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11. 发明申请

US20080164575A1 METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND A WAFER USED THEREIN 有权
标题翻译：制造三维半导体器件的方法及其使用的波形
公开(公告)号：US20080164575A1
公开(公告)日：2008-07-10
申请号：US11956560
申请日：2007-12-14
申请人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
发明人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
IPC分类号： H01L21/46 , H01L29/06
CPC分类号： H01L21/46 , H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/11462 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2224/81205 , H01L2224/81801 , H01L2224/83194 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/15311 , H01L2224/11 , H01L2224/81 , H01L2924/00014 , H01L2224/13099
摘要： A method for manufacturing a semiconductor device includes the steps of forming first and second semiconductor wafers each including an array of chips and elongate electrodes, forming a groove on scribe lines separating the chips from one another; coating a surface of one of the semiconductor wafers with adhesive; bonding together the semiconductor wafers while allowing the groove to receive therein excessive adhesive; and heating the wafers to connect the elongate electrodes of both the semiconductor wafers.
摘要翻译：一种制造半导体器件的方法包括以下步骤：形成第一和第二半导体晶片，每个半导体晶片均包括芯片和细长电极阵列，在将芯片彼此分开的划线上形成凹槽; 用粘合剂涂覆其中一个半导体晶片的表面; 将半导体晶片粘合在一起，同时允许凹槽在其中容纳过多的粘合剂; 并加热晶片以连接两个半导体晶片的细长电极。

12. 发明授权

US07122087B2 Method of manufacturing RFID 有权
标题翻译：制造RFID的方法
公开(公告)号：US07122087B2
公开(公告)日：2006-10-17
申请号：US10985934
申请日：2004-11-12
申请人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
发明人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
IPC分类号： B32B37/00
CPC分类号： G06K19/0775 , G06K19/07745 , G06K19/07749 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81191 , H01L2224/81395 , H01L2924/01079
摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.
摘要翻译：存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。因此，该方法抑制天线的变形。

13. 发明申请

US20050085010A1 Wireless communication medium and method of manufacturing the same 有权
标题翻译：无线通信介质及其制造方法
公开(公告)号：US20050085010A1
公开(公告)日：2005-04-21
申请号：US10959082
申请日：2004-10-07
申请人： Shigeharu Tsunoda , Naoya Kanda
发明人： Shigeharu Tsunoda , Naoya Kanda
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01L21/44
CPC分类号： G06K19/07722 , G06K7/0095 , G06K19/07718 , G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83102 , H01L2224/92125 , H01L2924/07811 , H01L2924/00
摘要： A highly reliable inexpensive RFID medium (Radio-frequency Identification medium) and a method of manufacturing the same is provided, particularly for small, thin RFID mediums. A RFID medium includes a transmitting/receiving antenna 2 and an IC chip 3. A rectangular part of a base sheet 1, having a major surface on which transmitting/receiving antennas 2 are formed, is folded along one of the long sides thereof, and the other three sides are bonded to the base sheet 1 so as to cover the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The base sheet 1 has spacing parts of a predetermined shape for covering the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The transmitting/receiving antennas 2 and the spacing parts 22 are arranged alternately. The base sheet 1 is rolled in a roll.
摘要翻译：提供了一种高度可靠的便宜的RFID介质（射频识别介质）及其制造方法，特别是对于小型，薄型的RFID介质。 RFID介质包括发送/接收天线2和IC芯片3.基板1的长边的长边侧折叠有形成发送/接收天线2的主表面的矩形部分，另外三个侧面被接合到基片1上，以覆盖发送/接收天线2和连接到发送/接收天线2的IC芯片3.基片1具有预定形状的间隔部分，用于覆盖发送 /接收天线2和连接到发送/接收天线2的IC芯片3.发送/接收天线2和间隔部分22交替布置。将基片1卷成一卷。

14. 发明授权

US07754581B2 Method for manufacturing a three-dimensional semiconductor device and a wafer used therein 有权
标题翻译：制造其中使用的三维半导体器件和晶片的方法
公开(公告)号：US07754581B2
公开(公告)日：2010-07-13
申请号：US11956560
申请日：2007-12-14
申请人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
发明人： Hiroaki Ikeda , Masakazu Ishino , Hiroyuki Tenmei , Naoya Kanda , Yasuhiro Naka , Kunihiko Nishi
IPC分类号： H01L21/30
CPC分类号： H01L21/46 , H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/11462 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2224/81205 , H01L2224/81801 , H01L2224/83194 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/15311 , H01L2224/11 , H01L2224/81 , H01L2924/00014 , H01L2224/13099
摘要： A method for manufacturing a semiconductor device includes the steps of forming first and second semiconductor wafers each including an array of chips and elongate electrodes, forming a groove on scribe lines separating the chips from one another; coating a surface of one of the semiconductor wafers with adhesive; bonding together the semiconductor wafers while allowing the groove to receive therein excessive adhesive; and heating the wafers to connect the elongate electrodes of both the semiconductor wafers.
摘要翻译：一种制造半导体器件的方法包括以下步骤：形成第一和第二半导体晶片，每个半导体晶片均包括芯片和细长电极阵列，在将芯片彼此分开的划线上形成凹槽; 用粘合剂涂覆其中一个半导体晶片的表面; 将半导体晶片粘合在一起，同时允许凹槽在其中容纳过多的粘合剂; 并加热晶片以连接两个半导体晶片的细长电极。

