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    • 16. 发明申请
    • TRACING SUPPORT FOR INTERCONNECT FABRIC
    • 追踪互连织物的支持
    • US20100268990A1
    • 2010-10-21
    • US12427646
    • 2009-04-21
    • Zheng XuSanjay DeshpandeMichael Snyder
    • Zheng XuSanjay DeshpandeMichael Snyder
    • G06F11/00
    • G06F11/26
    • Complex on-chip interconnect fabrics, particularly those that include point-to-point interconnects and coherent routing networks, can present significant challenges for conventional trace techniques that may be applied in an effort to efficiently provide an external debugger with visibility into on-chip interconnect transactions. Embodiments described herein generate and supply separate in-circuit-trace messages including address messages and data messages, which are sent out (i.e., off-chip) to external debug tools generally without delay and coincident with the distinct, but related, trace events within address and data paths of the interconnect fabric. These separate message instances embed appropriate tag and mark values to allow the message instances to be post-processed and correlated by the external debug tools so as to reconstruct the transaction information for operations performed in the on-chip interconnect.
    • 复杂的片上互连结构,特别是那些包括点对点互连和相干路由网络的互连结构,可能会为传统的跟踪技术带来重大挑战,这些技术可能会有效地为外部调试器提供可视化的片上互连 交易。 本文描述的实施例生成并提供单独的在线跟踪消息,包括地址消息和数据消息,其通常没有延迟地发送(即片外)到外部调试工具,并且与不同但相关的跟踪事件一致 互连结构的地址和数据路径。 这些单独的消息实例嵌入适当的标签和标记值,以允许消息实例被后处理并由外部调试工具相关联,以便重建用于在片上互连中执行的操作的事务信息。
    • 17. 发明授权
    • LED direct-plugging type multi-chip high power light source
    • LED直插式多芯片大功率光源
    • US07806554B2
    • 2010-10-05
    • US12043409
    • 2008-03-06
    • Baoyan ChangXianghong YangZheng Xu
    • Baoyan ChangXianghong YangZheng Xu
    • F21L4/00
    • F21V29/70F21K9/00F21V29/89F21Y2115/10
    • The present invention provides a LED direct-plugging type multi-chip high power light source, comprising a heat dissipating substrate, a protective rubber ring mounted at the front side of the heat dissipating substrate, LEDs fixed on the heat dissipating substrate and in the protective rubber ring, the heat dissipating substrate being provided with two through holes penetrating its front side and rear side, in each of the two through holes separately provided with a pin connected to the LEDs, one end of the pin inserted into the through hole and the other end of the pin led out from the rear side of the heat dissipating substrate to the outside of the heat dissipating substrate, and the part of the pins inserted in the through holes being separated from the heat dissipating substrate by a insulator. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. The present invention increases the power of a single light source, decreases the attenuation of light greatly, and increases the useful life greatly.
    • 本发明提供一种LED直插式多芯片大功率光源,包括散热基板,安装在散热基板正面的保护橡胶环,固定在散热基板上的LED和保护性的 橡胶圈,散热基板上设有穿过其前侧和后侧的两个通孔,在两个通孔中的每一个中,分别设置有连接到LED的销,插入通孔的销的一端和 销的另一端从散热基板的后侧引出到散热基板的外侧,并且插入通孔中的销的部分通过绝缘体与散热基板分离。 散热基板由高导热金属制成。 在本发明中,散热基板由高导热性金属制成,导热柱被消除。 与现有技术相比,本发明减少了散热路径,增大了截面面积,消除了高耐热性的中间环节。 本发明增加了单个光源的功率,大大降低了光的衰减,大大提高了使用寿命。