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11. 发明授权

US07439611B2 Circuit board with auxiliary wiring configuration to suppress breakage during bonding process 有权
标题翻译：具有辅助配线配置的电路板，可抑制接合过程中的破损
公开(公告)号：US07439611B2
公开(公告)日：2008-10-21
申请号：US11534288
申请日：2006-09-22
申请人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
发明人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
IPC分类号： H01L23/495
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H05K1/111 , H05K1/189 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , Y02P70/611
摘要： A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.
摘要翻译：提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起，导电布线。辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

12. 发明申请

US20050199979A1 Semiconductor device and method for fabricating the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050199979A1
公开(公告)日：2005-09-15
申请号：US11122094
申请日：2005-05-05
申请人： Nozomi Shimoishizaka , Kazuyuki Kaino , Yoshifumi Nakamura , Keiji Miki , Kazumi Watase , Ryuichi Sahara
发明人： Nozomi Shimoishizaka , Kazuyuki Kaino , Yoshifumi Nakamura , Keiji Miki , Kazumi Watase , Ryuichi Sahara
IPC分类号： H01L21/768 , H01L21/822 , H01L23/12 , H01L23/31 , H01L23/48 , H01L23/522 , H01L27/04 , H01L29/00
CPC分类号： H01L23/3114 , H01L23/5227 , H01L2224/0401 , H01L2224/05555 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.
摘要翻译：半导体器件具有半导体芯片，第一绝缘膜和电感器。半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。

13. 发明授权

US5997189A Automatic developer for photosensitive material 失效
标题翻译：感光材料的自动显影剂
公开(公告)号：US5997189A
公开(公告)日：1999-12-07
申请号：US194498
申请日：1998-11-25
申请人： Yoshifumi Nakamura , Hisashi Negoro
发明人： Yoshifumi Nakamura , Hisashi Negoro
IPC分类号： G03D3/02 , G03D3/06 , G03D3/13 , G03D3/08
CPC分类号： G03D3/02 , G03D3/06 , G03D3/065 , G03D3/132
摘要： A liquid channel (411a) is formed in an upper end of a partition wall (411) between subtanks (41) and (42) each filled with a fixing liquid to draw the fixing liquid from the subtank (42) into the subtank (41), and a guide plate including an opposing plate (411d) is provided in the subtank (41) to guide the fixing liquid downward. A liquid channel (431a) is formed in an upper end of a partition wall (431) between subtanks (43) and (44) each filled with a stabilizing liquid to draw the stabilizing liquid from the subtank (44) into the subtank (43), and a guide plate including an opposing plate (431d) is provided in the subtank (43) to guide the stabilizing liquid downward. A liquid channel (441a) is formed in an upper end of a partition wall (441) between subtanks (44) and (45) each filled with a stabilizing liquid, and a guide plate including an opposing plate (441d) is provided in the subtank (44).
摘要翻译： PCT No.PCT / JP98 / 01658 Sec。 371日期：1998年11月25日 102（e）1998年11月25日日期PCT提交1998年4月10日PCT公布。第WO98 / 01658号公报日期1998年10月15日液体通道（411a）形成在每个填充有定影液的子容器（41）和（42）之间的分隔壁（411）的上端，以从子容器（42）抽取定影液，在子容器41中设置有包括相对的板411d的引导板，以将定影液向下引导。液体通道（431a）形成在每个填充有稳定液体的子容器（43）和（44）之间的分隔壁（431）的上端，以将稳定液从子容器（44）吸入到子容器（43）），并且在副容器（43）中设置包括相对板（431d）的引导板，以将稳定液向下引导。液体通道（441a）形成在每个填充有稳定液体的副容器（44）和（45）之间的分隔壁（441）的上端，并且包括相对板（441d）的引导板设置在子系列（44）。

