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11. 发明授权

US06174841B1 Heat-reducing silicone grease composition and semiconductor device using the same 有权
标题翻译：减热硅脂组合物及使用其的半导体装置
公开(公告)号：US06174841B1
公开(公告)日：2001-01-16
申请号：US09409902
申请日：1999-10-01
申请人： Kunihiro Yamada , Kenichi Isobe , Takayuki Takahashi
发明人： Kunihiro Yamada , Kenichi Isobe , Takayuki Takahashi
IPC分类号： C10M11308
CPC分类号： C10M111/04 , C10M2201/0613 , C10M2201/0623 , C10M2229/0415 , C10M2229/0475 , C10M2229/0525 , C10N2220/082 , C10N2240/20 , C10N2250/10 , H01L23/3737 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , C10N2210/04 , C10N2210/03 , C10N2210/02 , H01L2924/00
摘要： A heat-reducing silicone grease composition comprising a mixture of (A) 50-95 weight % of aluminum nitride powder having an average particle size of 0.5-10 &mgr;m and containing no particles 100 &mgr;m or greater in size, (B) 5-50 weight % of liquid silicone having a viscosity of 50-500,000 cs at 25° C. and (C) 0-30 weight % of at least one powder selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders; and a semiconductor device to which the foregoing silicone grease composition is applied.
摘要翻译：一种减热硅油组合物，其包含（A）50-95重量％的平均粒径为0.5-10μm的氮化铝粉末并且不含粒径为100μm或更大的颗粒的混合物，（B）5-50 在25℃下粘度为50-500,000cs的液体硅氧烷的重量％和（C）0-30重量％的选自氧化锌，氧化铝，氮化硼和碳化硅粉末的至少一种粉末; 以及应用上述硅氧烷润滑脂组合物的半导体装置。

12. 发明授权

US6136758A Aluminum nitride powder and thermally conductive grease composition using the same 有权
标题翻译：氮化铝粉末和使用其的导热油脂组合物
公开(公告)号：US6136758A
公开(公告)日：2000-10-24
申请号：US209455
申请日：1998-12-11
申请人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
发明人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
IPC分类号： C01B21/072 , C10M113/16 , C10M169/00 , C10M169/02 , C10M107/50
CPC分类号： C10M169/02 , C01B21/0728 , C10M113/16 , C10M169/00 , C10M2201/0613 , C10M2201/0616 , C10M2201/0626 , C10M2227/045 , C10N2210/02 , C10N2210/03 , C10N2250/10 , C10N2260/00
摘要： An aluminum nitride powder having the surface treated with an organosilane represented by formula, R.sup.I.sub.a R.sup.II.sub.b SiY.sub.4-1-b, and/or a partial hydrolysis condensate thereof to acquire excellent moisture-proof, wherein R.sup.I represents a 6-20C alkyl group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 6-20C alkyl group, R.sup.II represents a 1-20C hydrocarbon group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 1-20C hydrocarbon group, Y represents a hydrolyzable group, a is an integer of 1 to 3 and b is an integer of 0 to 2, provided that a+b is an integer of 1 to 3; and a thermally conductive grease composition comprising (A) 50-95 weight % of the aforementioned surface-treated aluminum nitride powder and (B) 5 to 50 weight % of at least one base oil selected from the group consisting of liquid silicones, liquid hydrocarbons and fluorohydrocarbon oils, and further, if desired, (C) 0-30 weight % of a thicknener selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.
摘要翻译：具有用式表示的有机硅烷表面处理的氮化铝粉末，RIaRIIbSiY4-1-b和/或其部分水解缩合物，以获得优异的防湿性，其中RI表示6-20C烷基或由用卤原子或原子取代与6-20C烷基的碳原子连接的部分或全部氢原子，RII表示1-20C的烃基或通过用卤原子或原子取代部分或全部氢附着于1-20C烃基的碳原子的原子，Y表示可水解基团，a表示1〜3的整数，b表示0〜2的整数，条件是a + b为1〜3的整数。和导热性润滑脂组合物，其包含（A）50-95重量％的上述表面处理的氮化铝粉末和（B）5至50重量％的至少一种基础油，其选自液体硅酮，液体烃和氟代烃油，并且如果需要，（C）0-30重量％的选自氧化锌，氧化铝，氮化硼和碳化硅粉末的增稠剂。

