconductor device, and computer readable mediums encoded with a computer program implementing the same 有权
标题翻译：在制造半导体器件期间促进半导体制造产率和分类缺陷的方法以及用实现其的计算机程序编码的计算机可读介质
公开(公告)号：US09251581B1
公开(公告)日：2016-02-02
申请号：US13073405
申请日：2011-03-28
申请人： Shih-Tsung Chen , Wei Fang , Yu-Tsorng Fu , Futang Peng , Zhao-Li Zhang
发明人： Shih-Tsung Chen , Wei Fang , Yu-Tsorng Fu , Futang Peng , Zhao-Li Zhang
IPC分类号： G06T7/00 , G01N21/95
CPC分类号： G06T7/001 , G01N21/9501 , G06T2207/30148
摘要： A method for promoting semiconductor manufacturing yield comprising the following steps and a computer readable medium encoded with a computer program implementing the method is provided. First, a processed layer is inspected to generate an inspected image with defects thereon. Next, the inspected image is aligned to an original design layout information of the processed layer. In addition, the defects are classified according to geometric features of the original design layout information of the processed layer and at least previous one layer and/or at least next one layer.
摘要翻译：提供一种用于促进半导体制造产量的方法，包括以下步骤和用实现该方法的计算机程序编码的计算机可读介质。首先，检查处理层以产生其上具有缺陷的检查图像。接下来，被检查图像与处理层的原始设计布局信息对齐。另外，根据处理层的原始设计布局信息和至少前一个层和/或至少下一个层的几何特征对缺陷进行分类。

18. 发明授权

US09190241B2 Charged particle beam apparatus 有权
标题翻译：带电粒子束装置
公开(公告)号：US09190241B2
公开(公告)日：2015-11-17
申请号：US14220358
申请日：2014-03-20
申请人： Hermes-Microvision, Inc.
发明人： Zhongwei Chen , Jack Jau , Weiming Ren
IPC分类号： H01J37/26 , H01J37/28 , H01J37/10 , H01J37/14 , H01J37/20 , H01J37/22
CPC分类号： H01J37/28 , H01J37/026 , H01J37/10 , H01J37/14 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/261 , H01J37/285 , H01J37/292 , H01J2237/04926 , H01J2237/1405 , H01J2237/24475 , H01J2237/24495 , H01J2237/24528 , H01J2237/2801 , H01J2237/2804 , H01J2237/2806 , H01J2237/2814
摘要： The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.
摘要翻译：本发明提供了检查诸如晶片和掩模之类的样品表面上的小颗粒的装置。这些装置通过形成暗场BSE图像提供高检测效率和高吞吐量。这些装置可以通过同时形成SE图像和亮场BSE图像另外检查样品表面上的物理和电气缺陷。这些装置可被设计成进行单光束或甚至多个单光束检查以实现高吞吐量。

19. 发明授权

US09164399B2 Reticle operation system 有权
标题翻译：光栅操作系统
公开(公告)号：US09164399B2
公开(公告)日：2015-10-20
申请号：US13737065
申请日：2013-01-09
申请人： Hermes-Microvision, Inc.
发明人： Youjin Wang , Chiyan Kuan , Chung-Shih Pan
IPC分类号： G03B27/62 , G03F7/20 , G03F1/66 , G03B27/32
CPC分类号： G03F7/70741 , G03F1/66 , G03F7/70733
摘要： A system for operating EUV mask stored in reticle SMIF pod and/or dual pod is provided, wherein the reticle SMIF pod and Dual pod are for storing EUV mask. The system can be a sorter for EUV mask transferred from reticle SMIF pod into dual pod, and vice versa, or an operating system for tools relating to EUV mask, wherein the tools may be EUV lithography, or inspection tool for inspecting EUV mask.
摘要翻译：提供了一种用于操作存储在掩模版SMIF盒和/或双盒中的EUV掩模的系统，其中标线片SMIF盒和双盒用于存储EUV掩模。该系统可以是EUV掩模的分拣机，从掩模版SMIF荚转移到双荚，反之亦然，或与EUV掩模相关的工具的操作系统，其中工具可以是EUV光刻，或用于检查EUV掩模的检查工具。

20. 发明授权

US09100553B2 Method and system for measuring critical dimension and monitoring fabrication uniformity 有权
标题翻译：测量临界尺寸和监测制造均匀性的方法和系统
公开(公告)号：US09100553B2
公开(公告)日：2015-08-04
申请号：US13785256
申请日：2013-03-05
申请人： HERMES MICROVISION INC.
发明人： Wei Fang , Jack Jau , Hong Xiao
IPC分类号： H04N7/18 , G06T7/00
CPC分类号： H04N7/18 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/20016 , G06T2207/30148 , H04N7/183
摘要： A method for measuring critical dimension (CD) includes steps of: scanning at least one area of interest of a die to obtain at least one scanned image; aligning the scanned image to at least one designed layout pattern to identify a plurality of borders within the scanned image; and averaging distances each measured from the border or the plurality of borders of a pattern associated with a specific type of CD corresponding to the designed layout pattern to obtain a value of CD of the die. The value of critical dimensions of dies can be obtained from the scanned image with lower resolution which is obtained by relatively higher scanning speed, so the above-mentioned method can obtain value of CD for every die within entire wafer to monitor the uniformity of the semiconductor manufacturing process within an acceptable inspection time.
摘要翻译：用于测量临界尺寸（CD）的方法包括以下步骤：扫描模具的至少一个感兴趣区域以获得至少一个扫描图像; 将扫描图像对准至少一个设计的布局图案，以识别扫描图像内的多个边界; 以及从与设计的布局图案对应的特定类型的CD相关联的图案的边界或多个边界测量的平均距离，以获得模具的CD的值。可以通过相对较高的扫描速度获得的具有较低分辨率的扫描图像获得模具的临界尺寸的值，因此上述方法可以获得整个晶片内每个管芯的CD值，以监测半导体的均匀性制造过程在可接受的检验时间内。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式