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11. 发明申请

US20080118389A1 Nonoriented Electrical Steel Sheet Excellent In Core Loss 有权
标题翻译：无取向电工钢板优异的芯损
公开(公告)号：US20080118389A1
公开(公告)日：2008-05-22
申请号：US11663095
申请日：2005-09-09
申请人： Wataru O-Hashi , Masafumi Miyazaki , Yousuke Kurosaki , Takeshi Kubota
发明人： Wataru O-Hashi , Masafumi Miyazaki , Yousuke Kurosaki , Takeshi Kubota
IPC分类号： C22C38/02 , C22C38/00
CPC分类号： C22C38/005 , C21D8/12 , C22C38/02 , C22C38/04 , C22C38/06
摘要： A nonoriented electrical steel sheet excellent in core loss comprising copper sulfides with a sphere-equivalent radius of 100 nm or less, wherein the number density of the copper sulfides is less than 1×1010 [inclusions/mm3]. Preferably, the percentage of the number of copper sulfides with a (major axis)/(minor axis) ratio of more than 2 per total number of copper sulfides is 30% or less. The steel preferably further comprises Cu of 0.5 mass % or less and REM of 0.0005% or more and 0.03% or less, wherein the following expression (1) or expressions (1) and (2) are met: [REM]×[Cu]3≧7.5×10−11, (1) ([REM]−0.003)0.1×[Cu]2≦1.25×10−4. (2)
摘要翻译：一种磁芯损耗优异的非取向电工钢，其包含球半径为100nm以下的硫化铜，其中，硫化铜的数量密度小于1×10 10 [夹杂物/ mm 2 > 3 ]。优选地，每个硫化铜总数的（长轴）/（短轴）比大于2的硫化铜的数量的百分比为30％以下。钢优选还含有0.5质量％以下的Cu和0.0005％以上且0.03％以下的REM，其中符合以下表达式（1）或表达式（1）和（2）：< 公式描述=“在线公式”end =“lead”？> [REM] x [Cu] 3+ = 7.5×10 -11，（1） in-line-formula description =“In-line Formulas”end =“tail”？> <？in-line-formula description =“In-line Formulas”end =“lead”？>（[REM] -0.003）< SUP> 0.1×[Cu] 2 <= 1.25×10 -4。（2）<？in-line-formula description =“In-line Formulas”end =“tail”？>

12. 发明申请

US20060243351A1 Non-oriented electrical steel sheet excellent in core loss and manufacturing method thereof 有权
标题翻译：磁芯损耗优异的无方向性电磁钢板及其制造方法
公开(公告)号：US20060243351A1
公开(公告)日：2006-11-02
申请号：US10556148
申请日：2004-04-28
申请人： Wataru Ohashi , Akihito Kiyose , Masafumi Miyazaki , Takeshi Kubota , Yousuke Kurosaki , Yoshihiro Arita , Ken-ichiro Miyamoto , Takashi Sawai
发明人： Wataru Ohashi , Akihito Kiyose , Masafumi Miyazaki , Takeshi Kubota , Yousuke Kurosaki , Yoshihiro Arita , Ken-ichiro Miyamoto , Takashi Sawai
IPC分类号： H01F1/16
CPC分类号： C21D8/1205 , C22C38/005 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/18 , H01F1/14775 , H02K1/02
摘要： A non-oriented electrical steel sheet is characterized in that the number density of inclusions with an equivalent volume diameter of less than 100 nm contained in the steel sheet is 1×1010 [/mm3] or less, and that the steel sheet contains, by mass%, C: up to 0.01%, Si: 0.1% to 7.0%, Al: 0.1% to 3.0%, Mn: 0.1% to 2.0%, REM: 0.0003% to 0.05%, Ti: up to 0.02%, S: up to 0.005%, and N: up to 0.005%, the balance Fe and inevitable impurities and the mass % of Al represented by [All and the mass % of Ti represented by [Ti] satisfy the equation loq([Ti]×[N])−1.19×loq([Al]×[N])+1.84>0 . . . (1).
摘要翻译：无取向电工钢板的特征在于，钢板中所含的等体积直径小于100nm的夹杂物的数量密度为1×10 6 [/ mm 3 / SUP>]以下，钢板以质量％计含有C：0.01％以下，Si：0.1〜7.0％，Al：0.1〜3.0％，Mn：0.1〜2.0％，REM： 0.0003％〜0.05％，Ti：0.02％以下，S：0.005％以下，N：0.005％以下，余量为Fe和不可避免的杂质，Al的质量％为[全部和质量％Ti 由[Ti]表示，满足方程式loq（[Ti] x [N]） - 1.19xloq（[Al] x [N]）+ 1.84> 0。。。（1）。