13. 发明授权

US6114429A Thermally conductive silicone composition 有权
标题翻译：导热硅胶组合物
公开(公告)号：US6114429A
公开(公告)日：2000-09-05
申请号：US153334
申请日：1998-09-15
申请人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
发明人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
IPC分类号： C08L83/04 , H01B1/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/46 , C08G77/70
摘要： A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.
摘要翻译：一种导热硅氧烷组合物，其包含（A）5至30重量％的液体硅氧烷，（B）50至94.98重量％的至少一种增稠剂，其选自氧化锌粉末，铝粉末，铝氮化物粉末，氮化硼粉末和碳化硅粉末，（C）0.01〜10重量％的每分子羟基至少一个羟基直接与硅原子连接的有机聚硅氧烷，（D）0.01〜10重量％烷氧基硅烷，从而保持令人满意的导热性能，并且长时间难以引起油渗出。

14. 发明授权

US4180335A High speed serial printer 失效
标题翻译：高速串行打印机
公开(公告)号：US4180335A
公开(公告)日：1979-12-25
申请号：US746262
申请日：1976-11-30
申请人： Kunihiro Yamada
发明人： Kunihiro Yamada
IPC分类号： G06K15/08 , B41J19/18 , B41J19/62 , G06K15/10 , B41J19/00 , B41J5/30
CPC分类号： G06K15/10
摘要： Carriage space and line feed signals produced between consecutive character print signals are accumulated and logically combined to form a resultant signal rather than being executed as produced. In response to a character print signal, the carriage and line feed are moved in accordance with the resultant signal to the designated position and then the print operation is executed.
摘要翻译：在连续字符打印信号之间产生的运送空间和换行信号被积累并逻辑组合以形成合成信号，而不是如所生产的那样执行。响应于字符打印信号，滑架和换行符根据结果信号移动到指定位置，然后执行打印操作。

15. 发明授权

US08817538B2 Nonvolatile semiconductor memory device and method for erasing data thereof 有权
标题翻译：非易失性半导体存储器件及其数据的擦除方法
公开(公告)号：US08817538B2
公开(公告)日：2014-08-26
申请号：US13493370
申请日：2012-06-11
申请人： Kiyotaro Itagaki , Kunihiro Yamada , Yoshihisa Iwata
发明人： Kiyotaro Itagaki , Kunihiro Yamada , Yoshihisa Iwata
IPC分类号： G11C11/34
CPC分类号： G11C16/10 , G11C16/0483 , G11C16/08 , G11C16/16 , G11C16/26 , G11C2213/71 , H01L27/11582 , H01L29/7926
摘要： A control circuit is configured to set a drain-side select transistor and a source-side select transistor connected to a selected memory string to non-conductive states. The control circuit is configured to apply a first voltage to a non-selected word line connected to a gate of a non-selected memory cell in the selected memory string. The control circuit is configured to apply a second voltage to a selected word line connected to a gate of a selected memory cell in the selected memory string. The second voltage is smaller than the first voltage in an erasing operation.
摘要翻译：控制电路被配置为将连接到所选择的存储器串的漏极侧选择晶体管和源极侧选择晶体管设置为非导通状态。控制电路被配置为对连接到所选择的存储器串中未选择的存储器单元的栅极的未选择字线施加第一电压。控制电路被配置为对连接到所选择的存储器串中所选择的存储器单元的栅极的选定字线施加第二电压。在擦除操作中第二电压小于第一电压。