14. 发明授权

US5627619A Automatic photographic developing machine 失效
标题翻译：自动照相显影机
公开(公告)号：US5627619A
公开(公告)日：1997-05-06
申请号：US675186
申请日：1996-07-03
申请人： Yasuto Kimura , Yoshihiko Nakashima , Yoshifumi Nakamura
发明人： Yasuto Kimura , Yoshihiko Nakashima , Yoshifumi Nakamura
IPC分类号： G03D3/08 , G03D3/13
CPC分类号： G03D3/135
摘要： An automatic photographic developing machine allows a rack to be pushed up only if a feed mechanism of such rack is put under excessive load, and is made of fewer parts and is simple in structure. The rack has a feed mechanism for feeding photosensitive material and is inserted in a treating tank. The rack has an input shaft at its upper portion. The input shaft carries a helical gear in mesh with a worm of a drive shaft. A resilient piece made of synthetic resin is supported on a presser holder slidable in the axial direction of the drive shaft. An end of the resilient member is located opposite the end of the input shaft to prevent the rack from being pushed up. If the force urging the rack upward exceeds the resilience of the resilient piece due to an excessive load applied to the feed mechanism, the resilient piece is resiliently deformed by the input shaft. The rack is thus pushed up, and the helical gear is disengaged from the worm.
摘要翻译：如果这种机架的进给机构处于过载状态，并且由较少的部件制成并且结构简单，则自动摄影显影机允许将机架向上推。机架具有用于馈送感光材料的进给机构，并且插入处理槽中。机架在其上部具有输入轴。输入轴带有与驱动轴的蜗杆啮合的斜齿轮。由合成树脂制成的弹性件支撑在沿驱动轴的轴向方向滑动的压脚架上。弹性构件的端部与输入轴的端部相对设置，以防止机架被向上推。如果由于施加到进给机构的过大的负载而向上推力的力超过弹性件的弹性，则弹性件被输入轴弹性变形。因此，机架被推上，斜齿轮与蜗杆脱离啮合。

15. 发明授权

US5547530A Method of manufacturing a ceramic substrate 失效
标题翻译：制造陶瓷基板的方法
公开(公告)号：US5547530A
公开(公告)日：1996-08-20
申请号：US189482
申请日：1994-01-31
申请人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
发明人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
IPC分类号： H01L21/48 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , B32B31/04 , B32B31/12 , B32B31/24 , C04B41/81
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4867 , H01L2224/48091 , H01L2224/48227 , H01L2924/01087 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0367 , H05K3/4611 , H05K3/4629 , Y10T29/49163 , Y10T428/24273 , Y10T428/24917 , Y10T428/24926
摘要： The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
摘要翻译：本发明的具有多个凸块的陶瓷基板的制造方法包括以下步骤：在生片层叠体的上表面和下表面的至少一个上形成具有多个孔的凸块形成层; 用凸块形成膏填充凸块形成层中的孔; 烧结生片和凸起形成膏的层压体; 以及通过去除所述凸起形成层来形成由所述烧结凸块形成用糊料形成的凸块。

16. 发明授权

US5525402A Ceramic substrate and manufacturing method thereof 失效
标题翻译：陶瓷基板及其制造方法
公开(公告)号：US5525402A
公开(公告)日：1996-06-11
申请号：US393732
申请日：1995-02-24
申请人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
发明人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
IPC分类号： H01L21/48 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4867 , H01L2224/48091 , H01L2224/48227 , H01L2924/01087 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0367 , H05K3/4611 , H05K3/4629 , Y10T29/49163 , Y10T428/24273 , Y10T428/24917 , Y10T428/24926
摘要： The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
摘要翻译：本发明的具有多个凸块的陶瓷基板的制造方法包括以下步骤：在生片层叠体的上表面和下表面的至少一个上形成具有多个孔的凸块形成层; 用凸块形成膏填充凸块形成层中的孔; 烧结生片和凸起形成层的层叠体; 以及通过去除所述凸起形成层来形成由所述烧结凸块形成用糊料形成的凸块。

