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11. 发明授权

US4934920A Apparatus for producing semiconductor device 失效
标题翻译：半导体装置的制造装置
公开(公告)号：US4934920A
公开(公告)日：1990-06-19
申请号：US206743
申请日：1988-06-15
申请人： Shunji Yamauchi , Minoru Tanaka , Kenitiro Sakamoto , Yutaka Morita , Toru Kidera , Hiroki Mieda
发明人： Shunji Yamauchi , Minoru Tanaka , Kenitiro Sakamoto , Yutaka Morita , Toru Kidera , Hiroki Mieda
IPC分类号： B29C43/56 , B29C45/17 , B30B15/00
CPC分类号： B29C43/18 , B29C43/56 , B29C45/1701 , B30B15/0082 , B29C2791/001 , B29L2031/3406 , Y10T29/49121
摘要： An apparatus for producing a semiconductor device includes a dust-proof cover which covers a dust-generating portion in the apparatus such as a mold for effecting resin-molding of the semiconductor device composed of a lead frame and semiconductor chips wire- and die-bonded thereto, and a dust-collecting device for collecting dust which is suspended by the air inside the dust-proof cover.
摘要翻译：一种半导体装置的制造装置，其特征在于，包括覆盖所述设备中的尘埃产生部分的防尘盖，所述设备例如用于进行由引线框架构成的半导体器件和半导体芯片的树脂模制的线模和芯片粘合以及用于收集由防尘罩内的空气悬挂的灰尘的集尘装置。

12. 发明授权

US4283838A Method of making plastic encapsulated semiconductor devices 失效
标题翻译：制造塑料封装半导体器件的方法
公开(公告)号：US4283838A
公开(公告)日：1981-08-18
申请号：US11639
申请日：1979-02-12
申请人： Masahiro Yamane , Toshimi Watanabe , Keiji Itoga , Kiyoshi Ishibashi , Yutaka Morita , Isamu Yamamoto , Kiyoji Imanaka
发明人： Masahiro Yamane , Toshimi Watanabe , Keiji Itoga , Kiyoshi Ishibashi , Yutaka Morita , Isamu Yamamoto , Kiyoji Imanaka
IPC分类号： H01L21/56 , H01L23/31 , H01L23/495 , H01L25/11 , H01L21/28
CPC分类号： H01L23/49562 , H01L21/56 , H01L23/3107 , H01L23/3171 , H01L24/05 , H01L24/33 , H01L25/115 , H01L2224/06181 , H01L2224/32245 , H01L2224/33181 , H01L2224/94 , H01L24/94 , H01L2924/10157 , H01L2924/12036 , H01L2924/1301 , Y10T29/49121 , Y10T29/5147
摘要： The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.
摘要翻译：本发明提供了一种塑料封装半导体器件，其包括具有多个半导体元件保持部件的连接金属板，所述多个半导体元件保持部件在一个方向上与至少两个连接臂串联连接，所述连接臂的截面积小于所述半导体元件保持部，并且在连接方向上设置在所述半导体元件保持部的侧面的内侧。本发明提供一种制备半导体器件的方法，所述半导体器件具有用作汽车二极管的大约5至50安培的相对较大的电流容量并且在批量生产中具有高质量。

