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11. 发明申请

US20120218060A1 BULK ACOUSTIC WAVE RESONATOR COMPRISING BRIDGE FORMED WITHIN PIEZOELECTRIC LAYER 有权
标题翻译：包含在压电层中形成的桥的大容量声波谐波器
公开(公告)号：US20120218060A1
公开(公告)日：2012-08-30
申请号：US13208909
申请日：2011-08-12
申请人： Dariusz Burak , Phil Nikkel , Jyrki Kaitila , John D. Larson, III , Alexandre Shirakawa
发明人： Dariusz Burak , Phil Nikkel , Jyrki Kaitila , John D. Larson, III , Alexandre Shirakawa
IPC分类号： H03H9/56
CPC分类号： H03H9/132 , H03H3/04 , H03H9/02007 , H03H9/02118 , H03H9/173 , H03H9/175 , H03H9/584 , H03H9/585 , H03H9/587 , H03H9/589
摘要： A bulk acoustic wave (BAW) structure includes a first electrode disposed over a substrate, a piezoelectric layer disposed over the first electrode, and a second electrode disposed over the first piezoelectric layer. A bridge is formed within the piezoelectric layer, where the bridge is surrounded by piezoelectric material of the piezoelectric layer.
摘要翻译：体声波（BAW）结构包括设置在基板上的第一电极，设置在第一电极上的压电层和设置在第一压电层上的第二电极。桥接器形成在压电层内，桥被压电层的压电材料包围。

12. 发明授权

US08233851B2 Method and apparatus for providing impedance matching for high-frequency signal transmitter 有权
标题翻译：提供高频信号发射机阻抗匹配的方法和装置
公开(公告)号：US08233851B2
公开(公告)日：2012-07-31
申请号：US12699112
申请日：2010-02-03
申请人： Joo Young Jeon , Sang Hwa Jung , Jung Hyun Kim , Young Kwon
发明人： Joo Young Jeon , Sang Hwa Jung , Jung Hyun Kim , Young Kwon
IPC分类号： H04B1/04 , H04B17/00
CPC分类号： H04B1/04
摘要： In accordance with another representative embodiment, a high-frequency signal transmitter a power amplifier configured to supply a high-frequency signal; an antenna configured to transmit the high-frequency signal; a transmission line configured to transfer the high-frequency signal from the power amplifier to the antenna; and an impedance matching circuit connected to the transmission line. The high-frequency signal transmitter also comprises a mismatch detector. The mismatch detector is configured to designate a comparatively poor linearity region and a comparatively good linearity region by dividing a Smith chart into the two regions based on Adjacent Channel Power Ratio (ACPR) contours drawn on the Smith chart at a point on the transmission line where the impedance matching circuit is connected, to measure a time-dependent reflection coefficient of the high-frequency signal transmitter in terms of a phase and a magnitude, to determine whether the reflection coefficient is located in the comparatively poor linearity region or the comparatively good linearity region, and based on a result of the determination, to improve the linearity of the high-frequency signal transmitter.
摘要翻译：根据另一个代表性实施例，一种高频信号发射机，被配置为提供高频信号的功率放大器; 配置为发送高频信号的天线; 传输线，被配置为将高频信号从功率放大器传送到天线; 以及与传输线连接的阻抗匹配电路。高频信号发射机还包括不匹配检测器。不匹配检测器被配置为通过基于在传输线上的一点上在史密斯圆图上绘制的相邻信道功率比（ACPR）轮廓将史密斯圆图划分成两个区域来指定相对较差的线性区域和相对良好的线性度区域，其中连接阻抗匹配电路，根据相位和幅度测量高频信号发射器的时间相关反射系数，以确定反射系数是否位于相对较差的线性区域或较好的线性度区域，并且基于确定的结果，提高高频信号发射机的线性度。