17. 发明授权

US5400096A Automated print and development apparatus for three dimentional and conventional photographs 失效
标题翻译：自动印刷和开发设备，用于三维和常规照片
公开(公告)号：US5400096A
公开(公告)日：1995-03-21
申请号：US108611
申请日：1993-08-27
申请人： Shigeharu Kamada , Hiroshi Miyawaki , Mitsuhiko Itojima , Hiroto Nakao , Yoshifumi Nakamura , Kazuo Nagaosa
发明人： Shigeharu Kamada , Hiroshi Miyawaki , Mitsuhiko Itojima , Hiroto Nakao , Yoshifumi Nakamura , Kazuo Nagaosa
IPC分类号： G03B27/32 , G03B27/46 , G03D3/13 , G03B35/00
CPC分类号： G03D3/132 , G03B27/32 , G03B27/462
摘要： Handling of emulsion surfaces of both 3D and conventional photographs in the cases of development and drying processes is made possible by the following providing apparatus including a mechanism for selection of emulsion surface or selective reversal of the photographic paper. The difference in the processing time of 3D and conventional photography is dealt with by switching photographic paper conveying routes in the development section when processed such as development, bleach fixing and stabilizing processes take place. Printing of 3D photography is dealt with by making movable either both an exposure station and a lens or just the lens alone. Furthermore, switching is provided between respective lenses for conventional and 3D photographic printing. A suction type exposure station may be used, and may employ a mechanism to control an adhesive force applied to a photographic paper in the conventional and 3D photography. Processing of 3D photography is improved by incorporating a mechanism to allocate photographic papers into more than two lanes. The automated print and development apparatus of the present invention, which is equipped with the above features, is thus an apparatus that has the ability to perform 3D photographic processing in addition to having the functions of a conventional mini-lab, which processes conventional photographs and has the ability to handle a variety of photographic papers and films.
摘要翻译： PCT No.PCT / JP92 / 01672 Sec。 371日期：1993年8月27日 102（e）日期1993年8月27日PCT提交1992年12月21日PCT公布。公开号WO93 / 13454 日期：1993年7月8日。在显影和干燥过程的情况下，3D和常规照片的乳液表面的处理可以通过以下提供的装置实现，该设备包括用于选择乳剂表面的机构或相纸的选择性反转。 3D和传统摄影的处理时间的差异通过在开发处理（如开发，漂白固定和稳定处理）进行时，在开发部分切换照相纸输送路线来处理。 3D摄影的打印是通过使曝光台和镜头两者同时移动，或仅仅透镜来处理。此外，在用于常规和3D照相印刷的相应透镜之间提供切换。可以使用抽吸式曝光站，并且可以采用在常规和3D摄影中控制施加到相纸的粘合力的机构。通过采用将照相纸分配到两个以上车道的机制来改进3D摄影的处理。因此，具有上述特征的本发明的自动打印和显影装置是具有进行3D照相处理的能力的装置，除了具有处理常规照片的常规小型实验室的功能之外，还具有有能力处理各种照相纸和电影。

18. 发明授权

US08655550B2 Electric power steering system and method for controlling the same 有权
标题翻译：电动助力转向系统及其控制方法
公开(公告)号：US08655550B2
公开(公告)日：2014-02-18
申请号：US12558574
申请日：2009-09-14
申请人： Yoshifumi Nakamura , Norio Yamazaki , Shigenori Takimoto , Yoshimichi Kawamoto
发明人： Yoshifumi Nakamura , Norio Yamazaki , Shigenori Takimoto , Yoshimichi Kawamoto
IPC分类号： B62D5/04
CPC分类号： B62D6/04 , B62D5/0463
摘要： An electric power steering system includes an electric assist motor, a controller, a first corrector, and a second corrector. The electric assist motor is configured to assist steering according to a steering assist amount. The controller is configured to control the steering assist amount in accordance with an input steering force. The first corrector is configured to correct the steering assist amount with a correction amount in accordance with a steering torque during running on a cant road. The second corrector is configured to correct the correction amount in accordance with a steering angular velocity.
摘要翻译：电动助力转向系统包括电动辅助电动机，控制器，第一校正器和第二校正器。辅助电动机构造成根据转向辅助量辅助转向。控制器被配置为根据输入的转向力来控制转向辅助量。第一校正器被配置为根据在倾斜道路上行驶期间的转向扭矩以校正量来校正转向辅助量。第二校正器被配置为根据转向角速度校正校正量。