13. 发明申请

US20080095841A1 Pharmaceutical Composition, Method for Producing the Same, and Method for Stabilizing Dihydropyridine Compound in the Pharmaceutical Composition 审中-公开
标题翻译：药物组合物，其制备方法和药物组合物中二氢吡啶化合物的稳定化方法
公开(公告)号：US20080095841A1
公开(公告)日：2008-04-24
申请号：US11664725
申请日：2005-10-05
申请人： Toshio Suzuki , Masanobu Yasui , Satoshi Sugawara , Yutaka Morita
发明人： Toshio Suzuki , Masanobu Yasui , Satoshi Sugawara , Yutaka Morita
IPC分类号： A61K9/20 , A61K31/435 , A61K47/02 , A61P9/00 , A61K47/36
CPC分类号： A61K31/4422 , A61K9/0056
摘要： The present invention aims to provide a pharmaceutical composition containing a stable dihydropyridine compound, where improving the stability of dihydropyridine compounds in pharmaceutical compositions under influence of storage conditions and thus providing a pharmaceutical composition with superior handling ability and affordable administration. As such, the present invention is a pharmaceutical composition, comprising a dihydropyridine compound, and at least one selected from iron oxide and carrageenan; and a method for producing a pharmaceutical composition. In addition, the present invention is a method for stabilizing a dihydropyridine compound in a pharmaceutical composition, comprising mixing the dihydropyridine compound and at least one selected from iron oxide and carrageenan; and also a stabilizing agent, wherein the stabilizing agent is utilized for a pharmaceutical composition containing a dihydropyridine compound, and comprises at least one selected from iron oxide and carrageenan.
摘要翻译：本发明的目的在于提供含有稳定的二氢吡啶化合物的药物组合物，其在储存条件的影响下提高药物组合物中二氢吡啶化合物的稳定性，从而提供具有优异的处理能力和可负担的施用的药物组合物。因此，本发明是包含二氢吡啶化合物和选自氧化铁和角叉菜胶中的至少一种的药物组合物，和药物组合物的制造方法。此外，本发明是一种用于在药物组合物中稳定二氢吡啶化合物的方法，包括将二氢吡啶化合物和选自氧化铁和角叉菜聚糖中的至少一种混合; 还有稳定剂，其中稳定剂用于含有二氢吡啶化合物的药物组合物，并且包含选自氧化铁和角叉菜胶的至少一种。

14. 发明授权

US06629160B1 Direct memory access controller 失效
标题翻译：直接内存访问控制器
公开(公告)号：US06629160B1
公开(公告)日：2003-09-30
申请号：US09592865
申请日：2000-06-13
申请人： Yutaka Morita
发明人： Yutaka Morita
IPC分类号： G06F1328
CPC分类号： G06F13/28
摘要： The present invention provides a direct memory access controller used for carrying out a direct memory access transfer of data from a first memory to a second memory, wherein the direct memory access controller has a modulo address arithmetic unit for executing a modulo adjustment to transfer addresses of the first memory by computing a top transfer address of a next transfer datum which should be transferred following to a previously transferred datum which has been stored at a higher address than an address at which the next transfer datum is stored in the first memory, so that the direct memory access controller allows a continuous transfer of all of required data.
摘要翻译：本发明提供了一种直接存储器访问控制器，用于执行从第一存储器到第二存储器的数据的直接存储器访问传输，其中直接存储器存取控制器具有模数地址运算单元，用于执行模数调整以传送地址所述第一存储器通过计算下一个转移数据的顶部传送地址，所述下一个传输数据应该被传送到先前传输的数据，所述先前传输的数据已被存储在比所述第一存储器中存储下一传送数据的地址更高的地址处，使得直接存储器访问控制器允许连续传送所有必需的数据。

15. 发明授权

US5416248A Method of removing volatile chlorinated hydrocarbon base materials 失效
标题翻译：去除挥发性氯化烃基材料的方法
公开(公告)号：US5416248A
公开(公告)日：1995-05-16
申请号：US962918
申请日：1992-10-19
申请人： Mamoru Matsumoto , Yutaka Morita , Junji Hayashi , Takashi Syouji , Hideo Kawamoto
发明人： Mamoru Matsumoto , Yutaka Morita , Junji Hayashi , Takashi Syouji , Hideo Kawamoto
IPC分类号： A62D3/00 , B09C1/02 , B09C1/06 , B09C1/08 , C02F11/12 , C02F11/18 , B09B3/00
CPC分类号： C02F11/18 , B09C1/06 , B09C1/08 , C02F11/12
摘要： A method of removing volatile chlorinated hydrocarbon base materials contained in soil is provided wherein an inorganic compound that is an oxide of an alkali metal or an alkaline earth metal or a sulfate of an alkaline earth metal, which undergoes an exothermic reaction with water, is mixed in powder or granular form with soil containing a water content of 10% to 30% by weight and volatile chlorinated hydrocarbon base material having a normal boiling point in the range of about 60.degree. to about 120.degree. C., the inorganic compound being mixed with the soil in an amount of 0.01 to 0.5 times the weight of the water content.
摘要翻译：提供一种去除土壤中含有的挥发性氯化烃基材料的方法，其中将与水发生放热反应的碱金属或碱土金属或碱土金属的硫酸盐的无机化合物混合粉末或颗粒形式，含有含水量为10％至30％重量的土壤和具有约60至约120℃范围的正常沸点的挥发性氯化烃基材料，将无机化合物与土壤的含量为其重量的0.01〜0.5倍。

