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1. 发明授权

US5627619A Automatic photographic developing machine 失效
标题翻译：自动照相显影机
公开(公告)号：US5627619A
公开(公告)日：1997-05-06
申请号：US675186
申请日：1996-07-03
申请人： Yasuto Kimura , Yoshihiko Nakashima , Yoshifumi Nakamura
发明人： Yasuto Kimura , Yoshihiko Nakashima , Yoshifumi Nakamura
IPC分类号： G03D3/08 , G03D3/13
CPC分类号： G03D3/135
摘要： An automatic photographic developing machine allows a rack to be pushed up only if a feed mechanism of such rack is put under excessive load, and is made of fewer parts and is simple in structure. The rack has a feed mechanism for feeding photosensitive material and is inserted in a treating tank. The rack has an input shaft at its upper portion. The input shaft carries a helical gear in mesh with a worm of a drive shaft. A resilient piece made of synthetic resin is supported on a presser holder slidable in the axial direction of the drive shaft. An end of the resilient member is located opposite the end of the input shaft to prevent the rack from being pushed up. If the force urging the rack upward exceeds the resilience of the resilient piece due to an excessive load applied to the feed mechanism, the resilient piece is resiliently deformed by the input shaft. The rack is thus pushed up, and the helical gear is disengaged from the worm.
摘要翻译：如果这种机架的进给机构处于过载状态，并且由较少的部件制成并且结构简单，则自动摄影显影机允许将机架向上推。机架具有用于馈送感光材料的进给机构，并且插入处理槽中。机架在其上部具有输入轴。输入轴带有与驱动轴的蜗杆啮合的斜齿轮。由合成树脂制成的弹性件支撑在沿驱动轴的轴向方向滑动的压脚架上。弹性构件的端部与输入轴的端部相对设置，以防止机架被向上推。如果由于施加到进给机构的过大的负载而向上推力的力超过弹性件的弹性，则弹性件被输入轴弹性变形。因此，机架被推上，斜齿轮与蜗杆脱离啮合。

2. 发明授权

US07851904B2 Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure 有权
标题翻译：半导体装置及其制造方法以及半导体装置安装结构
公开(公告)号：US07851904B2
公开(公告)日：2010-12-14
申请号：US11950625
申请日：2007-12-05
申请人： Yukihiro Kozaka , Yoshifumi Nakamura , Michinari Tetani
发明人： Yukihiro Kozaka , Yoshifumi Nakamura , Michinari Tetani
IPC分类号： H01L23/10 , H01L23/58
CPC分类号： H01L23/49572 , G02F1/13452 , H01L23/367 , H01L23/4006 , H01L24/12 , H01L24/50 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05655 , H01L2224/13144 , H01L2224/13155 , H01L2224/16 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/75301 , H01L2224/81205 , H01L2224/81801 , H01L2224/81805 , H01L2224/81894 , H01L2224/81895 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device of the present invention includes: a wiring board 4 in which a conductive wiring 6 is formed on an insulating substrate 5 having an opening 5a; a semiconductor element 2 that has a circuit forming region 2a and an electrode pad 3, and is mounted on the wiring board with the circuit forming region facing the opening, the electrode pad being connected electrically to the conductive wiring via a protruding electrode 3a; a sealing resin 7 that covers the connected portion between the electrode pad and the conductive wiring; a heat dissipating member 9 that is disposed so as to have a portion facing the opening; and a filling material 8 that has a heat conductivity higher than that of the sealing resin, and is filled into the opening, so as to be in contact with the circuit forming region of the semiconductor element and the heat dissipating member. Even when the wiring board has a small area, heat dissipation efficiency can be ensured, and low cost manufacture can be achieved.
摘要翻译：本发明的半导体器件包括：布线基板4，在具有开口部5a的绝缘基板5上形成导电布线6; 具有电路形成区域2a和电极焊盘3的半导体元件2，并且安装在布线板上，电路形成区域面向开口，电极焊盘通过突出电极3a与导电布线电连接; 覆盖电极焊盘和导电布线之间的连接部分的密封树脂7; 散热构件9，其布置成具有面向开口的部分; 以及填充材料8，其具有比密封树脂的热导率高的热导率，并且填充到开口中，以便与半导体元件的电路形成区域和散热构件接触。即使布线板面积小，也能够确保散热效率，能够实现低成本的制造。

