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    • 14. 发明授权
    • Apparatus of fabricating and method of fabricating liquid ejection head, and liquid ejection head
    • 制造液体喷射头的制造方法和液体喷射头
    • US07703894B2
    • 2010-04-27
    • US11231853
    • 2005-09-22
    • Hideyuki OgawaKoichi SaitoNagamitsu TakashimaKatsumi MotojimaKatsunori Ono
    • Hideyuki OgawaKoichi SaitoNagamitsu TakashimaKatsumi MotojimaKatsunori Ono
    • B41J2/045
    • B41J2/1632B41J2/162Y10T29/49401Y10T29/49826
    • An apparatus of fabricating a liquid ejection head is provided. The apparatus includes: a first die including projected streak portions aligned in parallel by a predetermined pitch and gap portions formed between the adjacent projected streak portions, wherein the first die is adapted to form the groove-like recess portions by pressing the projected streak portions to a metal plate; and a second die for supporting the metal plate to which the projected streak portions of the first die are pressed. Each of the projected streak portions includes: an inner wall forming portion for forming an inner wall of the corresponding groove-like recess portion extending in a depth direction of the corresponding groove-like recess portion; a connecting face portion; and an inclined face portion, continuous via the connecting face portion to the inner wall forming portion, for forming a bottom portion of the corresponding groove like recess portion into a substantially V-like shape.
    • 提供一种制造液体喷射头的装置。 该装置包括:第一模具,其包括以预定间距平行排列的突出条纹部分和形成在相邻突出条纹部分之间的间隙部分,其中第一模具适于通过将突出条纹部分按压而形成槽状凹部 金属板; 以及用于支撑第一模具的突出条纹部分的金属板的第二模具。 每个突出部分包括:内壁形成部分,用于形成在相应的槽状凹部的深度方向上延伸的相应的槽状凹部的内壁; 连接面部; 以及经由连接面部分连接到内壁形成部分的倾斜面部分,用于将相应的凹槽状凹部的底部形成为大致V形的形状。
    • 18. 发明授权
    • Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
    • 晶圆拆卸方法,晶圆拆卸装置和晶圆拆卸和移印机
    • US07364616B2
    • 2008-04-29
    • US10554371
    • 2003-05-13
    • Masato TsuchiyaIkuo MashimoKoichi Saito
    • Masato TsuchiyaIkuo MashimoKoichi Saito
    • H01L21/68
    • B65H3/0816B65H3/48H01L21/67092H01L21/6838
    • It is an object of the present invention to provide a wafer release method capable of releasing a wafer safely, simply and certainly and improving a wafer releasing rate, a wafer release apparatus and a wafer release transfer machine using the wafer release apparatus. A wafer release method of the present invention comprises the steps of: pressing the uppermost wafer along an axis direction (L-L′) shifted by an angle in the range of from 15 to 75 degrees from a crystal habit line axis (A-A′) or (B-B′) of the uppermost wafer clockwise or counterclockwise; bending upwardly the peripheral portion of the uppermost wafer so as to cause a bending stress in the uppermost wafer in the axis direction (L-L′) shifted by the angle; blowing a fluid into a clearance between the lower surface of the uppermost wafer and the upper surface of the lower wafer adjacent thereto; and raising the uppermost wafer for releasing.
    • 本发明的目的是提供一种能够安全,简单且可靠地释放晶片并提高晶片释放速率的晶片释放方法,晶片释放装置和使用晶片释放装置的晶片释放转印机。 本发明的晶片释放方法包括以下步骤:沿着从晶体习性线轴(A-A)偏移15至75度的角度的轴向(L-L')按压最上面的晶片 ')或(B-B')的顺时针或逆时针方向; 向上弯曲最上面的晶片的周边部分,以使得最上面的晶片在轴向方向(L-L')上的弯曲应力偏移角度; 将流体吹送到最上面的晶片的下表面和与其相邻的下晶片的上表面之间的间隙中; 并抬起最上面的用于释放的晶片。