13. 发明授权

US07085509B2 Process cartridge and electrophotographic image forming apparatus 失效
标题翻译：处理盒和电子照相成像设备
公开(公告)号：US07085509B2
公开(公告)日：2006-08-01
申请号：US11007488
申请日：2004-12-09
申请人： Takeshi Kubota , Hideshi Kawaguchi
发明人： Takeshi Kubota , Hideshi Kawaguchi
IPC分类号： G03G15/00 , G03G21/18
CPC分类号： G03G21/1853 , G03G21/1871 , G03G2221/166
摘要： A process cartridge is detachably mountable to a main assembly of an electrophotographic image forming apparatus. The main assembly includes an output contact movable between electrical connecting and retracting positions, a displaceable member for moving the output contact, and an elastic member for elastically urging the displaceable member to urge the output contact toward the retracted position. The process cartridge includes a drum, a process device actable on the drum, an operating member, a movable operation member operable by the operating member, after mounting the cartridge to the main assembly, to move the displaceable member, in interrelation with which the output contact is moved from the retracted to the electrical connection position against an elastic force of the elastic member, and an input electrical contact for receiving a voltage enabling the process device by engagement with the output contact moved to the electrical connecting position.
摘要翻译：处理盒可拆卸地安装到电子照相成像设备的主组件上。主组件包括可在电连接和缩回位置之间移动的输出触点，用于移动输出触点的可移动构件，以及弹性构件，用于弹性地推动可移位构件以将输出触点推向缩回位置。处理盒包括滚筒，可在滚筒上操作的处理装置，操作构件，在操作构件可操作的可移动操作构件之后，将盒安装到主组件之后，使可移动构件相对于其输出接触件抵抗弹性构件的弹性力从缩回位置移动到电气连接位置;以及输入电接触件，用于接收通过与移动到电气连接位置的输出接触件接合而使得处理装置的电压。

14. 发明申请

US20060110181A1 Process cartridge and electrophotographic image forming apparatus 失效
标题翻译：处理盒和电子照相成像设备
公开(公告)号：US20060110181A1
公开(公告)日：2006-05-25
申请号：US11294538
申请日：2005-12-06
申请人： Takeshi Kubota , Hideshi Kawaguchi
发明人： Takeshi Kubota , Hideshi Kawaguchi
IPC分类号： G03G15/00 , G03G21/18
CPC分类号： G03G21/1853 , G03G21/1871 , G03G2221/166
摘要： A process cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, the main assembly including an output contact movable between an electrical connecting position and a retracted position retracted from the electrical connecting position, a displaceable member for moving the output contact, and an elastic function member for elastically urging the displaceable member to urge the output contact toward the retracted position away from the electrical connecting position, the process cartridge includes A electrophotographic photosensitive drum; process means actable on the electrophotographic photosensitive drum; an operating member; a movable operation member movable relative to a cartridge frame and operable by the operating member, after the process cartridge is mounted to the main assembly of the apparatus, to be engaged with the displaceable member provided in the main assembly of the electrophotographic image forming apparatus to move the displaceable member, in interrelation with which the output contact is moved from the retracted position to the electrical connection position against an elastic force of the elastic function member; and an input electrical contact for receiving a voltage for enabling the process means by engagement with the output contact moved to the electrical connecting position.
摘要翻译：一种可拆卸地安装到电子照相成像设备的主组件的处理盒，所述主组件包括可在电连接位置和从电连接位置缩回的缩回位置之间移动的输出触点，用于移动输出触点的可移位构件，以及弹性功能构件，用于弹性地推动所述可移动构件以将所述输出触点朝向远离所述电连接位置的所述缩回位置推动，所述处理盒包括电子照相感光鼓; 可在电照相感光鼓上作用的处理装置; 操作员; 可移动操作构件，其可相对于盒框架移动，并且在处理盒安装到设备的主组件之后可由操作构件操作，以与设置在电子照相成像设备的主组件中的可移动构件接合，移动所述可移动构件，与所述弹性功能构件的弹性力相反，所述输出触点相对于所述缩回位置移动到所述电连接位置; 以及输入电触点，用于通过与移动到电连接位置的输出触点接合来接收用于使得处理装置能够实现的电压。

