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    • 15. 发明授权
    • Method of manufacturing a non-volatile semiconductor device
    • 制造非易失性半导体器件的方法
    • US07867849B2
    • 2011-01-11
    • US12222074
    • 2008-08-01
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • H01L21/336
    • H01L21/324H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Example embodiments relate to methods of fabricating a non-volatile memory device. According to example embodiments, a method of fabricating a non-volatile memory device may include forming at least one gate structure on an upper face of a substrate. The at least one gate structure may include a tunnel insulation layer pattern, a charge storing layer pattern, a dielectric layer pattern and a control gate. According to example embodiments, a method of fabricating a non-volatile memory device may also include forming a silicon nitride layer on the upper face of the substrate to cover the at least one gate structure, forming an insulating interlayer on the silicon nitride layer on the upper face of the substrate, and providing an annealing gas toward the upper face of the substrate and a lower face of the substrate to cure defects of the tunnel insulation layer pattern.
    • 示例实施例涉及制造非易失性存储器件的方法。 根据示例性实施例,制造非易失性存储器件的方法可以包括在衬底的上表面上形成至少一个栅极结构。 至少一个栅极结构可以包括隧道绝缘层图案,电荷存储层图案,电介质层图案和控制栅极。 根据示例实施例,制造非易失性存储器件的方法还可以包括在衬底的上表面上形成氮化硅层以覆盖至少一个栅极结构,在氮化硅层上形成绝缘中间层 并且朝向基板的上表面和基板的下表面提供退火气体,以固化隧道绝缘层图案的缺陷。