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11. 发明申请

US20090091042A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE HAVING RELIEVED ACTIVE REGION 有权
标题翻译：集成电路封装系统，包括具有可移动活动区域的DIE
公开(公告)号：US20090091042A1
公开(公告)日：2009-04-09
申请号：US12235111
申请日：2008-09-22
申请人： Byung Tai Do , Sang-Ho Lee , Jong Wook Ju
发明人： Byung Tai Do , Sang-Ho Lee , Jong Wook Ju
IPC分类号： H01L23/49 , H01L21/60
CPC分类号： H01L24/33 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L29/0657 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/4809 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2225/0651 , H01L2225/06555 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/078 , H01L2924/10156 , H01L2924/10157 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a substrate; attaching a base die to the substrate, the base die having a relief region with a shaped cross-section; and connecting a bond wire between an active base surface of the base die and the substrate, the bond wire extending through the shaped cross-section of the relief region.
摘要翻译：集成电路封装系统包括：提供衬底; 将基模连接到基板上，基模具有具有成形横截面的浮雕区域; 以及将所述基模的活性基底表面和所述基底之间的接合线连接，所述接合线延伸穿过所述浮雕区域的形状横截面。

12. 发明申请

US20090057862A1 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH CARRIER INTERPOSER 有权
标题翻译：集成电路封装系统与载体插接器
公开(公告)号：US20090057862A1
公开(公告)日：2009-03-05
申请号：US11849127
申请日：2007-08-31
申请人： Jong-Woo Ha , BumJoon Hong , Sang-Ho Lee , Soo-San Park
发明人： Jong-Woo Ha , BumJoon Hong , Sang-Ho Lee , Soo-San Park
IPC分类号： H01L23/538 , H01L21/56
CPC分类号： H01L25/03 , H01L23/3128 , H01L24/73 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2225/06558 , H01L2924/14 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.
摘要翻译：集成电路封装包装系统包括：将集成电路装置安装在封装载体上; 形成子组件，其包括：提供集成电路封装系统，其具有其上具有集成电路管芯的载体插入器，以及将器件安装在所述载体插入器下; 将组件安装在集成电路装置上; 并将该组件和该集成电路器件封装在该封装载体上。

13. 发明申请

US20080058368A1 4,5,6,7-Tetrahydro-[1,2]Dithiolo[4,3-C] Pyridine-3-Thione Compounds 失效
标题翻译： 4,5,6,7-四氢 - [1,2]二硫基[4,3-C]吡啶-3-硫酮化合物
公开(公告)号：US20080058368A1
公开(公告)日：2008-03-06
申请号：US11664528
申请日：2005-10-11
申请人： Sang-Geon Kim , Seung-Jin Lee , Eun-Young Park , Mvong-Suk Ko , Jin-Wan Kim , Kwang-Do Choi , Jee-Woong Lim , Sang-Ho Lee
发明人： Sang-Geon Kim , Seung-Jin Lee , Eun-Young Park , Mvong-Suk Ko , Jin-Wan Kim , Kwang-Do Choi , Jee-Woong Lim , Sang-Ho Lee
IPC分类号： A61K31/4365 , A61P1/16 , C07D471/04
CPC分类号： C07D495/04
摘要： The present invention relates to new compounds directly increasing kinase activity of p90 ribosomal S6 kinase 1 (RSK1), a pharmaceutical composition comprising them as active ingredient, a use thereof to prevent or treat hepatic fibrosis or cirrhosis, and a method for preventing or treating hepatic fiborsis or cirrhosis, comprising administering a therapeutically effective amount of the composition to mammal.
摘要翻译：本发明涉及直接增加p90核糖体S6激酶1（RSK1）的激酶活性的新化合物，其是包含它们作为活性成分的药物组合物，其用于预防或治疗肝纤维化或肝硬化的用途，以及用于预防或治疗肝脏的方法纤维性或肝硬化，包括向哺乳动物施用治疗有效量的组合物。

14. 发明申请

US20080012095A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING WAFER LEVEL SPACER 有权
标题翻译：集成电路封装系统，包括波形间隔器
公开(公告)号：US20080012095A1
公开(公告)日：2008-01-17
申请号：US11456845
申请日：2006-07-11
申请人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L29/06 , H01L21/00
CPC分类号： H01L25/0657 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06575 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.
摘要翻译：一种集成电路封装系统，其包括提供包括孔的晶片级间隔件，所述孔限定互连的单元间隔件，并且构造所述单元间隔件以基本上对准在衬底内形成的器件。

