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11. 发明授权

US08035992B2 Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip 有权
标题翻译：垂直转换，印刷电路板和半导体封装与印刷电路板和半导体芯片
公开(公告)号：US08035992B2
公开(公告)日：2011-10-11
申请号：US12089483
申请日：2006-10-10
申请人： Taras Kushta , Kaoru Narita
发明人： Taras Kushta , Kaoru Narita
IPC分类号： H05K9/00
CPC分类号： H05K1/0222 , H01L23/49827 , H01L23/49838 , H01L2223/6622 , H01L2224/16235 , H01L2924/01004 , H01L2924/01057 , H01L2924/01087 , H01L2924/3011 , H01L2924/3025 , H05K1/115 , H05K1/116 , H05K3/429 , H05K2201/093 , H05K2201/09618 , H05K2201/09636 , H05K2201/09663 , H05K2201/09718
摘要： Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a wave guiding channel is a conductor which includes at least more than one of signal vias 201, an assembly of ground vias 202 surrounding the signal via, ground plates from conductor layers of the PCB connected to the ground vias, closed ground striplines 205 connecting the ground vias and power supply layer.
摘要翻译：提供了在多层PCB中的宽频带中具有高电性能和高屏蔽性能的垂直转换，具有垂直转换的印刷电路板和具有印刷电路板和半导体芯片的半导体封装。在多层PCB的垂直转换中，波导通道是包括至少多于一个信号通孔201的导体，围绕信号通孔的接地通孔202的组件，与连接到地面的PCB的导体层的接地板通孔，连接接地通孔和电源层的闭合接地带状线205。

12. 发明授权

US07952365B2 Resonator, printed board, and method for measuring complex dielectric constant 有权
标题翻译：谐振器，印刷电路板和测量复介电常数的方法
公开(公告)号：US07952365B2
公开(公告)日：2011-05-31
申请号：US11817280
申请日：2006-03-22
申请人： Kaoru Narita , Taras Kushta
发明人： Kaoru Narita , Taras Kushta
IPC分类号： G01R27/04 , G01R27/28 , G01J3/00
CPC分类号： H05K1/0268 , G01R27/2617 , G01R31/2805 , H05K1/16 , H05K3/429 , H05K2201/09618 , H05K2201/10068
摘要： A plurality of through-hole vias connected to conductor layers is disposed with gaps left between these vias around opening parts disposed in the conductor layers in a printed board in which these conductor layers are disposed parallel to each other so as to sandwich a dielectric layer in between. Furthermore, through-hole vias used for excitation are disposed in the opening parts of the conductor layers and regions of the dielectric layer matching these opening parts in a non-contact manner with the conductor layers. When the complex dielectric constant is measured, a high-frequency power is applied to the through-hole vias, and the power loss between the through-hole vias and the conductor layers is measured by the S parameter method. As a result, the complex dielectric constant and the frequency dependency of this complex dielectric constant can be measured with a high precision in a frequency range extending from several gigahertzes to 20 GHz, and there is no electrical interference with other parts even when this resonator is mounted on a board.
摘要翻译：连接到导体层的多个通孔过孔被布置成在印刷电路板的布置在导体层中的开口部分周围的这些通孔之间留有间隙，其中这些导体层彼此平行设置，以将电介质层夹在之间。此外，用于激励的通孔过孔以与导体层非接触的方式设置在导体层的开口部分和与这些开口部分匹配的电介质层的区域。当测量复介电常数时，对通孔通孔施加高频功率，通过S参数法测量通孔和导体层之间的功率损耗。结果，可以在从几千兆赫到20GHz的频率范围内以高精度测量该复合介电常数的复介电常数和频率依赖性，即使该谐振器是安装在板上。

13. 发明授权

US09107300B2 Resonant via structures in multilayer substrates and filters based on these via structures 有权
标题翻译：通过多层基板中的结构的共振和基于这些通孔结构的滤波器
公开(公告)号：US09107300B2
公开(公告)日：2015-08-11
申请号：US13515840
申请日：2009-12-14
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P1/203 , H01P7/08 , H05K1/02 , H05K1/11 , H05K1/16 , H05K3/42
CPC分类号： H05K1/0222 , H01P1/203 , H01P7/08 , H05K1/0251 , H05K1/116 , H05K1/162 , H05K3/429 , H05K2201/09618
摘要： A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers.
摘要翻译：谐振通孔结构设置有多层基板，信号通孔导体和接地通孔。多层基板包括导体层和电介质。电介质隔离每个导体层。信号通孔导体设置在多层基板上。接地通孔通过多层基板和信号通孔导体周围设置。电介质包括布置在导体层平面中的信号通孔和接地通孔之间的两个部分。第一部分设置在第一层和其它导体层之间。第二部分设置在另一层和最后一层导体层之间。