3. 发明申请

US20090091021A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090091021A1
公开(公告)日：2009-04-09
申请号：US12211364
申请日：2008-09-16
申请人： Yoshifumi Nakamura
发明人： Yoshifumi Nakamura
IPC分类号： H01L21/56 , H01L23/36
CPC分类号： H01L23/4985 , H01L21/563 , H01L21/565 , H01L23/3735 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05567 , H01L2224/05573 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81801 , H01L2224/838 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/3025 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： An insulating resin 4 is packed between a semiconductor chip 5 and a tape carrier 1, with taper portions 4a formed on the side faces, and a resin layer 7 is formed in close contact with the rear face of the semiconductor chip 5, the tape carrier 1, and the taper portions 4a; further, by forming a metal layer 9 having a depression 8 and formed with a shape enabling close contact with the resin layer 7, the metal layer 9, which functions as a heat spreader, can be fastened stably to the semiconductor chip 5, and moreover heat generated from the semiconductor chip 5 is transmitted efficiently not only from the rear face of the semiconductor chip 5 but from the side faces thereof to the metal layer 9 for heat dissipation, whereby heat dissipation can be improved.
摘要翻译：在半导体芯片5和带状载体1之间填充绝缘树脂4，在侧面形成有锥形部分4a，并且树脂层7形成为与半导体芯片5的背面紧密接触，带状载体 1和锥形部分4a; 此外，通过形成具有凹陷8并形成为能够与树脂层7紧密接触的形状的金属层9，可以将用作散热器的金属层9稳定地紧固到半导体芯片5，此外，从半导体芯片5产生的热量不仅从半导体芯片5的背面，而且从侧面到金属层9有效地传输散热，从而可以提高散热。

4. 发明授权

US07279357B2 Method for fabricating a chip-scale-packaging (CSP) having an inductor 有权
标题翻译：具有电感器的芯片级封装（CSP）的制造方法
公开(公告)号：US07279357B2
公开(公告)日：2007-10-09
申请号：US11122094
申请日：2005-05-05
申请人： Nozomi Shimoishizaka , Kazuyuki Kaino , Yoshifumi Nakamura , Keiji Miki , Kazumi Watase , Ryuichi Sahara
发明人： Nozomi Shimoishizaka , Kazuyuki Kaino , Yoshifumi Nakamura , Keiji Miki , Kazumi Watase , Ryuichi Sahara
IPC分类号： H01L21/311 , H01L21/3205 , H01L23/48
CPC分类号： H01L23/3114 , H01L23/5227 , H01L2224/0401 , H01L2224/05555 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.
摘要翻译：半导体器件具有半导体芯片，第一绝缘膜和电感器。半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。

5. 发明授权

US06784557B2 Semiconductor device including a diffusion layer formed between electrode portions 有权
标题翻译：半导体器件包括在电极部分之间形成的扩散层
公开(公告)号：US06784557B2
公开(公告)日：2004-08-31
申请号：US10307450
申请日：2002-12-02
申请人： Yoshifumi Nakamura , Ryuichi Sahara , Nozomi Shimoishizaka , Kazuyuki Kainou , Keiji Miki , Kazumi Watase , Yasutake Yaguchi
发明人： Yoshifumi Nakamura , Ryuichi Sahara , Nozomi Shimoishizaka , Kazuyuki Kainou , Keiji Miki , Kazumi Watase , Yasutake Yaguchi
IPC分类号： H01L2348
CPC分类号： H01L24/13 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05548 , H01L2224/05557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/114 , H01L2224/116 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/81801 , H01L2924/0001 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00012 , H01L2924/00014 , H01L2224/05552 , H01L2924/013
摘要： The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.
摘要翻译：半导体器件包括在其表面上形成有电极的半导体元件和形成在半导体元件的表面上并与电极电连接的金属布线。金属布线具有用作外部电极的外部电极部分。外部电极部分的厚度大于金属布线的非电极部分的厚度，即除了外部电极部分之外的金属布线的一部分。

