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    • 11. 发明授权
    • Method for minimizing false detection of states in flash memory devices
    • 用于最小化闪速存储器件中的状态的错误检测的方法
    • US07283398B1
    • 2007-10-16
    • US10838962
    • 2004-05-04
    • Yue-Song HeRichard FastowTakao AkaogiWing LeungZhigang Wang
    • Yue-Song HeRichard FastowTakao AkaogiWing LeungZhigang Wang
    • G11C16/06
    • G11C16/0466G11C16/344G11C16/3445G11C16/3477
    • The present invention provides a method for determining program and erase states in flash memory devices. Specifically, one embodiment of the present invention discloses a method for minimizing false detection of states in an array of non-volatile floating gate memory cells. A plurality of word lines are arranged in a plurality of rows. A plurality of bit lines are arranged in a plurality of columns. The method begins by determining a selected bit line that is associated with a column of memory cells. Then, the method continues by biasing a group of word lines at a negative voltage. The group of word lines are electrically coupled to the associated memory cells. The application of negative voltage to the group of word lines limits leakage current contributions from the associated memory cells in the column of memory cells when performing a verify operation.
    • 本发明提供一种用于确定闪存设备中的程序和擦除状态的方法。 具体地,本发明的一个实施例公开了一种用于使非易失性浮动栅极存储单元的阵列中的状态的错误检测最小化的方法。 多个字线被布置成多行。 多个位线被布置在多个列中。 该方法通过确定与一列存储器单元相关联的所选位线开始。 然后,该方法通过在一个负电压下偏置一组字线来继续。 字线组电耦合到相关联的存储器单元。 当执行验证操作时,将负电压施加到字线组限制了来自存储器单元列中的相关联存储器单元的泄漏电流贡献。
    • 12. 发明申请
    • Analog layout module generator and method
    • 模拟布局模块发生器和方法
    • US20070130553A1
    • 2007-06-07
    • US11295268
    • 2005-12-06
    • Zhigang WangElias FallonRegis Colwell
    • Zhigang WangElias FallonRegis Colwell
    • G06F17/50
    • G06F17/5068G06F17/5063
    • In a computer implemented method of device layout in an integrated circuit design an array having a plurality of cells is selected and stored in a memory of a computer. A schematic view of a plurality of interconnected circuit devices of a circuit is displayed on the computer's display. One or more of the circuit devices of the displayed schematic view are selected by a user. Responsive to the selection of each circuit device, a processing means of the computer populates an empty cell of the array in the memory of the computer with a corresponding layout instance of the circuit device, wherein each layout instance represents a physical arrangement of material(s) that form the corresponding selected circuit device.
    • 在集成电路设计中的设备布局的计算机实现方法中,选择具有多个单元的阵列并将其存储在计算机的存储器中。 在计算机的显示器上显示电路的多个互连电路装置的示意图。 所显示的示意图的一个或多个电路装置由用户选择。 响应于每个电路装置的选择,计算机的处理装置用电路装置的相应布局实例填充计算机的存储器中的阵列的空单元,其中每个布局实例表示材料的物理布置 ),形成相应的所选择的电路装置。
    • 14. 发明授权
    • Method of programming a flash memory device using multilevel charge storage
    • 使用多电平电荷存储来编程闪存器件的方法
    • US07042766B1
    • 2006-05-09
    • US10896651
    • 2004-07-22
    • Zhigang WangNian YangZhizheng Liu
    • Zhigang WangNian YangZhizheng Liu
    • G11C16/06
    • G11C11/5628G11C16/12G11C16/3468G11C2211/5621
    • Disclosed is a method of programming a flash memory device to store an amount of charge corresponding to one of a plurality of charged program states. The method can include pulsing the memory device with program voltages including at least a gate voltage. If the gate voltage is greater than or equal to a predetermined minimum threshold voltage for the one of the plurality of charged program states, an amount of charge stored by the memory device can be verified. Otherwise the memory device can be repulsed. This procedure can be carried out until verifying is conducted and the verifying indicates that the amount of charge stored by the memory device corresponds to the one of the plurality of charged program states.
    • 公开了一种编程闪速存储器件以存储对应于多个充电程序状态之一的电荷量的方法。 该方法可以包括使具有至少包括栅极电压的编程电压脉冲存储器件。 如果栅极电压大于或等于多个充电程序状态之一的预定最小阈值电压,则可以验证由存储器件存储的电荷量。 否则可能会使存储器件发生故障。 可以执行该过程,直到进行验证,并且验证指示存储器件存储的电荷量对应于多个充电程序状态中的一个。
    • 15. 发明授权
    • Method of reference cell design for optimized memory circuit yield
    • 参考电池设计方法优化了存储器电路的产量
    • US07020022B1
    • 2006-03-28
    • US10887782
    • 2004-07-09
    • John WangZhigang WangXin Guo
    • John WangZhigang WangXin Guo
    • G11C16/00
    • G11C16/28
    • A method for standard reference cell design is herein disclosed. The method includes determining a first number of individual bits to be employed in a standard reference cell design based on the number of individual bits that are included in core memory cells that are to be measured using the standard reference cell. The method further includes determining a range of variation in the core memory cells to be measured that is due to process variation in the generation of the core memory cells. In addition, the method includes determining an additional number of individual bits to be included in the standard reference cell design based on the determined range of variation. A standard reference cell that includes a number of individual bits equal to the sum of both the first and the additional number of individual bits is generated.