15. 发明申请

US20070235846A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NET SPACER 有权
标题翻译：带网间的集成电路封装系统
公开(公告)号：US20070235846A1
公开(公告)日：2007-10-11
申请号：US11278411
申请日：2006-04-01
申请人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L23/495
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06575 , H01L2225/06593 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package system that includes forming a strip level net spacer including support bars, tie bars and paddles. Configuring the support bars, the tie bars and the paddles to form open regions and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices.
摘要翻译：一种集成电路封装系统，包括形成包括支撑杆，连接杆和桨叶的带状水平网间隔件。配置支撑杆，连杆和桨叶以形成开放区域并且互连支撑杆，连杆和桨，以向垂直堆叠的半导体器件提供结构支撑。

16. 发明申请

US20070231701A1 Electrode assembly and pouch type lithium rechargeable battery having the same 有权
标题翻译：具有相同的电极组件和袋型锂可充电电池
公开(公告)号：US20070231701A1
公开(公告)日：2007-10-04
申请号：US11727863
申请日：2007-03-28
申请人： Sang-Ho Lee
发明人： Sang-Ho Lee
IPC分类号： H01M2/16 , H01M2/26
CPC分类号： H01M10/0587 , H01M2/0275 , H01M2/18 , H01M2/26 , H01M2/30 , H01M2/34 , H01M10/0436
摘要： The present invention relates to an electrode assembly and a pouch type lithium rechargeable battery having the same, which can minimize the total volume of a battery while maximizing a distance between electrode tabs. Insulation members cover portions of electrode tabs to prevent contact of an electrode tab with another electrode tab and electrode plate with opposite polarity. The shape of the insulation member is changed to effectively increase the distance between electrode tabs and to reduce overall thickness or width of the battery.
摘要翻译：本发明涉及一种电极组件和具有该电池组件的袋式锂可再充电电池，其可以最小化电池的总体积，同时最大化电极片之间的距离。绝缘构件覆盖电极接片的部分，以防止电极接头与另一个极性相反的电极接头和电极板接触。改变绝缘构件的形状以有效地增加电极片之间的距离并减小电池的整体厚度或宽度。

17. 发明申请

US20070181998A1 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FACE TO FACE STACK CONFIGURATION 有权
标题翻译：堆叠式集成电路封装系统与面向堆叠配置
公开(公告)号：US20070181998A1
公开(公告)日：2007-08-09
申请号：US11307382
申请日：2006-02-03
申请人： Jong-Woo Ha , Sang-Ho Lee , Soo-San Park
发明人： Jong-Woo Ha , Sang-Ho Lee , Soo-San Park
IPC分类号： H01L23/34
CPC分类号： H01L24/48 , H01L23/3128 , H01L24/85 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16 , H01L2224/274 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/85051 , H01L2224/85399 , H01L2224/85986 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2224/85186 , H01L2224/78 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A stacked integrated circuit package system is provided forming a first molded chip comprises attaching a conductor on a wafer, applying an encapsulant around the conductor, and exposing a surface of the conductor in the encapsulant, attaching a first electrical interconnect on the conductor of the first molded chip and stacking an integrated circuit device on the first molded chip with an electrical connector of the integrated circuit device connected to the conductor of the first molded chip with the first electrical interconnect.
摘要翻译：提供了一种堆叠的集成电路封装系统，其形成第一模制芯片，包括将导体附着在晶片上，在导体周围施加密封剂，以及将导体的表面暴露在密封剂中，将第一电互连件附接到第一将第一模制芯片上的集成电路器件堆叠在一起，其中集成电路器件的电连接器通过第一电互连连接到第一模制芯片的导体上。