6. 发明授权

US06694613B2 Method for producing a printed-circuit board having projection electrodes 失效
标题翻译：一种具有突起电极的印刷电路板的制造方法
公开(公告)号：US06694613B2
公开(公告)日：2004-02-24
申请号：US09873461
申请日：2001-06-05
申请人： Yoshifumi Nakamura , Minehiro Itagaki , Hiroaki Takezawa , Yoshihiro Bessho , Tsukasa Shiraishi
发明人： Yoshifumi Nakamura , Minehiro Itagaki , Hiroaki Takezawa , Yoshihiro Bessho , Tsukasa Shiraishi
IPC分类号： H05K302
CPC分类号： H01L23/49811 , H01L21/4853 , H01L2924/0002 , H05K1/095 , H05K3/4007 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49149 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24926 , H01L2924/00
摘要： A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the parting film. Thus, projection electrodes with a height corresponding to the thickness of the film are formed in a manner such that the projection electrodes are integrated with the via hole conductors.
摘要翻译：一种印刷电路板的制造方法，其特征在于，具有形成贯通预浸料坯的通孔，该预浸料坯具有分隔膜的表面，用导电膏填充通孔; 在加热下压制预浸料以固化预浸料和糊料; 然后剥离分离膜。因此，以使得突起电极与通孔导体一体化的方式形成具有与膜的厚度对应的高度的突起电极。

7. 发明申请

US20150025779A1 CONTROL APPARATUS FOR INTERNAL COMBUSTION ENGINE 有权
标题翻译：内燃机控制装置
公开(公告)号：US20150025779A1
公开(公告)日：2015-01-22
申请号：US14386702
申请日：2013-03-13
申请人： Akito Uchida , Hiroshi Enomoto , Yoshifumi Nakamura
发明人： Akito Uchida , Hiroshi Enomoto , Yoshifumi Nakamura
IPC分类号： F02D29/02 , F02D41/30
CPC分类号： F02D41/065 , F02D29/02 , F02D41/009 , F02D41/30 , F02D2041/0092 , F02D2700/07 , F02N11/0814 , F02N2200/021 , F02N2300/2002 , Y02T10/48
摘要： When a stop position of a piston resulting from the automatic stop is in a range that is on an advance side of a threshold in terms of crank angle, fuel injection is performed at beginning of the automatic restart-up in the cylinder that is in the intake stroke and an ignition is performed in a subsequent initial compression stroke in the same cylinder. When the stop position of the piston resulting is in a range that is on a retard side of the threshold in terms of crank angle, initial fuel injection is performed in the cylinder that next enters an intake stroke among the cylinders of the internal combustion engine after the beginning of automatic restart-up and initial ignition is performed in a subsequent compression stroke in the same cylinder. The threshold is determined in accordance with an amount of deviation of a crank angle.
摘要翻译：当自动停止产生的活塞的停止位置在曲柄角方面处于阈值前进的范围内时，在缸内的自动重起动开始时进行燃料喷射在同一气缸中的后续初始压缩冲程中执行进气冲程和点火。当所产生的活塞的停止位置在曲轴角度处于阈值的延迟侧的范围内时，在下一次进入内燃机的气缸中的进气冲程的气缸中进行初始燃料喷射，在同一气缸中的后续压缩冲程中执行自动重启和初始点火的开始。根据曲轴角度的偏差量确定阈值。

