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    • 13. 发明授权
    • Directed-flow conduit
    • 定向导管
    • US08025271B2
    • 2011-09-27
    • US12080409
    • 2008-03-31
    • Paul Robert KolodnerAvinoam KornblitThomas Nikita KrupenkinAlan Michael LyonsTodd Richard Salamon
    • Paul Robert KolodnerAvinoam KornblitThomas Nikita KrupenkinAlan Michael LyonsTodd Richard Salamon
    • B01F3/04
    • F15D1/065B33Y80/00Y10T137/0391Y10T137/87249
    • Device including channel having channel input and output. Channel has interior channel surface extending along channel path from channel input to output. In one implementation, channel includes plurality of channel sections in serial communication along channel path. Each of channel sections includes first internal circumference spaced apart along channel path from second internal circumference, in each of channel sections the first and second internal circumferences being substantially different. Each of channel sections includes sub-surface of interior channel surface. At least region of sub-surface of each channel section includes distribution of raised micro-scale features. As another implementation, at least first region of interior channel surface includes distribution of raised micro-scale features interrupted by plurality of raised barriers spaced apart along channel path on interior channel surface. Each raised barrier extends on interior channel surface in directions partially transverse to and partially parallel to longitudinal axis. Method also provided.
    • 设备包括具有通道输入和输出的通道。 通道具有从通道输入到输出的通道路径延伸的内部通道表面。 在一个实现中,信道包括沿着信道路径串行通信的多个信道段。 每个通道部分包括沿着与第二内圆周的通道路径间隔开的第一内圆周,在每个通道部分中,第一和第二内圆周基本不同。 每个通道部分包括内部通道表面的子表面。 每个通道部分的子表面的至少区域包括凸起的微尺度特征的分布。 作为另一实施方案,内部通道表面的至少第一区域包括由在内部通道表面上沿着通道路径间隔开的多个凸起的屏障中断的凸起的微尺度特征的分布。 每个凸起的屏障在内部通道表面上沿与纵向轴线部分横向并部分平行的方向延伸。 方法也提供。
    • 19. 发明授权
    • Process for fabricating a lithographic mask
    • 光刻掩模的制造工艺
    • US6051346A
    • 2000-04-18
    • US121266
    • 1998-07-23
    • Avinoam KornblitJames Alexander LiddleAnthony Edward Novembre
    • Avinoam KornblitJames Alexander LiddleAnthony Edward Novembre
    • H01L21/027G03F1/20G03F1/22G03F9/00
    • G03F1/22G03F1/20
    • The invention provides an improved process for fabricating masks suitable for use in SCALPEL and similar electron-based or ion-based lithographic processes. Specifically, the process allows use of commercially-available (100) oriented silicon substrates, and better control over the profiles of mask struts. Specifically, the struts of the mask are formed by plasma etching, using a fluorine-based gas, and a unique multilayer mask blank is fabricated to promote successful use of the plasma etch. According to an embodiment of the process, an etch stop layer is deposited onto the front surface of a silicon substrate, and a membrane layer is deposited over the etch stop layer. A scattering layer, typically tungsten, is deposited over the membrane layer. A patterning layer is deposited on the back surface of the substrate, and the desired grillage pattern for the struts is patterned into the patterning layer. The grillage structure is then etched into the silicon, to form the struts, by plasma etching with the fluorine-based gas. The etch stop layer acts to prevent the etch from damaging the membrane layer.
    • 本发明提供了一种用于制造适用于SCALPEL和类似的基于电子或基于离子的光刻工艺的掩模的改进方法。 具体来说,该方法允许使用市售的(100)定向硅衬底,并且更好地控制掩模支柱的轮廓。 具体地,通过使用氟基气体的等离子体蚀刻形成掩模的支柱,并且制造独特的多层掩模坯料以促进等离子体蚀刻的成功应用。 根据该方法的一个实施方案,将蚀刻停止层沉积在硅衬底的前表面上,并且膜层沉积在蚀刻停止层上。 散布层(通常为钨)沉积在膜层上。 图案层沉积在衬底的背面,并且用于支柱的所需格栅图案被图案化成图形层。 然后通过用氟基气体的等离子体蚀刻将格栅结构蚀刻到硅中以形成支柱。 蚀刻停止层用于防止蚀刻损坏膜层。