16. 发明申请

US20130105726A1 HEAT-CONDUCTIVE SILICONE COMPOSITION 审中-公开
标题翻译：导热硅胶组合物
公开(公告)号：US20130105726A1
公开(公告)日：2013-05-02
申请号：US13606061
申请日：2012-09-07
申请人： Kenichi TSUJI , Kunihiro Yamada
发明人： Kenichi TSUJI , Kunihiro Yamada
IPC分类号： C09K5/16
CPC分类号： C08K3/08 , C08G77/12 , C08G77/20 , C08K5/0025 , C08K5/5419 , C08K5/5425 , C08K5/56 , C08K13/02 , C08K2003/0806 , C08K2003/0812 , C08L83/04 , C09D183/04 , C08L83/00
摘要： A heat-conductive silicone composition that exhibits reduced thermal contact resistance, while also maintaining high overall thermal conductivity. Specifically, a heat-conductive silicone composition comprising silver particles that undergo an exothermic reaction at a temperature of 260° C. or lower. One embodiment of the composition comprises (A) an organopolysiloxane comprising at least two alkenyl groups within each molecule, and having a kinematic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) an organohydrogenpolysiloxane comprising at least two hydrogen atoms bonded to silicon atoms within each molecule, (C) a platinum-based hydrosilylation reaction catalyst, (D) a reaction retarder, (E) silver particles that undergo an exothermic reaction at a temperature of 260° C. or lower, and (F) a heat-conductive filler, other than the component (E), having a thermal conductivity of at least 10 W/m° C.
摘要翻译：具有降低的热接触电阻的导热硅氧烷组合物，同时还保持高的整体导热性。具体地说，包括在260℃以下的温度下进行放热反应的银粒子的导热性有机硅组合物。组合物的一个实施方案包括（A）在每个分子内包含至少两个烯基的有机聚硅氧烷，并且在25℃下的运动粘度为10至100,000mm 2 / s，（B）包含至少两个氢原子的有机氢聚硅氧烷（C）铂系氢化硅烷化反应催化剂，（D）反应延迟剂，（E）在260℃以下的温度下发生放热反应的银粒子，（F ）除了组分（E）之外的具有至少10W / m℃的热导率的导热填料。

17. 发明申请

US20120119137A1 THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION 有权
标题翻译：导热硅脂润滑脂组合物
公开(公告)号：US20120119137A1
公开(公告)日：2012-05-17
申请号：US13282797
申请日：2011-10-27
申请人： Kenichi Tsuji , Kunihiro Yamada , Hiroaki Kizaki , Nobuaki Matsumoto
发明人： Kenichi Tsuji , Kunihiro Yamada , Hiroaki Kizaki , Nobuaki Matsumoto
IPC分类号： C09K5/10
CPC分类号： C09K5/14 , C08G77/12 , C08G77/18 , C08G77/20 , C08L83/04
摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.
摘要翻译：一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。（C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。

18. 发明申请

US20120026775A1 METHOD OF OPERATING SEMICONDUCTOR MEMORY DEVICE 有权
标题翻译：操作半导体存储器件的方法
公开(公告)号：US20120026775A1
公开(公告)日：2012-02-02
申请号：US13052195
申请日：2011-03-21
申请人： Kunihiro Yamada , Hideaki Aochi , Masaru Kito , Tomoko Fujiwara , Yoshiaki Fukuzumi , Ryouhei Kirisawa , Yoshimasa Mikajiri , Kaori Kawasaki
发明人： Kunihiro Yamada , Hideaki Aochi , Masaru Kito , Tomoko Fujiwara , Yoshiaki Fukuzumi , Ryouhei Kirisawa , Yoshimasa Mikajiri , Kaori Kawasaki
IPC分类号： G11C17/12
CPC分类号： G11C16/0483 , G11C16/22 , H01L27/11578 , H01L27/11582
摘要： According to one embodiment, a method of operating a semiconductor memory device is disclosed. The method can include storing read-only data in at least one selected from a memory cell of an uppermost layer and a memory cell of a lowermost layer of a plurality of memory cells connected in series via a channel body. The channel body extends upward from a substrate to intersect a plurality of electrode layers stacked on the substrate. The method can include prohibiting a data erase operation of the read-only memory cell having the read-only data stored in the read-only memory cell.
摘要翻译：根据一个实施例，公开了一种操作半导体存储器件的方法。该方法可以包括将至少一个从通过主体连接的多个存储单元的最上层的存储单元和最下层的存储单元中选出的至少一个存储在只读数据中。通道体从衬底向上延伸以与堆叠在衬底上的多个电极层交叉。该方法可以包括禁止具有存储在只读存储器单元中的只读数据的只读存储器单元的数据擦除操作。

