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    • 11. 发明授权
    • Non-volatile memory devices and methods of operating the same
    • 非易失性存储器件及其操作方法
    • US07813180B2
    • 2010-10-12
    • US12005376
    • 2007-12-27
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-hee Lee
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-hee Lee
    • G11C7/00
    • H01L29/7881G11C16/3418H01L27/115H01L27/11521H01L29/42328H01L29/42336H01L29/66825
    • Example embodiment non-volatile memory devices may be capable of increased integration and reliability and may provide example methods of operating non-volatile memory devices. Example embodiment non-volatile memory devices may include a first control gate electrode on a semiconductor substrate. A first charge storing layer may be between the semiconductor substrate and the first control gate electrode. A source region may be defined in the semiconductor substrate at one side of the first control gate electrode. A first auxiliary gate electrode may be at the other side of the first control gate electrode and may be recessed into the semiconductor substrate. A first drain region may be defined in the semiconductor substrate at one side of the first auxiliary gate electrode opposite to the first control gate electrode. A bit line may be connected to the first drain region.
    • 示例性实施例非易失性存储器设备可能能够提高集成度和可靠性,并且可以提供操作非易失性存储器设备的示例性方法。 示例性实施例非易失性存储器件可以包括半导体衬底上的第一控制栅电极。 第一电荷存储层可以在半导体衬底和第一控制栅电极之间。 源区域可以在第一控制栅电极的一侧的半导体衬底中限定。 第一辅助栅电极可以在第一控制栅电极的另一侧,并且可以凹入到半导体衬底中。 第一漏极区域可以在第一辅助栅电极的与第一控制栅电极相对的一侧的半导体衬底中限定。 位线可以连接到第一漏区。
    • 12. 发明授权
    • Non-volatile memory device and method of fabricating the same
    • 非易失性存储器件及其制造方法
    • US07700935B2
    • 2010-04-20
    • US11882694
    • 2007-08-03
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • H01L47/00
    • G11C11/5678G11C13/0004H01L27/24
    • A non-volatile memory device and a method of fabricating the same are provided. In the non-volatile memory device, at least one first semiconductor layer of a first conductivity type may be formed spaced apart from each other on a portion of a substrate. A plurality of first resistance variation storage layers may contact first sidewalls of each of the at least one first semiconductor layer. A plurality of second semiconductor layers of a second conductivity type, opposite to the first conductivity type, may be interposed between the first sidewalls of each of the at least one first semiconductor layer and the plurality of first resistance variation storage layers. A plurality of bit line electrodes may be connected to each of the plurality of first resistance variation storage layers.
    • 提供了一种非易失性存储器件及其制造方法。 在非易失性存储器件中,第一导电类型的至少一个第一半导体层可以在衬底的一部分上彼此间隔开形成。 多个第一电阻变化存储层可以接触至少一个第一半导体层中的每一个的第一侧壁。 与第一导电类型相反的第二导电类型的多个第二半导体层可以插入在至少一个第一半导体层和多个第一电阻变化存储层中的每一个的第一侧壁之间。 多个位线电极可以连接到多个第一电阻变化存储层中的每一个。
    • 20. 发明授权
    • Unit cell of a non-volatile memory device, a non-volatile memory device and method thereof
    • 非易失性存储器件的单元,非易失性存储器件及其方法
    • US07551491B2
    • 2009-06-23
    • US11715404
    • 2007-03-08
    • Won-joo KimSuk-pil KimJae-woong HyunYoon-dong ParkJune-mo Koo
    • Won-joo KimSuk-pil KimJae-woong HyunYoon-dong ParkJune-mo Koo
    • G11C11/34
    • G11C16/0433G11C16/0491G11C16/10H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Unit cells of a non-volatile memory device and a method thereof are provided. In an example, the unit cell may include a first memory transistor and a second memory transistor connected to each other in series and further connected in common to a word line, the first and second memory transistors including first and second storage nodes, respectively, the first and second storage nodes configured to execute concurrent memory operations. In another example, the unit cell may include a semiconductor substrate in which first and second bit line regions are defined, first and second storage node layers respectively formed on the semiconductor substrate between the first and second bit line regions, a first pass gate electrode formed on the semiconductor substrate between the first bit line region and the first storage node layer, a second pass gate electrode formed on the semiconductor substrate between the second bit line region and the second storage node layer, a third pass gate electrode formed on the semiconductor substrate between the first and second storage node layers, a third bit line region formed in a portion of the semiconductor substrate under the third pass gate electrode and a control gate electrode extending across the first and second storage node layers. The example unit cells may be implemented within a non-volatile memory device (e.g., a flash memory device), such that the non-volatile memory device may include a plurality of example unit cells.
    • 提供非易失性存储器件的单元电池及其方法。 在一个示例中,单元可以包括串联连接并进一步连接到字线的第一存储晶体管和第二存储晶体管,第一和第二存储晶体管分别包括第一和第二存储节点, 配置为执行并发存储器操作的第一和第二存储节点。 在另一示例中,单元可以包括其中限定了第一和第二位线区域的半导体衬底,分别形成在第一和第二位线区域之间的半导体衬底上的第一和第二存储节点层,形成的第一遍栅极电极 在第一位线区域和第一存储节点层之间的半导体衬底上,形成在第二位线区域和第二存储节点层之间的半导体衬底上的第二遍栅极电极,形成在半导体衬底上的第三栅极电极 在所述第一和第二存储节点层之间形成第三位线区域,所述第三位线区域形成在所述第三栅极电极下方的所述半导体衬底的一部分中,以及跨越所述第一和第二存储节点层延伸的控制栅电极。 示例性单元单元可以在非易失性存储器件(例如,闪存器件)内实现,使得非易失性存储器件可以包括多个示例单位单元。