13. 发明授权

US08209826B2 Method for manufacturing a coupled resonator device 失效
标题翻译：制造耦合谐振器装置的方法
公开(公告)号：US08209826B2
公开(公告)日：2012-07-03
申请号：US12110961
申请日：2008-04-28
申请人： Martin Handtmann , Klaus-Guenter Oppermann , Martin Fritz
发明人： Martin Handtmann , Klaus-Guenter Oppermann , Martin Fritz
IPC分类号： H04R17/00 , C23F1/00
CPC分类号： H03H3/02 , H03H9/584 , Y10T29/42 , Y10T29/49005 , Y10T29/49156
摘要： A method for manufacturing a coupled resonator device includes forming a first BAW-device on a first substrate, forming a second BAW-device on a second substrate, and bonding the first and the second BAW-device such that the bonded first and second BAW-device are sandwiched between the first and second substrate.
摘要翻译：一种耦合谐振器装置的制造方法包括在第一基板上形成第一BAW器件，在第二基板上形成第二BAW器件，以及将第一和第二BAW器件接合，使得结合的第一和第二BAW- 器件夹在第一和第二衬底之间。

14. 发明授权

US08199953B2 Multi-aperture acoustic horn 失效
标题翻译：多孔声喇叭
公开(公告)号：US08199953B2
公开(公告)日：2012-06-12
申请号：US12261244
申请日：2008-10-30
申请人： Osvaldo Buccafusca
发明人： Osvaldo Buccafusca
IPC分类号： H04R1/20
CPC分类号： G10K11/025
摘要： A device, for transmitting or receiving ultrasonic signals, includes a transducer and an acoustic horn. The transducer is configured to convert between electrical energy and the ultrasonic signals, and may be a micro electromechanical system (MEMS) transducer. The acoustic horn is coupled to the transducer, and includes multiple apertures through which the ultrasonic signals are transmitted or received in order to manipulate at least one of a radiation pattern, frequency response or magnitude of the ultrasonic signals. The multiple apertures have different sizes.
摘要翻译：用于发送或接收超声信号的装置包括换能器和声喇叭。换能器被配置为在电能和超声波信号之间转换，并且可以是微机电系统（MEMS）换能器。声喇叭耦合到换能器，并且包括多个孔，超声波信号通过该孔被发送或接收，以便操纵超声信号的辐射图，频率响应或幅度中的至少一个。多个孔径具有不同的尺寸。

15. 发明授权

US08186028B2 Method of manufacturing a piezoelectric resonator having improved temperature compensation 失效
标题翻译：制造具有改善的温度补偿的压电谐振器的方法
公开(公告)号：US08186028B2
公开(公告)日：2012-05-29
申请号：US12344829
申请日：2008-12-29
申请人： Robert Aigner
发明人： Robert Aigner
IPC分类号： H04R17/10 , H05K7/02
CPC分类号： H03H9/02102 , Y10T29/42 , Y10T29/49128 , Y10T29/49155
摘要： A method for manufacturing a piezoelectric resonator, comprising the step of: producing an arrangement comprising a piezoelectric layer having a resonance frequency temperature coefficient of a first sign, a first and a second electrode. The piezoelectric layer is arranged between the first and second electrodes, and a compensation layer is arranged between the first electrode and the piezoelectric layer. The compensation layer has a compensation material having a second resonance frequency temperature coefficient of a second sign opposite to the first one. The producing comprises providing the compensation material with a modification material to increase a conductivity of the compensation layer in a direction between the first electrode and the piezoelectric layer.
摘要翻译：一种制造压电谐振器的方法，包括以下步骤：制造包括具有第一符号的共振频率温度系数的压电层，第一和第二电极的布置。压电层设置在第一和第二电极之间，并且补偿层设置在第一电极和压电层之间。补偿层具有补偿材料，其具有与第一共振频率温度系数相反的第二共振频率温度系数。该制造方法包括向所述补偿材料提供改性材料，以在所述第一电极和所述压电层之间的方向上增加所述补偿层的导电性。