19. 发明授权

US08594880B2 Vehicle body flow suppression device 有权
标题翻译：车身流量抑制装置
公开(公告)号：US08594880B2
公开(公告)日：2013-11-26
申请号：US12989309
申请日：2009-04-21
申请人： Norio Yamazaki , Shigenori Takimoto , Yoshifumi Nakamura , Yoshimichi Kawamoto
发明人： Norio Yamazaki , Shigenori Takimoto , Yoshifumi Nakamura , Yoshimichi Kawamoto
IPC分类号： G06F7/00 , B62D6/00
CPC分类号： G06F7/00 , B62D6/00 , B62D6/007 , B62D6/04
摘要： A vehicle body drifting restraining device restraining a drifting of a vehicle body of a vehicle, the vehicle body drifting restraining device comprising: an activeness level determination unit determining an activeness level of a driver with respect to a movement of the vehicle in a longitudinal direction; and a vehicle body drifting restraining control permission/prohibition switch permitting or prohibiting a control restraining the drifting of the vehicle body, wherein the control restraining the drifting of the vehicle body is executed only when the activeness level determination unit determines that the activeness level is low.
摘要翻译：一种车体漂移抑制装置，其抑制车辆的车身漂移，所述车体漂移抑制装置包括：活动度判定单元，确定驾驶员相对于所述车辆在长度方向上的移动的活动水平; 以及允许或禁止限制车身漂流的控制的车体漂移抑制控制允许/禁止开关，其中，仅当活动度判定单元判定为活动水平低时才执行抑制车身漂移的控制。

20. 发明授权

US08283775B2 Wiring board, semiconductor device and method for manufacturing the same 有权
标题翻译：接线板，半导体器件及其制造方法
公开(公告)号：US08283775B2
公开(公告)日：2012-10-09
申请号：US13049307
申请日：2011-03-16
申请人： Nozomi Shimoishizaka , Yoshifumi Nakamura , Kouichi Nagao
发明人： Nozomi Shimoishizaka , Yoshifumi Nakamura , Kouichi Nagao
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/4334 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/36 , H01L23/3677 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/02166 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/17051 , H01L2224/171 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2224/81136 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/18301 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including a semiconductor element 1 having an active element region 1a, a plurality of element electrodes 2 formed on a principal face of the semiconductor element, external terminals 6 and 7 connected to one or more element electrodes via connection members 8 and 9, one or more first heat-dissipation protrusions 4 formed on the principal face of the semiconductor element, an insulation resin layer 10 covering the principal face of the semiconductor element and the first heat-dissipation protrusions, and a heat-dissipation medium 11 contacting a face of the insulation resin layer on a side opposite to a side contacting front faces of the first heat-dissipation protrusions. At least a part of the active element region is included in a region below a bottom face of the first heat-dissipation protrusion, the first heat-dissipation protrusion is not connected to the external terminal within the active element region, a thermal conductivity of the first heat-dissipation protrusion is larger than a thermal conductivity of the insulation resin layer, and a thickness of the insulation resin layer from the front face of the first heat-dissipation protrusion to the heat-dissipation medium is thinner than a thickness of the insulation resin layer from the principal face of the semiconductor element to the heat-dissipation medium. Thereby, it is possible to improve the speed of dissipating heat from the active element region of the mounted semiconductor element to the heat-dissipation medium.
摘要翻译：一种半导体器件，包括具有有源元件区域1a的半导体元件1，形成在半导体元件的主面上的多个元件电极2，经由连接构件8和9连接到一个或多个元件电极的外部端子6和7，形成在半导体元件的主面上的一个或多个第一散热突起4，覆盖半导体元件的主面的绝缘树脂层10和第一散热突起，以及与面对面接触的散热介质11 绝缘树脂层的与接触第一散热突起的前表面的一侧相反的一侧。有源元件区域的至少一部分被包括在第一散热突起的底面下方的区域中，第一散热突起不与有源元件区域内的外部端子连接，导热系数第一散热突起大于绝缘树脂层的导热率，绝缘树脂层从第一散热突起到散热介质的前表面的厚度比绝缘层的厚度薄树脂层从半导体元件的主面到散热介质。因此，可以提高从安装的半导体元件的有源元件区域到散热介质的散热速度。

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