16. 发明授权

US5168278A Antenna device for electronic devices 失效
标题翻译：电子设备用天线装置
公开(公告)号：US5168278A
公开(公告)日：1992-12-01
申请号：US852967
申请日：1992-03-17
申请人： Yutaka Morita
发明人： Yutaka Morita
IPC分类号： H01Q1/10 , H01Q1/24 , H04M1/02
CPC分类号： H01Q1/244 , H01Q1/103
摘要： An antenna device having a straight shaft extending from a mount member to be attached to an electronic device, and a cylinder member which comprises an antenna member and slidably fitted around the shaft in intimate contact therewith to define a generally airtight chamber by the outer end of the shaft and the inner surface of the cylinder member. The cylinder member is projectable outward along with the antenna member by an urging force when released from a lock member, the cylinder member being so projectable at a reduced speed by giving a negative pressure to the chamber.
摘要翻译：具有从安装构件延伸以附接到电子设备的直轴的天线装置，以及包括天线构件并且可滑动地装配在轴上以与其紧密接触以形成大体上气密的腔室的气缸构件，轴和缸体的内表面。当从锁定构件释放时，气缸构件通过施加力与天线构件一起向外伸出，气缸构件通过向腔室施加负压而以可降低的速度投射。

17. 发明授权

US4983111A Device for resin sealing semiconductor devices 失效
标题翻译：树脂密封半导体器件
公开(公告)号：US4983111A
公开(公告)日：1991-01-08
申请号：US447866
申请日：1989-12-08
申请人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
发明人： Yasutsugu Tsutsumi , Sueyoshi Tanaka , Tatsuro Takahashi , Yutaka Morita , Hideaki Suezaki , Hiromichi Yamada
IPC分类号： B29C45/02 , B29C45/17 , B30B15/06
CPC分类号： B30B15/06 , B29C45/02 , B29C45/1744
摘要： Apparatus for resin sealing semiconductor devices is disclosed, wherein semiconductor devices such as semiconductor chips are placed in cavities provided in a pair of chase blocks, which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks such as to resin seal the semiconductor devices.Also disclosed is a device for resin sealing semiconductor devices, which device comprises: a pair of chase blocks equipped with cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members adapted to hold the chase blocks over the respective press surfaces of the press machine and to undergo elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities provided in the chase blocks.

18. 发明申请

US20130152765A1 PERCUSSION INSTRUMENT APPARATUS, SYSTEM AND PROCESS 有权
标题翻译：推测仪器设备，系统和过程
公开(公告)号：US20130152765A1
公开(公告)日：2013-06-20
申请号：US13545913
申请日：2012-07-10
申请人： Yutaka Morita , Yoshiaki Mori
发明人： Yutaka Morita , Yoshiaki Mori
IPC分类号： G10D13/02
CPC分类号： G10D13/02 , G10H1/32 , G10H2230/275
摘要： A percussion instrument includes a mainframe having a bottom part defining a lower surface. A head is tensioned over an inner part of the mainframe. A hoop structure is arranged over the outer periphery of the head and applies tension to the head. The hoop structure has a lower surface provided with a plurality of recesses. Female threaded connector parts are contained within the recesses. A plurality of bolts extend through the bottom part of the mainframe and engage the female threaded connector parts, to affix the hoop structure to the mainframe. The bolts extend into the bottom part of the mainframe, such that exposure of the bolts on the upper surface side of the hoop structure can be avoided.
摘要翻译：打击乐器包括具有限定下表面的底部的主机。头部张紧在主机的内部。环形结构布置在头部的外周边上并向头部施加张力。环形结构具有设置有多个凹部的下表面。内螺纹连接器部件包含在凹部内。多个螺栓延伸穿过主机的底部并与内螺纹连接器部分接合，以将箍结构固定在主机上。螺栓延伸到主机的底部，从而可以避免螺栓在箍结构的上表面侧的暴露。

