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    • 13. 发明申请
    • Structures and methods for forming schottky diodes on a p-substrate or a bottom
anode schottky diode
    • 在p型衬底或底部阳极肖特基二极管上形成肖特基二极管的结构和方法
    • US20120007206A1
    • 2012-01-12
    • US13199264
    • 2011-08-23
    • Anup BhallaSik K. LuiYi Su
    • Anup BhallaSik K. LuiYi Su
    • H01L29/47H01L21/329
    • H01L29/872H01L29/0649H01L29/861
    • This invention discloses bottom-anode Schottky (BAS) device supported on a semiconductor substrate having a bottom surface functioning as an anode electrode with an epitaxial layer has a same doped conductivity as said anode electrode overlying the anode electrode. The BAS device further includes an Schottky contact metal disposed in a plurality of trenches and covering a top surface of the semiconductor substrate between the trenches. The BAS device further includes a plurality of doped JBS regions disposed on sidewalls and below a bottom surface of the trenches doped with an opposite conductivity type from the anode electrode constituting a junction barrier Schottky (JBS) with the epitaxial layer disposed between the plurality of doped JBS regions. The BAS device further includes an ultra-shallow Shannon implant layer disposed immediate below the Schottky contact metal in the epitaxial layer between the plurality of doped JBS regions.
    • 本发明公开了一种支撑在具有作为具有外延层的阳极电极的底面的半导体衬底上的底阳极肖特基(BAS)器件具有与覆盖在阳极电极上的所述阳极电极相同的掺杂电导率。 BAS装置还包括设置在多个沟槽中并且在沟槽之间覆盖半导体衬底的顶表面的肖特基接触金属。 BAS器件还包括多个掺杂的JBS区域,其布置在沟槽的底表面的下表面上,掺杂有来自构成结屏障肖特基(JBS)的阳极电极的相反导电类型,其外延层设置在多个掺杂的 JBS地区。 BAS装置还包括在多个掺杂的JBS区域之间的外延层中立即设置在肖特基接触金属下方的超浅香农注入层。