16. 发明申请

US20120126887A1 HIGH-EFFICIENCY POWER AMPLIFIER WITH MULTIPLE POWER MODES 有权
标题翻译：具有多种功率模式的高效功率放大器
公开(公告)号：US20120126887A1
公开(公告)日：2012-05-24
申请号：US12952620
申请日：2010-11-23
申请人： Choong Soo Han , Jung Min Oh , Sang Hwa Jung
发明人： Choong Soo Han , Jung Min Oh , Sang Hwa Jung
IPC分类号： H03F3/60 , H03F3/68
CPC分类号： H03F1/0277 , H03F3/211 , H03F3/68 , H03F3/72 , H03F2203/21103 , H03F2203/21106 , H03F2203/21139 , H03F2203/21142 , H03F2203/7233 , H03F2203/7236
摘要： In a representative embodiment, a multiple mode power amplifier that is operable in a first power mode and a second power mode. The multiple mode power amplifier comprises a first amplifying unit; a second amplifying unit; a first impedance matching network connected to an output port of the first amplifying unit; a second impedance matching network connected to an output port of the second amplifying unit and to the first impedance matching network; and a third impedance matching network connected to the output ports of the first and the second amplifying units. The third impedance matching network reduces a phase difference between signals amplified by the first and the second amplifying units in the first mode.
摘要翻译：在代表性实施例中，可在第一功率模式和第二功率模式下操作的多模式功率放大器。多模式功率放大器包括第一放大单元; 第二放大单元; 连接到第一放大单元的输出端口的第一阻抗匹配网络; 连接到第二放大单元的输出端口和第一阻抗匹配网络的第二阻抗匹配网络; 以及连接到第一和第二放大单元的输出端口的第三阻抗匹配网络。第三阻抗匹配网络在第一模式中减小由第一和第二放大单元放大的信号之间的相位差。

17. 发明申请

US20120096697A1 METHOD OF FORMING ACOUSTIC RESONATOR USING INTERVENING SEED LAYER 有权
标题翻译：使用干涉种子层形成声学谐振器的方法
公开(公告)号：US20120096697A1
公开(公告)日：2012-04-26
申请号：US12911986
申请日：2010-10-26
申请人： Kevin J. GRANNEN , Chris FENG , Phil NIKKEL , John CHOY
发明人： Kevin J. GRANNEN , Chris FENG , Phil NIKKEL , John CHOY
IPC分类号： H01L41/22
CPC分类号： H03H3/02 , H01L41/314 , H01L41/317 , H01L41/319 , H03H9/173 , H03H9/175 , H03H2003/021 , H03H2003/025 , Y10T29/42
摘要： A method of forming an acoustic resonator includes forming a seed layer on a first electrode layer, forming a piezoelectric layer directly on a surface of the seed layer, and forming a second electrode layer on the piezoelectric layer. The piezoelectric layer includes multiple crystals of piezoelectric material, and the seed layer causes crystal axis orientations of the crystals to be substantially perpendicular to the surface of the seed layer.
摘要翻译：形成声谐振器的方法包括在第一电极层上形成种子层，在种子层的表面上直接形成压电层，在压电层上形成第二电极层。压电层包括多个压电材料晶体，种晶层使晶体的晶轴取向基本上垂直于晶种层的表面。

18. 发明授权

US08143105B2 Semiconductor seal ring and method of manufacture thereof 失效
标题翻译：半导体密封圈及其制造方法
公开(公告)号：US08143105B2
公开(公告)日：2012-03-27
申请号：US12466064
申请日：2009-05-14
申请人： Bradley Barber , Tony LoBianco , David T. Young
发明人： Bradley Barber , Tony LoBianco , David T. Young
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/78
摘要： An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during the singulation process. A thin moisture-proof barrier layer is preferably deposited over at least a portion of the thick layer to seal at least an edge of the thick layer. A thick nonmetallic layer preferably used for fabrication of active circuit elements may advantageously be employed as the thick layer (for example, an aluminum nitride (AlN) layer in, for example, a bulk acoustic wave (BAW) filter device). A thin amorphous nonmetallic layer (e.g., a silicon nitride (SiN) layer) may preferably be deposited over the thick layer. Alternatively, other materials may be used.
摘要翻译：因此，描述了改进的半导体密封环和方法。密封环包括厚层，其中在切割之前，从切割街道中去除厚层的至少一部分，从而避免在切割过程中损坏厚层。优选在厚层的至少一部分上沉积薄的防湿屏障层，以密封厚层的至少一个边缘。优选用于制造有源电路元件的厚非金属层可以有利地用作厚层（例如，例如在体声波（BAW）滤波器装置中的氮化铝（AlN）层）。薄的非晶非金属层（例如，氮化硅（SiN）层）可优选沉积在厚层上。或者，也可以使用其他材料。

