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1. 发明申请

US20160177464A1 FILM DEPOSITION DEVICE OF METAL FILM AND FILM DEPOSITION METHOD 有权
标题翻译：金属膜和薄膜沉积方法的膜沉积装置
公开(公告)号：US20160177464A1
公开(公告)日：2016-06-23
申请号：US14910365
申请日：2014-08-04
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Yuki SATO , Hiroshi YANAGIMOTO , Motoki HIRAOKI
IPC分类号： C25D5/22 , C25D21/00 , C25D17/00
CPC分类号： C25D5/22 , C25D5/02 , C25D5/08 , C25D17/00 , C25D17/002 , C25D17/10 , C25D17/14 , C25D21/00
摘要： A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.
摘要翻译：金属膜的成膜装置（1A）包括：容纳金属离子的固体电解质膜（13）; 由多孔体制成的正极（11）电源部，其在正极和基材之间施加电压; 和与正极（11）接触的接触加压部（20），并通过正极（11）使固体电解质膜（13）对基材的表面的成膜区域均匀地加压。由多孔体制成的正极（11）能够传输含有金属离子的溶液，使得金属离子被供给到固体电解质膜。电源部件（14）在正电极和基体材料之间施加电压，使得由金属制成的金属膜被沉积。

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