8. 发明授权

US08472099B2 Scanning optical apparatus 有权
标题翻译：扫描光学仪器
公开(公告)号：US08472099B2
公开(公告)日：2013-06-25
申请号：US13051876
申请日：2011-03-18
申请人： Hitoshi Fujino , Yoshifumi Nakamura , Hiroyuki Ominato , Hiroki Yukawa
发明人： Hitoshi Fujino , Yoshifumi Nakamura , Hiroyuki Ominato , Hiroki Yukawa
IPC分类号： G02B26/08
CPC分类号： B41J2/471 , G02B3/04 , G02B13/0005 , G02B26/125 , G02B27/0031
摘要： A scanning optical apparatus includes: a light source; a first optical element configured to convert light emitted from the light source into a beam of light; a second optical element configured to convert the beam of light having passed through the first optical element into a linear image extending in a main scanning direction; a deflecting mirror configured to deflect the beam of light having passed through the second optical element in the main scanning direction; and a third optical element configured to convert the beam of light having been deflected by the deflecting mirror into a spot-like image and focus it on a target surface to be scanned. The third optical element is a single lens having a pair of opposite lens surfaces, and each of the pair of lens surfaces is aspheric in a main scanning plane to satisfy the formula:  ( 1 - S k ⁡ ( y 1 , y 2 ) f t ⁡ ( y 1 , y 2 ) ) · h ⁡ ( y 1 , y 2 ) 
摘要翻译：扫描光学装置包括：光源; 第一光学元件，被配置为将从所述光源发射的光转换成光束; 第二光学元件，被配置为将通过所述第一光学元件的光束转换成沿主扫描方向延伸的线性图像; 偏转镜，被配置为使主扫描方向上穿过第二光学元件的光束偏转; 以及第三光学元件，被配置为将已经被偏转镜偏转的光束转换成斑点状图像，并将其聚焦在待扫描的目标表面上。第三光学元件是具有一对相反透镜表面的单透镜，并且一对透镜表面中的每一个在主扫描平面中是非球面的，以满足公式：（1-S k⁡（y 1，y 2） ft⁡（y 1，y 2））·h⁡（y 1，y 2）è

9. 发明申请

US20110046841A1 VEHICLE BODY FLOW SUPPRESSION DEVICE 有权
标题翻译：车身身体流量抑制装置
公开(公告)号：US20110046841A1
公开(公告)日：2011-02-24
申请号：US12989309
申请日：2009-04-21
申请人： Norio Yamazaki , Shigenori Takimoto , Yoshifumi Nakamura , Yoshimichi Kawamoto
发明人： Norio Yamazaki , Shigenori Takimoto , Yoshifumi Nakamura , Yoshimichi Kawamoto
IPC分类号： B60W30/10
CPC分类号： G06F7/00 , B62D6/00 , B62D6/007 , B62D6/04
摘要： A vehicle body drifting restraining device restraining a drifting of a vehicle body of a vehicle, the vehicle body drifting restraining device comprising: an activeness level determination unit determining an activeness level of a driver with respect to a movement of the vehicle in a longitudinal direction; and a vehicle body drifting restraining control permission/prohibition switch permitting or prohibiting a control restraining the drifting of the vehicle body, wherein the control restraining the drifting of the vehicle body is executed only when the activeness level determination unit determines that the activeness level is low.
摘要翻译：一种车体漂移抑制装置，其抑制车辆的车身漂移，所述车体漂移抑制装置包括：活动度判定单元，确定驾驶员相对于所述车辆在长度方向上的移动的活动水平; 以及允许或禁止限制车身漂流的控制的车体漂移抑制控制允许/禁止开关，其中，仅当活动度判定单元判定为活动水平低时才执行抑制车身漂移的控制。

10. 发明申请

US20090020318A1 Circuit board, and semiconductor device 审中-公开
标题翻译：电路板和半导体器件
公开(公告)号：US20090020318A1
公开(公告)日：2009-01-22
申请号：US12283043
申请日：2008-09-09
申请人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
发明人： Hiroyuki Imamura , Nobuyuki Koutani , Yoshifumi Nakamura , Kenshi Tokushima
IPC分类号： H05K1/00
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49838 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H05K1/111 , H05K1/189 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , Y02P70/611
摘要： A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.
摘要翻译：提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起，导电布线。辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

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