    • 本文公开了一种用于标准参考电池设计的方法。 该方法包括基于使用标准参考小区来测量的核心存储器单元中包含的各个比特的数量来确定在标准参考小区设计中采用的单个比特的第一数量。 该方法还包括确定由于核心存储器单元的产生中的过程变化而导致的要测量的核心存储器单元的变化范围。 此外,该方法包括基于所确定的变化范围来确定要包括在标准参考单元设计中的附加数量的单独位。 生成包括等于第一个和另外个数的个数之和的个别位数的标准参考单元。
    • 16. 发明授权
    • N-Gate/N-Substrate or P-Gate/P-Substrate capacitor to characterize polysilicon gate depletion evaluation
    • N栅极/ N基板或P栅极/ P基板电容器来表征多晶硅栅极耗尽评估
    • US06888157B1
    • 2005-05-03
    • US09917440
    • 2001-07-27
    • Zhigang WangNian YangYue-song He
    • Zhigang WangNian YangYue-song He
    • H01L23/544H01L23/58
    • H01L22/34H01L2924/0002H01L2924/00
    • A capacitor structure for characterizing polysilicon gate depletion effects of a particular semiconductor fabrication process. In one embodiment, an N-Gate/N-Substrate capacitor is fabricated with the semiconductor fabrication process which is being evaluated for its polysilicon gate depletion effects. The N-gate of capacitor structure is driven to depletion while the N-substrate is simultaneously driven to accumulation. Capacitance-voltage measurements are taken. Based on these CV measurements, the polysilicon depletion effects are then obtained for that particular semiconductor fabrication process. In another embodiment, a P-Gate/P-Substrate capacitor is fabricated with the semiconductor fabrication process. The gate of the P-Gate/P-Substrate capacitor is driven to depletion while the substrate is simultaneously driven to accumulation. Based on the CV measurements performed on the P-Gate/P-Substrate capacitor, the polysilicon depletion effects can be obtained for that particular semiconductor fabrication process. In a third embodiment, a capacitor structure device is used to evaluate the polysilicon gate depletion effects of a semiconductor fabrication process. Different voltages are selectively applied to the gate of either an N-Gate/N-Substrate capacitor or a P-Gate/P-Substrate capacitor while its capacitance is measured. Based on the CV measurements, the polysilicon gate depletion effects for that particular semiconductor fabrication process is characterized.
    • 用于表征特定半导体制造工艺的多晶硅栅极耗尽效应的电容器结构。 在一个实施例中,通过正在评估其多晶硅栅极耗尽效应的半导体制造工艺来制造N栅极/ N-衬底电容器。 驱动电容器结构的N栅极耗尽,同时驱动N衬底进行积累。 进行电容电压测量。 基于这些CV测量,然后获得针对该特定半导体制造工艺的多晶硅耗尽效应。 在另一个实施例中,通过半导体制造工艺制造P栅极/ P-基板电容器。 P栅极/ P基板电容器的栅极被驱动为耗尽,同时基板同时被驱动以累积。 基于在P型栅极/ P-基板电容器上执行的CV测量,可以获得针对该特定半导体制造工艺的多晶硅耗尽效应。 在第三实施例中,使用电容器结构器件来评估半导体制造工艺的多晶硅栅极耗尽效应。 在测量其电容时,不同的电压选择性地施加到N栅极/ N基板电容器或P栅极/ P基板电容器的栅极。 基于CV测量,对该特定半导体制造工艺的多晶硅栅极耗尽效应进行了表征。
    • 20. 发明授权
    • Efficient method to detect process induced defects in the gate stack of flash memory devices
    • 高效的方法来检测闪存器件的栅极堆叠中的工艺引起的缺陷
    • US06717850B1
    • 2004-04-06
    • US10313676
    • 2002-12-05
    • Jiang LiNian YangZhigang WangJohn Jianshi Wang
    • Jiang LiNian YangZhigang WangJohn Jianshi Wang
    • G11C1604
    • G11C29/50G11C16/04G11C2029/0403
    • A method of processing a semiconductor device is disclosed and comprises applying a relatively high voltage across a gate stack of a flash memory cell for a certain period of time. Then, the polarity of the applied voltage is reversed and is again applied across the gate stack for another certain period of time. The voltage applied is greater than a channel erase voltage utilized for the memory cell. This applied voltage causes extrinsic defects to become amplified at interfaces of oxide/insulator layers of the gate stack. Then, the memory cell is tested (e.g., via a battery of tests) in order to determine if the memory cell is defective. If the cell is defective (e.g., fails the test), it can be assumed that substantial extrinsic defects were present in the memory cell and have been amplified resulting in the test failure. If the cell passes the test, it can be assumed that the memory cell is substantially free from extrinsic defects. Defective memory cells/devices can be marked or otherwise indicated as being defective.
    • 公开了一种处理半导体器件的方法,并且包括在闪存单元的栅极堆叠上施加相当高的电压一段时间。 然后,施加的电压的极性反转,并再次施加在栅极堆叠另外一段时间。 施加的电压大于用于存储器单元的通道擦除电压。 该施加的电压导致外部缺陷在栅极堆叠的氧化物/绝缘体层的界面处被放大。 然后,测试存储器单元(例如,通过测试电池),以便确定存储器单元是否有故障。 如果细胞有缺陷(例如,测试失败),则可以认为在存储单元中存在大量的外在缺陷并且被放大,导致测试失败。 如果单元通过测试,则可以认为存储单元基本上没有外在缺陷。 存储器单元/器件不良或可能被标记为有缺陷。