19. 发明申请

US20120043628A1 PACKAGED DEVICE INCLUDING A WELL FOR CONTAINING A DIE 审中-公开
标题翻译：包装设备，包括用于包装的食物
公开(公告)号：US20120043628A1
公开(公告)日：2012-02-23
申请号：US12859524
申请日：2010-08-19
申请人： Steve MARTIN , Timothy LECLAIR
发明人： Steve MARTIN , Timothy LECLAIR
IPC分类号： H01L29/84 , H01L23/495
CPC分类号： H01L23/49861 , B81B7/0048 , B81B2201/0257 , B81C1/00 , H01L23/16 , H01L2224/48091 , H01L2924/1461 , H01L2924/00 , H01L2924/00014
摘要： A packaged device includes a package defining a well having a well top, a die positioned in the well of the package, and a retaining substrate attached to the package over the well top. The retaining substrate holds the die in direct contact with a portion of the package exposed at a well bottom opposite the well top.
摘要翻译：封装的装置包括限定井的井的封套，位于封装井的井中的管芯，以及在井顶上连接到封装的保持基板。保持衬底保持模具与暴露在与井顶相对的井底部暴露的包装的一部分直接接触。

20. 发明申请

US20120013401A1 POWER AMPLIFIER WITH SELECTABLE LOAD IMPEDANCE AND METHOD OF AMPLIFYING A SIGNAL WITH SELECTABLE LOAD IMPEDANCE 审中-公开
标题翻译：具有可选负载阻抗的功率放大器和放大具有可选负载阻抗的信号的方法
公开(公告)号：US20120013401A1
公开(公告)日：2012-01-19
申请号：US12835853
申请日：2010-07-14
申请人： Moon-Suk JEON , Chan Hoe KOO , Hyung Bin LEE , Sang Hwa JUNG
发明人： Moon-Suk JEON , Chan Hoe KOO , Hyung Bin LEE , Sang Hwa JUNG
IPC分类号： H03F1/30
CPC分类号： H03F1/56 , H03F1/02 , H03F2200/387 , H03F2200/513
摘要： A device includes: a power amplifier, including a supply voltage terminal, an input port and an output port, and the power amplifier being configured to receive a supply voltage at the supply voltage terminal, an input signal through the input port, to amplify the received input signal, and to output an amplified output signal through the output port; a variable impedance matching circuit having an input terminal connected to the output port of the power amplifier, and having an output terminal for being connected to a load; and a controller including a voltage measuring unit configured to measure the supply voltage, to compare the measured supply voltage with a threshold voltage, and to control the variable impedance matching circuit based on a result of the comparison so as to adjust a load impedance seen by the power amplifier at its output port.
摘要翻译：一种设备包括：功率放大器，包括电源电压端子，输入端口和输出端口，并且功率放大器被配置为在电源电压端子处接收通过输入端口的输入信号的电源电压，以放大接收输入信号，并通过输出端口输出放大的输出信号; 可变阻抗匹配电路，其具有连接到功率放大器的输出端口的输入端子，并具有用于连接到负载的输出端子; 以及控制器，其包括电压测量单元，其被配置为测量所述电源电压，以将所测量的电源电压与阈值电压进行比较，并且基于所述比较的结果来控制所述可变阻抗匹配电路，以便调整由功率放大器在其输出端口。

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