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    • 17. 发明申请
    • FILM FORMATION APPARATUS AND FILM FORMATION METHOD FORMING METAL FILM
    • 电影形成装置和成膜方法成型金属膜
    • US20160265129A1
    • 2016-09-15
    • US15033967
    • 2014-11-12
    • TOYOTA JIDOSHA KABUSHIKI KAISHA
    • Motoki HIRAOKAHiroshi YANAGIMOTOYuki SATO
    • C25D5/06C25D17/14C25D17/00
    • C25D5/06C25D3/00C25D17/00C25D17/002C25D17/005C25D17/14
    • Provided is film formation apparatus of a metal film and a film formation method therefor capable of forming a homogeneous metal film of a uniform thickness stably, while being less affected by the surface state of the anode. A film formation apparatus 1A includes: an anode 11; a solid electrolyte membrane 13 disposed between the anode 11 and a base B serving as a cathode; and a power supply unit 14 to apply voltage between the anode 11 and the base B, the film formation apparatus being configured so that, when the solid electrolyte membrane 13 is brought into contact with a surface of the base B, and voltage is applied between the anode 11 and the base B, metal is deposited on the surface of the base B from metal ions included inside of the solid electrolyte membrane 13, so that the metal film F made of the metal is formed. The film formation apparatus 1A includes a mounting base 21 on which the base B is to be placed, and the mounting base 21 has a suction unit 22 to suck the solid electrolyte membrane 13 from a side of the base B so that the solid electrolyte membrane 13 is brought into intimate contact with the surface of the base B during formation of the metal film F.
    • 提供一种金属膜的成膜装置及其成膜方法,其能够在不受阳极表面状态影响的同时稳定地形成均匀厚度均匀的金属膜。 成膜装置1A包括:阳极11; 设置在阳极11和用作阴极的基体B之间的固体电解质膜13; 以及在阳极11和基体B之间施加电压的电源单元14,成膜装置构成为:当使固体电解质膜13与基体B的表面接触时,在 阳极11和基体B,金属从固体电解质膜13内部的金属离子沉积在基体B的表面上,从而形成由金属制成的金属膜F. 成膜装置1A包括安装基座21,基座B将放置在该安装基座21上,安装基座21具有从基座B的侧面抽吸固体电解质膜13的吸引单元22,使固体电解质膜 13在金属膜F的形成期间与基体B的表面紧密接触。
    • 20. 发明申请
    • FILM DEPOSITION DEVICE OF METAL FILM AND FILM DEPOSITION METHOD
    • 金属膜和薄膜沉积方法的膜沉积装置
    • US20160177464A1
    • 2016-06-23
    • US14910365
    • 2014-08-04
    • TOYOTA JIDOSHA KABUSHIKI KAISHA
    • Yuki SATOHiroshi YANAGIMOTOMotoki HIRAOKI
    • C25D5/22C25D21/00C25D17/00
    • C25D5/22C25D5/02C25D5/08C25D17/00C25D17/002C25D17/10C25D17/14C25D21/00
    • A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.
    • 金属膜的成膜装置(1A)包括:容纳金属离子的固体电解质膜(13); 由多孔体制成的正极(11) 电源部,其在正极和基材之间施加电压; 和与正极(11)接触的接触加压部(20),并通过正极(11)使固体电解质膜(13)对基材的表面的成膜区域均匀地加压。 由多孔体制成的正极(11)能够传输含有金属离子的溶液,使得金属离子被供给到固体电解质膜。 电源部件(14)在正电极和基体材料之间施加电压,使得由金属制成的金属膜被沉积。