15. 发明申请

US20080185729A1 SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVICE AND MODULE THEREOF, ASSEMBLED STRUCTURE THEREOF AND FILM SUBSTRATE CONNECTION STRUCTURE 审中-公开
标题翻译：半导体元件及其复合物，半导体器件及其模块，其组装结构和薄膜衬底连接结构
公开(公告)号：US20080185729A1
公开(公告)日：2008-08-07
申请号：US12022516
申请日：2008-01-30
申请人： Masahiro Yamaguchi , Naoya Kanda , Yasuo Amano , Shigeharu Tsunoda
发明人： Masahiro Yamaguchi , Naoya Kanda , Yasuo Amano , Shigeharu Tsunoda
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/49833 , H01L23/538 , H01L24/16 , H01L24/50 , H01L24/86 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/0652 , H01L2225/06527 , H01L2225/06568 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device is provided with a film substrate that has through-vias that are formed by filling a conductive material in through-holes that pass through the front and rear of a film-shaped substrate body and wiring or terminals that connect to the through-vias, with a semiconductor element being mounted on the film-shaped substrate body by terminal members thereof being electrically connected to the wiring or terminals of the film substrate.
摘要翻译：半导体器件具有薄膜基板，该薄膜基板具有通孔，所述通孔通过在通过薄膜状基板主体的前后的通孔中填充导电材料而形成，并且连接到通孔的接线或端子，通孔，其半导体元件通过其端子部件电连接到薄膜基板的布线或端子而安装在膜状基板主体上。

16. 发明授权

US07141451B2 Wireless communication medium and method of manufacturing the same 有权
标题翻译：无线通信介质及其制造方法
公开(公告)号：US07141451B2
公开(公告)日：2006-11-28
申请号：US10959082
申请日：2004-10-07
申请人： Shigeharu Tsunoda , Naoya Kanda
发明人： Shigeharu Tsunoda , Naoya Kanda
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： G06K19/07722 , G06K7/0095 , G06K19/07718 , G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83102 , H01L2224/92125 , H01L2924/07811 , H01L2924/00
摘要： A highly reliable inexpensive RFID medium (Radio-frequency Identification medium) and a method of manufacturing the same is provided, particularly for small, thin RFID mediums.A RFID medium includes a transmitting/receiving antenna 2 and an IC chip 3. A rectangular part of a base sheet 1, having a major surface on which transmitting/receiving antennas 2 are formed, is folded along one of the long sides thereof, and the other three sides are bonded to the base sheet 1 so as to cover the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The base sheet 1 has spacing parts of a predetermined shape for covering the transmitting/receiving antenna 2 and the IC chip 3 connected to the transmitting/receiving antenna 2. The transmitting/receiving antennas 2 and the spacing parts 22 are arranged alternately. The base sheet 1 is rolled in a roll.
摘要翻译：提供了一种高度可靠的便宜的RFID介质（射频识别介质）及其制造方法，特别是对于小型，薄型的RFID介质。 RFID介质包括发送/接收天线2和IC芯片3.基板1的长边的长边侧折叠有形成发送/接收天线2的主表面的矩形部分，另外三个侧面被接合到基片1上，以覆盖发送/接收天线2和连接到发送/接收天线2的IC芯片3.基片1具有预定形状的间隔部分，用于覆盖发送 /接收天线2和连接到发送/接收天线2的IC芯片3.发送/接收天线2和间隔部分22交替布置。将基片1卷成一卷。