15. 发明授权

US06941070B2 Flash device and lens-fitted photo film unit with built-in flash device 失效
标题翻译：闪光灯和带镜头的摄影胶片单元，内置闪光灯
公开(公告)号：US06941070B2
公开(公告)日：2005-09-06
申请号：US10856767
申请日：2004-06-01
申请人： Takeshi Kubota
发明人： Takeshi Kubota
IPC分类号： G03B15/03 , G03B15/05 , G03B17/04 , G03C3/00 , H02M3/338 , H05B41/32
CPC分类号： G03B15/05 , G03B2215/0503 , G03B2219/045
摘要： A charging circuit includes an oscillation transformer and an oscillation transistor. The oscillation transistor oscillates at a secondary current returned from a secondary coil in the charging circuit. The oscillation transistor increases/decreases a primary current, which flows from a battery to a primary coil, and flows the secondary current through the secondary coil to charge a main capacitor. The oscillation transistor, which satisfies the following conditions, is used: a DC current gain hFE1 is 500±10 when a collector-emitter voltage VCE is 2V and a collector current IC is 0.5 A, and a DC current gain hFE2 is 290±10 when the collector-emitter voltage VCE is 2V and the collector current IC is 5 A.
摘要翻译：充电电路包括振荡变压器和振荡晶体管。振荡晶体管以从充电电路中的次级线圈返回的次级电流振荡。振荡晶体管增加/减少从电池流到初级线圈的初级电流，并且使二次电流流过次级线圈以对主电容器充电。使用满足以下条件的振荡晶体管：当集电极 - 发射极电压V CE CE为2V时，DC电流增益h FE1 <500> 10为500±10，集电极当集电极 - 发射极间电压V CE为2V时，电流I C为0.5A，直流电流增益h FE2为290±10，集电极电流I C是5 A.

16. 发明授权

US06564966B2 Sheet feeding apparatus and sheet processing apparatus 失效
公开(公告)号：US06564966B2
公开(公告)日：2003-05-20
申请号：US09963386
申请日：2001-09-27
申请人： Miho Kaiga , Takeshi Kubota
发明人： Miho Kaiga , Takeshi Kubota
IPC分类号： B65H130
CPC分类号： B65H3/5223 , B65H2402/60 , B65H2601/324
摘要： A sheet feeding apparatus and a sheet processing apparatus is provided, in which there are provided in an edge area of an opening 16 a guide groove 12b for guiding insertion of a separating pad unit 18 into the opening 16 from the side on which a sheet feeding roller 6 is disposed and a rotation regulating groove 15c for regulating a rotation regulating fitting shaped portion 15a provided in the separating pad unit 18 to be guided by the guiding groove 12b to be inserted in the opening 16 to locate the separating pad unit 18 in a position in the opening 16 where the separating pad unit 18 should be accommodated, whereby a sheet feeding apparatus and a sheet processing apparatus with improvement of usability as well as improvement of sheet feeding performance are realized.