14. 发明授权

US08970327B2 Filter based on a combined via structure 有权
标题翻译：基于组合通孔结构进行过滤
公开(公告)号：US08970327B2
公开(公告)日：2015-03-03
申请号：US13139786
申请日：2008-12-25
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P1/203 , H01P7/08 , H01P1/205 , H01P7/04 , H05K1/02 , H05K1/11 , H05K3/42
CPC分类号： H01P1/2056 , H01P1/203 , H01P7/04 , H01P7/08 , H05K1/0222 , H05K1/0251 , H05K1/116 , H05K3/429 , H05K2201/09454 , H05K2201/09618 , H05K2201/09627 , H05K2201/09718
摘要： A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.
摘要翻译：滤波器设置有平面传输线和连接到平面传输线的一端的（两者）的组合通孔结构。平面传输线和组合通孔结构设置在相同的多层板中。组合通孔结构包括两个工作部件。第一工作部分包括信号通道的段和围绕信号通路的多个接地通路段。第二工作部分包括相同信号通道的段，相同接地通孔的多个段，平滑导电板和波纹状导电板。平滑导电板和波纹状导电板连接到信号通孔。第二工作部分包括相同信号通道的段，相同接地通孔和波纹状导电板的多个段。波纹状导电板与信号通孔相连。

15. 发明申请

US20140085147A1 BROADBAND PATCH ANTENNA 有权
标题翻译：宽带天线天线
公开(公告)号：US20140085147A1
公开(公告)日：2014-03-27
申请号：US14117720
申请日：2011-05-16
申请人： Taras Kushta , Takashi Harada
发明人： Taras Kushta , Takashi Harada
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0414 , H01Q9/0442 , H01Q9/0457 , H01Q21/065
摘要： An antenna of the present invention includes: a first conductive patch having a rectangular shape with corrugations on two opposing sides; and a second conductive patch below said first conductive patch and connected to a feeding point.
摘要翻译：本发明的天线包括：具有在两个相对侧上具有波纹的矩形形状的第一导电贴片; 以及在所述第一导电贴片下面的第二导电贴片并且连接到馈电点。

16. 发明授权

US09583807B2 Hybrid resonators in multilayer substrates and filters based on these resonators 有权
标题翻译：基于这些谐振器的多层衬底中的混合谐振器和滤波器
公开(公告)号：US09583807B2
公开(公告)日：2017-02-28
申请号：US14401426
申请日：2012-05-15
申请人： Taras Kushta , Takashi Harada
发明人： Taras Kushta , Takashi Harada
IPC分类号： H01P1/203 , H01P7/08 , H01P1/208 , H05K1/16 , H05K1/02
CPC分类号： H01P1/203 , H01P1/20345 , H01P1/2088 , H01P7/082 , H05K1/0222 , H05K1/0298 , H05K1/16
摘要： A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias.
摘要翻译：本发明的滤波器包括多层基板，两个端子，接地导体和混合谐振器。多层基板包括多个导体层和被配置为将所述多个导体层彼此隔离的电介质。混合谐振器设置在多层衬底中，并且包括第一和第二谐振元件和连接第一和所述第二谐振元件的耦合条。每个谐振元件包括信号通孔，一组接地通孔和人造电介质。每个信号通孔设置穿过多层基板。每组接地孔通过多层基板设置并且被配置为围绕信号通道。每个人造电介质设置在多层基板中，并且在信号通孔和一组接地通孔之间。人造电介质包括连接到第一信号通孔的导电板和将第一导电板与一组接地通孔隔离的隔离狭缝。

17. 发明申请

US20110248800A1 FILTER BASED ON A COMBINED VIA STRUCTURE 有权
标题翻译：基于组合结构的过滤器
公开(公告)号：US20110248800A1
公开(公告)日：2011-10-13
申请号：US13139786
申请日：2008-12-25
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P1/203
CPC分类号： H01P1/2056 , H01P1/203 , H01P7/04 , H01P7/08 , H05K1/0222 , H05K1/0251 , H05K1/116 , H05K3/429 , H05K2201/09454 , H05K2201/09618 , H05K2201/09627 , H05K2201/09718
摘要： A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.
摘要翻译：滤波器设置有平面传输线和连接到平面传输线的一端的（两者）的组合通孔结构。平面传输线和组合通孔结构设置在相同的多层板中。组合通孔结构包括两个工作部件。第一工作部分包括信号通道的段和围绕信号通路的多个接地通路段。第二工作部分包括相同信号通道的段，相同接地通孔的多个段，平滑导电板和波纹状导电板。平滑导电板和波纹状导电板连接到信号通孔。第二工作部分包括相同信号通道的段，相同接地通孔和波纹状导电板的多个段。波纹状导电板与信号通孔相连。