17. 发明授权

US5811877A Semiconductor device structure 失效
标题翻译：半导体器件结构
公开(公告)号：US5811877A
公开(公告)日：1998-09-22
申请号：US829144
申请日：1997-03-31
申请人： Ichiro Miyano , Ikuo Kawaguchi , Kunio Matsumoto , Junichi Saeki , Tooru Yoshida , Naoya Kanda , Isamu Yoshida , Michifumi Kawai , Hideo Yamakura , Shigeharu Tsunoda , Ritsuro Orihashi , Masachika Masuda , Sueo Kawai
发明人： Ichiro Miyano , Ikuo Kawaguchi , Kunio Matsumoto , Junichi Saeki , Tooru Yoshida , Naoya Kanda , Isamu Yoshida , Michifumi Kawai , Hideo Yamakura , Shigeharu Tsunoda , Ritsuro Orihashi , Masachika Masuda , Sueo Kawai
IPC分类号： H01L21/50 , H01L21/56 , H01L21/70 , H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50 , H01L25/10 , H01L23/48 , H01L25/18
CPC分类号： H01L21/565 , H01L23/3107 , H01L23/4951 , H01L23/49568 , H01L25/105 , H01L2224/32014 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/4826 , H01L2224/49175 , H01L2224/73215 , H01L2225/1029 , H01L2225/1058 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01019 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/3025 , H01L2924/3511
摘要： An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module utilizing assembled by the stacked semiconductor module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding the LSI from harmful light beams, or a positioning base for mounting a substrate. The above ultra-thin resin molded semiconductor devices are interconnected together in a stacked layout to provide a stacked semiconductor module, and to provide a card type device having a higher function.
摘要翻译：一种超薄树脂模制半导体器件，可靠性高，成本低，安装时易于维修。多个这些半导体器件被堆叠以提供具有比相同体积的半导体器件更高功能的半导体模块，并且提供利用由堆叠的半导体模块组装的卡型模块。在制造半导体模块时，将极薄的引线框架和LSI芯片直接连接在一起，并且通过使用低粘度环氧树脂来暴露LSI芯片的镜面以具有薄的成型。研磨镜面以使半导体器件的整个结构具有更薄的厚度。引线框架的一部分形成为加强构件，散热路径，用于屏蔽LSI免受有害光束的遮光部分或用于安装基板的定位基座。上述超薄树脂模制半导体器件以堆叠的布局互连在一起以提供堆叠的半导体模块，并且提供具有更高功能的卡型设备。

18. 发明申请

US20050130425A1 Method of manufacturing RFID 有权
标题翻译：制造RFID的方法
公开(公告)号：US20050130425A1
公开(公告)日：2005-06-16
申请号：US10985934
申请日：2004-11-12
申请人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
发明人： Naoya Kanda , Kosuke Inoue , Madoka Minagawa , Shigeharu Tsunoda
IPC分类号： G06K19/07 , G06K19/077 , H01R43/02 , H01L21/302 , H01L21/461
CPC分类号： G06K19/0775 , G06K19/07745 , G06K19/07749 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81191 , H01L2224/81395 , H01L2924/01079
摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.
摘要翻译：存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。因此，该方法抑制天线的变形。

19. 发明申请

US20070194135A1 Paper tag identified by using radiofrequency and method of manufacturing the same 失效
标题翻译：使用射频识别的纸标签及其制造方法
公开(公告)号：US20070194135A1
公开(公告)日：2007-08-23
申请号：US11709157
申请日：2007-02-22
申请人： Kosuke Inoue , Naoya Kanda , Hiroshi Honma
发明人： Kosuke Inoue , Naoya Kanda , Hiroshi Honma
IPC分类号： G06K19/06
CPC分类号： G06K19/07728 , G06K19/07749 , G06K19/0775 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/81395 , H01L2924/01057 , H01L2924/01079
摘要： A RFID tag including: a paper-like structure inlaying a RFID thread between a first paper layer and a second paper layer, the RFID thread being connected to a RFID chip through bumps to an antenna arranged onto a base member and being formed with a protecting material provided with a window at a position in which the RFID chip corresponds; wherein a height of an upper surface of the protecting material is larger than a height of an upper surface of the RFID chip.
摘要翻译：一种RFID标签，包括：在第一纸层和第二纸层之间嵌入RFID线的纸状结构，所述RFID线通过凸块连接到RFID芯片，布置在基座上并形成有保护层在RFID芯片对应的位置处设置有窗口的材料; 其中所述保护材料的上表面的高度大于所述RFID芯片的上表面的高度。

20. 发明授权

US4913769A Process for preparing superconductive wiring board 失效
标题翻译：制备超导布线板的工艺
公开(公告)号：US4913769A
公开(公告)日：1990-04-03
申请号：US228297
申请日：1988-08-04
申请人： Naoya Kanda , Takayoshi Sowa , Tetsuya Yamazaki , Hiroaki Okudaira
发明人： Naoya Kanda , Takayoshi Sowa , Tetsuya Yamazaki , Hiroaki Okudaira
IPC分类号： H01L39/24
CPC分类号： H01L39/2464 , Y10S505/816 , Y10S505/82
摘要： The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder.In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question.The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.
摘要翻译：本发明涉及一种包括超导材料或布线形成技术的元件。在其中使用超导材料作为导体的薄膜布线板中，在形成膜之后，应在氧气氛中在高温下进行退火，以便将导体部分转换为超导材料，这使得它成为必要使用无机氧化物作为绝缘膜。这导致了第二和随后的绝缘层的蚀刻对其上提供的布线和绝缘层造成损坏的问题。在本发明中，为了解决上述问题，在设置在第二绝缘层及其后的绝缘层的布线层上设置防过蚀层。本发明通过利用超导材料产生实现多层布线层的形成的效果。

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