19. 发明授权

US5672364A Apparatus for manufacturing tablets 失效
标题翻译：片剂制造装置
公开(公告)号：US5672364A
公开(公告)日：1997-09-30
申请号：US494924
申请日：1995-06-26
申请人： Heizaburo Kato , Yuki Tsushima , Takayuki Ohwaki , Masaharu Nakajima , Yutaka Morita
发明人： Heizaburo Kato , Yuki Tsushima , Takayuki Ohwaki , Masaharu Nakajima , Yutaka Morita
IPC分类号： A61J1/10 , A61J3/10 , B30B11/10
CPC分类号： A61J3/10 , B30B11/027 , B30B11/10 , B30B15/302
摘要： A method and an apparatus for manufacturing tablets of moist powder which is produced by adding an additive agent such as an excipient or a binder to medical ingredients, further adding a solvent such as water, ethanol or the like, and kneading the mixture. The tablet manufacturing method comprises the steps of: preparing a first table and a second table which are intermittently rotated and driven relatively with respect to each other; supplying moist powder from a hopper into filling holes of the first table; filling the supplied moist powder into mold cavities of the second table under a pressurized condition by means of filling pins of a filling and pressurizing device at a location where the first table overlaps with the second table; relatively moving the first and second tables with respect to each other so as to level the surface of the moist powder in the mold cavities by removing the excessive powder; chamfering the surface of the moist powder by a finish-forming device; drying the moist powder by a dryer; and releasing the moist powder out of the mold cavities by a release device.
摘要翻译：通过向医药成分添加赋形剂或粘合剂等添加剂而进一步添加水，乙醇等溶剂，捏合该混合物而制造的湿粉状片剂的制造方法和装置。片剂制造方法包括以下步骤：制备相对于彼此间歇地旋转和驱动的第一工作台和第二工作台; 将料斗中的潮湿粉末装入第一台的填充孔; 在第一台与第二台重叠的位置处，通过填充和加压装置的填充销填充所供应的潮湿粉末到加压状态下的第二台的模腔中; 相对于彼此相对移动第一和第二台，以通过去除过量的粉末来平衡模具腔中的湿粉末的表面; 通过精整成形装置对潮湿粉末的表面进行倒角; 用干燥机干燥湿粉; 并通过释放装置将湿粉释放出模腔。

20. 发明授权

US5560907A Whitening embellisher 失效
标题翻译：美白精华
公开(公告)号：US5560907A
公开(公告)日：1996-10-01
申请号：US403174
申请日：1995-03-13
申请人： Itaru Sakai , Kana Satoh , Tomohide Tanaka , Yutaka Morita , Takashi Hibi , Yoshio Tanabe , Shigemitsu Osawa , Yasushi Tomita
发明人： Itaru Sakai , Kana Satoh , Tomohide Tanaka , Yutaka Morita , Takashi Hibi , Yoshio Tanabe , Shigemitsu Osawa , Yasushi Tomita
IPC分类号： A61K8/35 , A61K8/49 , A61K8/60 , A61K8/67 , A61Q19/02 , A61Q19/10 , A61K7/48
CPC分类号： A61Q19/10 , A61K8/35 , A61K8/498 , A61K8/60 , A61K8/676 , A61Q19/02 , Y10S514/844 , Y10S514/846 , Y10S514/96
摘要： A whitening embellisher includes, as an active ingredient, teprenone (chemical name: geranylgeranyl-acetone). A whitening and beautifying composition includes teprenone and one or more substances selected from kojic acid, L-ascorbic acid and the like.The whitening embellisher, and whitening and beautifying composition prevent the skin from pigmenting and darkening due to sunburn and/or aging, and quicken fading, and hence make spots and freckles inconspicuous when the preparations are used for external application as a cream or milky lotion.
摘要翻译：作为活性成分的美白精华液含有替普瑞酮（化学名称：香叶基香叶基丙酮）。美白美白组合物包括替普瑞酮和选自曲酸，L-抗坏血酸等的一种或多种物质。美白精华和美白美白组合物防止皮肤因晒伤和/或衰老而着色和变暗，加速褪色，因此当制剂用作外用霜剂或乳液时，斑点和雀斑不明显。

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