18. 发明申请

US20100321135A1 DIFFERENTIAL-COMMON MODE RESONANT FILTERS 失效
标题翻译：差分共模共振滤波器
公开(公告)号：US20100321135A1
公开(公告)日：2010-12-23
申请号：US12810200
申请日：2007-12-25
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P7/06
CPC分类号： H01P1/2088 , H01P7/065
摘要： A filter is provided with a multilayer board incorporating a resonator formed by two ground plates opposed to each other and conductive side walls connected to the ground plates; two signal vias provided through the resonator; and two terminals connected to the signal vias to receive a pair of signals. The resonator has a first face of symmetry vertical to the ground plates. The signal vias are disposed symmetrically with respect to the first face of symmetry on a distance from the first face of symmetry.
摘要翻译：滤波器设置有包括由彼此相对的两个接地板形成的谐振器和连接到接地板的导电侧壁的多层板; 通过谐振器提供两个信号通孔; 连接到信号通孔的两个端子接收一对信号。谐振器具有垂直于接地板的对称的第一面。信号通孔相对于第一对称面对称地设置在距第一对称面的距离处。

19. 发明授权

US08994480B2 Resonant elements designed vertically in a multilayer board and filters based on these elements 有权
标题翻译：在多层板中垂直设计的谐振元件和基于这些元件的滤波器
公开(公告)号：US08994480B2
公开(公告)日：2015-03-31
申请号：US13386009
申请日：2009-07-21
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P1/203 , H01P7/04 , H05K1/02 , H01P1/205 , H05K1/11 , H05K3/42
CPC分类号： H01P1/20345 , H01P1/2056 , H01P7/04 , H05K1/0222 , H05K1/0251 , H05K1/116 , H05K3/429 , H05K2201/09381 , H05K2201/09454 , H05K2201/09618 , H05K2201/09718
摘要： A resonant element is provided with a multilayer board, comprising a plurality of conductor layers isolated by a dielectric, a signal via conductor, penetrating through the multilayer board, and a plurality of ground vias, penetrating thought the multilayer board and disposed around the signal via conductor. The multilayer board comprises a first conductor layer, a second conductor layer, and a corrugated conductor layer disposed between the first and the second conductor layers. The corrugated conductor layer comprises a corrugated signal plate, connected to the signal via conductor, and a corrugated ground plate, connected to the plurality of ground vias, isolated from the corrugated signal plate by the dielectric.
摘要翻译：谐振元件设置有多层板，其包括通过电介质隔离的多个导体层，穿过多层板的信号通路导体和多个接地通孔，贯穿于多层板并且围绕信号通过导体。多层板包括第一导体层，第二导体层和布置在第一和第二导体层之间的波纹状导体层。波纹状导体层包括连接到信号通孔导体的瓦楞信号板和连接到多个通孔的波纹接地板，通过电介质隔离波纹信号板。

20. 发明申请

US20130099876A1 VIA STRUCTURES AND COMPACT THREE-DIMENSIONAL FILTERS WITH THE EXTENDED LOW NOISE OUT-OF-BAND AREA 有权
标题翻译：具有扩展的低噪声带外区域的结构和紧凑的三维滤波器
公开(公告)号：US20130099876A1
公开(公告)日：2013-04-25
申请号：US13806824
申请日：2010-06-30
申请人： Taras Kushta
发明人： Taras Kushta
IPC分类号： H01P1/213
CPC分类号： H01P1/20 , H01P1/203 , H05K1/0222 , H05K1/0233 , H05K1/0251 , H05K3/429 , H05K3/4614 , H05K2201/09609 , H05K2201/09618 , H05K2201/0979
摘要： A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.
摘要翻译：本发明的过滤器包括具有多层基板的多个通孔结构。多个通孔结构中的每一个包括第一，第二和第三功能部分。第一功能部的信号通路的一端连接到第二功能部的信号通路的一端，第二功能部的信号通路的另一端连接到第三功能部的两个信号通路。那些信号通道被多个接地通孔包围。滤波器的输入和输出端口连接到每个第一功能部分的信号通道的另一端。

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