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    • 11. 发明授权
    • Silicon-containing polyimide resin and silicon-containing polyamic acid
    • 含硅聚酰亚胺树脂和含硅聚酰胺酸
    • US6001942A
    • 1999-12-14
    • US217075
    • 1998-12-21
    • Masaaki AmakoHaruhiko FurukawaYoshitsugu MoritaHiroshi Ueki
    • Masaaki AmakoHaruhiko FurukawaYoshitsugu MoritaHiroshi Ueki
    • C08G73/10C08G77/455C08G77/04
    • C08G73/1042C08G73/106C08G77/455
    • The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.
    • 本发明涉及一种含硅聚酰亚胺树脂,其包含(I)0.1-100摩尔%的由下式表示的结构单元:其中Ar1是具有至少一个芳族环的四价有机基团,R独立地表示一价无烃基团 的脂肪族不饱和键,X选自亚烷氧基亚烷基或碳原子数2以上的亚烷基,Y为氧原子,亚烷基氧化烯基或碳原子数2以上的亚烷基,l,m,n分别为 整数值为1〜10,p为1〜80的整数,a为0或1; 和(II)99.9至0摩尔%的由下式表示的结构单元:其中Ar 2是具有至少一个芳环的四价有机基团,Ar 3是具有至少一个芳族基团的二价有机基团。
    • 13. 发明授权
    • Flame-retardant thermoplastic resin composition and manufacturing method thereof
    • 阻燃热塑性树脂组合物及其制造方法
    • US06699925B2
    • 2004-03-02
    • US09938251
    • 2001-08-23
    • Hidekatsu HatanakaKoji NakanishiHaruhiko FurukawaKoji ShiromotoHiroshi UekiYoshitsugu Morita
    • Hidekatsu HatanakaKoji NakanishiHaruhiko FurukawaKoji ShiromotoHiroshi UekiYoshitsugu Morita
    • C08K320
    • C08L23/04C08L83/04C08L2201/02C08L83/00
    • A flame-retardant thermoplastic resin composition comprising (A) 100 weight parts of a thermoplastic resin, (B) 10 to 300 weight parts of particulate metal hydroxide; (C) 0.01 to 50 weight parts of a branched polyorganosiloxane having alkoxy groups and described by average unit formula R1a(R2O)bSiO(4−a−b)/2, where R1 and R2 are monovalent hydrocarbon groups selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number; b is a positive number; and a+b is a number from 0.75 to 2.5; (D) 0.01 to 50 weight parts of a branched polyorganosiloxane having silanol groups and described by average unit formula R3a(HO)bSiO(4−a−b)/2, where R3 is a monovalent hydrocarbon group selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number, b is a positive number, and a+b is a number from 0.75 to 2.5; and (E) 0.01 to 10 weight parts of a condensation reaction promoting catalyst. The present invention further relates to a method for manufacturing the flame-retardant thermoplastic resin composition.
    • 一种阻燃热塑性树脂组合物,其包含(A)100重量份的热塑性树脂,(B)10〜300重量份的颗粒状金属氢氧化物; (C)0.01至50重量份的具有烷氧基且由平均单元式R a a(R 2 O)b SiO(4-ab)/ 2表示的支链聚有机硅氧烷,其中R 1和R 2, 2>是选自烷基,烯基和芳基的一价烃基,a是0或正数; b是正数; a + b为0.75〜2.5的数; (D)0.01〜50重量份具有硅烷醇基且由平均单元式R 3 a(HO)b SiO(4-ab)/ 2表示的支链聚有机硅氧烷,其中R 3为选自 由烷基,烯基和芳基组成的组,a为0或正数,b为正数,a + b为0.75至2.5的数; 和(E)0.01〜10重量份缩合反应促进催化剂。 本发明还涉及一种阻燃热塑性树脂组合物的制造方法。
    • 17. 发明授权
    • Resin additive, curable resin composition, and cured resin
    • 树脂添加剂,可固化树脂组合物和固化树脂
    • US06239245B1
    • 2001-05-29
    • US09507867
    • 2000-02-22
    • Yoshitsugu MoritaKazuo KobayashiHiroshi UekiHaruhiko Furukawa
    • Yoshitsugu MoritaKazuo KobayashiHiroshi UekiHaruhiko Furukawa
    • C08G7708
    • C08J3/26C08J3/12C08J2383/04
    • There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.
    • 提供(i)即使在吸收了水分的树脂的情况下也能赋予优异的耐热冲击性的树脂添加剂,(ii)能够形成具有优异的耐热冲击性的固化树脂的固化性树脂组合物,即使在吸收水分后 ,和(iii)即使在吸收水分后也具有优异的耐热冲击性的固化树脂。 树脂添加剂由平均粒径为0.1〜100μm的硅橡胶的粉末构成。 在约121℃,两个大气压,相对湿度为100%的温度下处理20小时后,其吸湿率为0.20重量%以下。 固化性树脂组合物含有树脂添加剂,固化树脂通过使固化性树脂组合物固化而形成。