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热词
    • 15. 发明授权
    • Heat sink assembly
    • 散热器组件
    • US07342795B2
    • 2008-03-11
    • US11244916
    • 2005-10-05
    • Hsieh-Kun LeeChun-Chi ChenShi-Wen ZhouZhan Wu
    • Hsieh-Kun LeeChun-Chi ChenShi-Wen ZhouZhan Wu
    • H05K7/20F28F7/00
    • H01L23/4006H01L2924/0002H01L2924/00
    • A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
    • 散热器组件包括散热器(10),从扩展器延伸的多个散热片(12),紧固件(20)和固定到紧固件的固定套管(30)。 紧固件包括具有螺纹底端(208)的头部(200)和轴(204)。 套筒包括圆柱形壁(302),上开口端(304)和下开口端(306)。 套筒还具有与壁垂直连接并在下开口端延伸的环形基座(308)。 头部被接收在墙壁上并接触基座。 轴延伸穿过吊具。 压头弹簧(22)在头部和吊具之间提供,用于向下推动吊具以与发热电子装置接合。
    • 17. 发明申请
    • HEAT DISSIPATION DEVICE
    • 散热装置
    • US20070217162A1
    • 2007-09-20
    • US11309758
    • 2006-09-22
    • Shi-Wen ZhouChun-Chi ChenZhan Wu
    • Shi-Wen ZhouChun-Chi ChenZhan Wu
    • H05K7/20
    • H01L23/427H01L23/4006H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation device includes a heat sink and a back plate assembly thermally independent from the sink. The back plate assembly includes a body facing a bottom surface of the heat sink and a heat-dissipating member thermal connecting to the body. The heat sink is used for absorbing heat generated by a heat-generating electronic component from a top side thereof. The back plate assembly is used for absorbing the heat generated by the heat-generating electronic component from a bottom side thereof. The heat sink and the back plate assembly are connected together by fixing members extending from the heat sink through a printed circuit board on which the electronic component is mounted to threadedly engage with the back plate assembly.
    • 散热装置包括散热器和与散热器热独立的背板组件。 背板组件包括面向散热器的底表面的主体和连接到主体的散热构件。 散热器用于从其顶侧吸收由发热电子部件产生的热量。 背板组件用于从其底侧吸收由发热电子部件产生的热量。 散热器和背板组件通过从散热器延伸的固定部件通过印刷电路板连接在一起,电路板安装在印刷电路板上,以与背板组件螺纹接合。
    • 20. 发明授权
    • Heat dissipation device with heat pipes
    • 带热管的散热装置
    • US07610950B2
    • 2009-11-03
    • US11557917
    • 2006-11-08
    • Jun CaoZhan WuShi-Wen Zhou
    • Jun CaoZhan WuShi-Wen Zhou
    • H01L23/427F28D15/02
    • H01L23/467F28D15/0275H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
    • 一种散热装置,包括第一基板(10),布置在第一基板上的翅片组(30),安装在第一基板和翅片组上的第一热管(50)和第二热管 )连接在第一基板上并延伸穿过翅片组。 第一和第二热管中的每一个包括吸收部分和消散部分。 第一和第二热管的吸收部分为L形并且在相反方向上定向,并且第一和第二热管的散热部分彼此垂直取向,由此附接有电子部件的第一基板的热量可以 从第一基板到散热片组的更多不同的散热路径。