18. 发明授权

US07243934B2 Multi-link rear suspension system 有权
标题翻译：多连杆后悬挂系统
公开(公告)号：US07243934B2
公开(公告)日：2007-07-17
申请号：US11005405
申请日：2004-12-06
申请人： Un-Koo Lee , Sang-Ho Lee , Hyung-Bae Jang , Young-Wook Park
发明人： Un-Koo Lee , Sang-Ho Lee , Hyung-Bae Jang , Young-Wook Park
IPC分类号： B60G3/12
CPC分类号： B60G3/202 , B60G7/001 , B60G7/008 , B60G2200/1442 , B60G2200/184 , B60G2202/12 , B60G2202/24 , B60G2204/1244 , B60G2204/143 , B60G2204/148 , B60G2204/15 , B60G2206/50
摘要： A knuckle is minimized in size to be located in an internal space of a rear wheel. An upper arm is disposed lower than a conventional double wishbone type and one end of the upper arm is secured to the knuckle. A shock absorber couples at a lower end thereof to the knuckle by passing through a space between a lower arm and assist arm. This configuration thus constructed greatly increases the space of the trunk room, reduces noise by minimizing the transmission of road impact and vibration, and improves ride comfort as well as braking stability and turn stability.
摘要翻译：转向节的尺寸被最小化以位于后轮的内部空间中。上臂布置成低于传统的双叉骨型，并且上臂的一端固定在转向节上。减震器通过穿过下臂和辅助臂之间的空间在其下端处连接到转向节。这样构造大大增加了行李箱的空间，通过最小化道路冲击和振动的传递来降低噪音，并且提高乘坐舒适度以及制动稳定性和转向稳定性。

19. 发明申请

US20070154017A1 Method for transmitting security context for handover in portable internet system 有权
标题翻译：用于在便携式互联网系统中传送用于切换的安全上下文的方法
公开(公告)号：US20070154017A1
公开(公告)日：2007-07-05
申请号：US11635113
申请日：2006-12-07
申请人： Mi-Young Yun , Sang-Ho Lee
发明人： Mi-Young Yun , Sang-Ho Lee
IPC分类号： H04K1/00
CPC分类号： H04W36/0038 , H04L63/06 , H04W12/04
摘要： A method for transmitting a handover security context of a first access point, when an access terminal from a service cell of a first access point is connected to a packet access router, to a service cell of a second access point connected to the packet access router, is provided. The handover security context transmitting method includes confirming whether a handover confirmation message transmitted from the access terminal has a security context therein; when the handover confirmation message has a security context therein, confirming whether the security context has security-related information therein; when the security context has security-related information therein, confirming whether the security context has a traffic-related key or a pairwise master key; and transmitting an information instruction message including the security related information confirmed in the security context, the security-related information, the traffic-related key, and the pairwise master key through the PAR to the second AP.
摘要翻译：一种当从第一接入点的服务小区的接入终端连接到分组接入路由器时，将第一接入点的切换安全上下文发送到连接到分组接入路由器的第二接入点的服务小区的方法，被提供。切换安全上下文发送方法包括：确认从接入终端发送的切换确认消息是否具有其中的安全上下文; 当切换确认消息具有其中的安全上下文时，确认安全上下文是否具有安全相关信息; 当安全上下文中具有安全性相关信息时，确认安全上下文是否具有业务相关密钥或成对主密钥; 以及通过PAR向第二AP发送包括在安全上下文中确认的安全相关信息，安全相关信息，与交通相关的密钥和成对主密钥的信息指示消息。

20. 发明申请

US20070082683A1 Call service providing system, method thereof, and mobile terminal paging method 审中-公开
标题翻译：呼叫服务提供系统，方法和移动终端寻呼方法
公开(公告)号：US20070082683A1
公开(公告)日：2007-04-12
申请号：US11546792
申请日：2006-10-12
申请人： Jee-Hyeon Na , Sang-Ho Lee , Jee-Hwan Ahn , Yun-Won Chung
发明人： Jee-Hyeon Na , Sang-Ho Lee , Jee-Hwan Ahn , Yun-Won Chung
IPC分类号： H04Q7/20
CPC分类号： H04W68/00
摘要： The present invention discloses a system for providing a call service for a mobile terminal to an application server. The system includes a location server that manages a location of the mobile terminal in an idle state by a paging group identifier. A paging controller detects a state and a location of the mobile terminal from the location server. When the mobile terminal is in the idle state, the paging controller requests a paging operation from at least one paging controller corresponding to the paging group having the mobile terminal so that the mobile terminal receives a network address when in the idle state, and provides the network address to the application server.
摘要翻译：本发明公开了一种向应用服务器提供移动终端的呼叫服务的系统。该系统包括位置服务器，其通过寻呼组标识符管理处于空闲状态的移动终端的位置。寻呼控制器从位置服务器检测移动终端的状态和位置。当移动终端处于空闲状态时，寻呼控制器从与具有移动终端的寻呼组对应的至少一个寻呼控制器请求寻呼操作，使得移动终端处于空闲状态时接收网络地址，并提供网络地址到应用服务器。

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