19. 发明授权

US07141273B2 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US07141273B2
公开(公告)日：2006-11-28
申请号：US10958251
申请日：2004-10-06
申请人： Akihiro Endo , Kunihiko Mita , Akio Nakano , Kunihiro Yamada , Hiroaki Kizaki , Hiroaki Tetsuka
发明人： Akihiro Endo , Kunihiko Mita , Akio Nakano , Kunihiro Yamada , Hiroaki Kizaki , Hiroaki Tetsuka
IPC分类号： B05D3/02
CPC分类号： H01L23/3737 , C08G77/12 , C08G77/18 , C08G77/20 , C08K3/08 , C08K5/5419 , C08L83/04 , C08L2205/02 , C08L2205/03 , C09K5/14 , H01L2224/16 , H01L2224/73253 , Y10T428/31663 , C08L83/00
摘要： Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 μm, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.
摘要翻译：提供了一种可固化的有机基聚硅氧烷组合物，其包含（A）在每个分子内含有至少2个与硅原子键合的烯基的有机聚硅氧烷，（B）含有与每个分子内的硅原子键合的至少2个氢原子的有机氢聚硅氧烷，（C）镓和/或其合金，熔点在0-70℃的范围内，任选地（D）平均粒径在0.1-100μm范围内的导热填料，（E）铂基催化剂，（F）加成反应控制剂。该组合物可用作能够形成具有优异导热性的层的材料，其夹在发热电子部件和散热构件之间。

20. 发明授权

US06940722B2 Heat-dissipating member, manufacturing method and installation method 失效
标题翻译：散热构件，制造方法和安装方法
公开(公告)号：US06940722B2
公开(公告)日：2005-09-06
申请号：US10347599
申请日：2003-01-22
申请人： Hiroaki Tetsuka , Kunihiko Mita , Kunihiro Yamada , Yoshitaka Aoki , Tsutomu Yoneyama
发明人： Hiroaki Tetsuka , Kunihiko Mita , Kunihiro Yamada , Yoshitaka Aoki , Tsutomu Yoneyama
IPC分类号： H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , F28F2013/006 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 μm and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 μm. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, together with a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, such that (1)/[(1)+(2)]=0.2-1.0.
摘要翻译：夹在由于操作而达到比室温高的温度的散热电子部件之间的散热部件，以及用于散发由该散热电子部件产生的热量的散热部件。本发明的散热构件具有中间层，其包含厚度为1-50μm，导热率为10-500W / mK的金属箔和/或金属网，以及包括含有100 重量份硅树脂和1000-3,000重量份形成在中间层的两个表面上的导热填料，使得总厚度在40-500μm的范围内。该散热构件在室温下为非流体，但是由于电子部件运转时发出的热量的作用，其粘度降低，并且基于树脂和低熔点金属的相变而软化或熔化，因此它有效地与电子部件和散热部件之间的边界紧密接触而没有任何间隙。导热性填料含有熔融温度为40〜250℃，粒径为0.1〜100μm的低熔点金属粉末（1），以及具有熔融温度的导热性粉末（2）超过250℃，平均粒径为0.1-100μm，使得（1）/ [（1）+（2）] = 0.2-1.0。

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