17. 发明授权

US06236062B1 Liquid crystal display and thin film transistor with capacitive electrode structure 有权
标题翻译：液晶显示器和具有电容电极结构的薄膜晶体管
公开(公告)号：US06236062B1
公开(公告)日：2001-05-22
申请号：US09166175
申请日：1998-10-05
申请人： Tadaki Nakahori , Tetsuya Sakoguchi , Kazuhiko Noguchi , Kouji Yabushita , Takeshi Kubota
发明人： Tadaki Nakahori , Tetsuya Sakoguchi , Kazuhiko Noguchi , Kouji Yabushita , Takeshi Kubota
IPC分类号： H01L2900
CPC分类号： H01L29/66765 , G02F1/1368 , H01L29/78669
摘要： A manufacturing process OF a thin film transistor is provided, in which occurrence of a dry spot and occurrence of an etch residue of an ohmic contact layer (n+ a-Si:H film) due to the dry spot are prevented in photoengraving process for patterning a semiconductor layer and the ohmic contact layer into an island, without any further treatment by any other apparatus. After forming the a-Si:H film 4a which forms the semiconductor layer of the TFT and the n+ a-Si:H film 5a which forms the ohmic contact layer, a N2 gas plasma discharge is continuously performed using the same plasma CVD apparatus, thereby forming a very thin silicon nitride film 6 having a hydrophilic property on a surface layer of the n+ a-Si:H film 5a.
摘要翻译：提供了一种薄膜晶体管的制造方法，其中在光刻图案中防止干斑的发生和由于干斑引起的欧姆接触层（n + a-Si：H膜）的蚀刻残留物的出现半导体层和欧姆接触层进入岛，而不用任何其他设备进一步处理。形成形成TFT的半导体层的a-Si：H膜4a和n + a-Si：H膜5a之后形成欧姆接触层，使用相同的等离子体CVD装置连续进行N2气体等离子体放电，从而在n + a-Si：H膜5a的表面层上形成具有亲水性的非常薄的氮化硅膜6。

18. 发明授权

US6015754A Chemical mechanical polishing apparatus and method 失效
标题翻译：化学机械抛光装置及方法
公开(公告)号：US6015754A
公开(公告)日：2000-01-18
申请号：US996695
申请日：1997-12-23
申请人： Yasukazu Mase , Yoshitaka Matsui , Takeshi Kubota , Toshihiko Kitamura
发明人： Yasukazu Mase , Yoshitaka Matsui , Takeshi Kubota , Toshihiko Kitamura
IPC分类号： B24B37/013 , B24B49/10 , H01L21/304 , H01L21/321 , H01L21/302 , C23F1/02
CPC分类号： B24B37/005 , B24B49/10 , H01L21/32115
摘要： A CMP apparatus is used to subject a target surface of a semiconductor wafer to a polishing treatment, by moving the target surface and a polishing surface of a polishing cloth relative to each other while supplying a polishing liquid between the target surface and the polishing surface. Electric resistance is measured between pairs of measuring points arranged on opposite sides of dicing lines on the target surface, while subjecting the target surface to the polishing treatment. The polishing treatment is caused to be ended by comparing detected values of a changing rate in measured values of the electric property with a reference value set to correspond to an end point of the polishing treatment.
摘要翻译： CMP设备用于通过在目标表面和抛光表面之间提供抛光液体的同时相对于彼此移动目标表面和抛光布的抛光表面来对半导体晶片的目标表面进行抛光处理。在目标表面上的切割线的相对侧的测量点对之间测量电阻，同时对目标表面进行抛光处理。通过将电性能的测量值中的变化率的检测值与设置为对应于抛光处理的终点的参考值进行比较，结束抛光处理。

19. 发明授权

US5763059A Circuit board 失效
标题翻译：电路板
公开(公告)号：US5763059A
公开(公告)日：1998-06-09
申请号：US623979
申请日：1996-03-29
申请人： Kouichi Yamaguchi , Noriaki Hamada , Hideto Yonekura , Takeshi Kubota , Yasuyoshi Kunimatsu , Yasuhide Tami , Masahiko Higashi , Yohji Furukubo
发明人： Kouichi Yamaguchi , Noriaki Hamada , Hideto Yonekura , Takeshi Kubota , Yasuyoshi Kunimatsu , Yasuhide Tami , Masahiko Higashi , Yohji Furukubo
IPC分类号： H01L23/15 , H01L23/498 , H05K1/03 , H05K3/34 , B32B9/00
CPC分类号： H01L23/15 , H01L23/49816 , H01L23/49894 , H05K3/3436 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/16195 , H05K1/0306 , H05K2201/09472 , H05K2201/09745 , H05K2201/10234 , H05K2201/10992 , H05K2203/041 , Y02P70/613 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： In a circuit board obtained by providing a metallized layer of wiring on the surface or interior of an insulation substrate, the insulation substrate is, for example, a multi-layer circuit board or a package for semiconductor element, the insutating substrate obtained from a sintered body having a linear expansion coefficient of 8 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. which is prepared by sintering a molded body containing 20 to 80% of a glass having a liner expansion coefficient of 6 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. and 80 to 20% of a filler having a linear expansion coefficient of at least 6 ppm/.degree. C. When the circuit board of the present invention is surface mounted on an outer electric circuit substrate such as a printed wiring board having a large linear expansion coefficient, the occurrence of stress due to a difference between the linear expansion coefficients of both is suppressed, and the circuit board and the outer electric circuit can be electrically connected accurately and firmly over a long period of time. Furthermore, a mounted structure of a circuit board having high reliability which can sufficiently dealt with the use of multiple pins due to large sizing of a semiconductor element can be realized. Furthermore, simultaneous sintering with the Cu metallized layer can be performed, and since the binder can be removed efficiently, the product is of high quality and is cheap.
摘要翻译：在通过在绝缘基板的表面或内部设置布线的金属化层而获得的电路板中，绝缘基板例如是多层电路基板或半导体元件用封装，所述绝缘基板由烧结在40〜400℃下线膨胀系数为8〜18ppm /℃的本体，其通过烧结含有20〜80％的具有6〜18ppm / 40℃〜40℃，80〜20％的线膨胀系数为6ppm /℃以上的填料。当本发明的电路板表面安装在外部电路基板上时例如具有大的线性膨胀系数的印刷线路板，抑制由于两者的线性膨胀系数之间的差引起的应力的发生，并且电路板和外部电路可以电连接准确而牢固地在很长一段时间内。此外，可以实现具有高可靠性的电路板的安装结构，其可以充分地处理由于半导体元件的大尺寸而使用多个引脚。此外，可以进行与Cu金属化层的同时烧结，并且由于可以有效地除去粘合剂，因此产品质量好并且便宜。

20. 发明授权

US5621451A Image forming apparatus 失效
标题翻译：图像形成装置
公开(公告)号：US5621451A
公开(公告)日：1997-04-15
申请号：US988913
申请日：1993-03-11
申请人： Yoshinori Sugiura , Noriyoshi Ishikawa , Takeshi Setoriyama , Chitose Tenpaku , Tatsuo Hamada , Yoshiro Tsuchiya , Takeshi Kubota , Ken Murooka , Takeshi Niimura , Nobukazu Adachi , Akira Kuroda , Takeshi Sugita , Akira Yuza , Jun Azuma
发明人： Yoshinori Sugiura , Noriyoshi Ishikawa , Takeshi Setoriyama , Chitose Tenpaku , Tatsuo Hamada , Yoshiro Tsuchiya , Takeshi Kubota , Ken Murooka , Takeshi Niimura , Nobukazu Adachi , Akira Kuroda , Takeshi Sugita , Akira Yuza , Jun Azuma
IPC分类号： B41J2/44 , B41J2/47 , B41J13/00 , G03G15/00 , G03G15/16 , G03G15/20 , G03G15/32 , H04N1/00 , H04N1/113 , H04N1/23
CPC分类号： G03G15/04072 , B41J13/00 , B41J2/442 , B41J2/471 , G03G15/326 , G03G15/6529 , G03G21/1623 , H04N1/1135 , G03G2221/183
摘要： An image forming apparatus for performing a recording operation with respect to a recording medium, includes an image forming device for forming an image on a recording medium, a recording medium receiver for receiving the recording medium on which the image is formed, and a laser beam emitter, arranged below the recording medium receiver, for emitting a laser beam in accordance with image information so as to cause the image forming device to form an image. The laser beam emitter is arranged below the recording medium receiver to emit a laser beam obliquely upward.
摘要翻译： PCT No.PCT / JP93 / 00054 Sec。 371日期1993年3月11日 102（e）1993年3月11日PCT 1993年1月18日PCT PCT。出版物WO94 / 15792 日期1994年7月21日一种用于对记录介质执行记录操作的图像形成装置包括用于在记录介质上形成图像的图像形成装置，用于接收其上形成图像的记录介质的记录介质接收器以及布置在记录介质接收器下方的激光束发射器，用于根据图像信息发射激光束，以使图像形成装置形成图像。激光束发射器布置在记录介质接收器下方以向上倾斜地发射激光束。

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