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11. 发明授权

US07511366B2 Multi-row substrate strip and method for manufacturing the same 有权
标题翻译：多行基板条及其制造方法
公开(公告)号：US07511366B2
公开(公告)日：2009-03-31
申请号：US11258085
申请日：2005-10-26
申请人： Yao-Ting Huang , Kuang-Lin Lo
发明人： Yao-Ting Huang , Kuang-Lin Lo
IPC分类号： H01L23/02
CPC分类号： H01L23/49838 , H01L21/4846 , H01L21/565 , H01L23/5386 , H01L2924/0002 , H01L2924/00
摘要： A multi-row substrate strip mainly includes a plurality of first and second substrate units in parallel, a plurality of connecting bars, a degating metal layer and at least one plating layer. The connecting bars are used to connect the first substrate units and connect the second substrate units. The degating metal layer includes a plurality of runner portions on the connecting bars, a plurality of first gate portions and a plurality of second gate portions. The first gate portions are formed on the first substrate units, and the second gate portions are formed on the second substrate units. The plating layer is formed on the first gate portions and the second gate portions, and exposes the runner portions, so as to save the plating material.
摘要翻译：多排衬底条主要包括多个平行的第一和第二衬底单元，多个连接条，去金属层和至少一个镀层。连接杆用于连接第一基板单元并连接第二基板单元。脱金属层包括连接杆上的多个流道部分，多个第一栅极部分和多个第二栅极部分。第一栅极部分形成在第一基板单元上，并且第二栅极部分形成在第二基板单元上。电镀层形成在第一栅极部分和第二栅极部分上，并露出流道部分，以便保存电镀材料。

12. 发明申请

US20060091384A1 Substrate testing apparatus with full contact configuration 审中-公开
标题翻译：基板测试仪器具有全触点配置
公开(公告)号：US20060091384A1
公开(公告)日：2006-05-04
申请号：US11250526
申请日：2005-10-17
申请人： Chung-Hsiung Ho , Jui-Wen Wang , Tien-Ming Shih , Kuang-Lin Lo
发明人： Chung-Hsiung Ho , Jui-Wen Wang , Tien-Ming Shih , Kuang-Lin Lo
IPC分类号： H01L23/58
CPC分类号： G01R1/07335 , G01R31/2896 , H01L22/32
摘要： A substrate testing apparatus with full contact configuration. The apparatus includes a jig and a full-contact probe substrate. The jig has a conductive tape disposed thereon for fully electrically connecting a plurality of first connecting pads disposed on an upper surface of a substrate strip. The full-contact probe substrate has a contact surface and includes a plurality of conductive bumps and contact pads. The conductive bumps are disposed on the contact surface, and are used for individually probing a plurality of corresponding second connecting pads disposed on a lower surface of the substrate strip. The contact pads are electrically connected to the conductive bumps. The substrate strip is fully tested by means of the jig and the full-contact probe substrate.
摘要翻译：具有完全接触配置的基板测试装置。该装置包括夹具和全接触探针基板。夹具具有设置在其上的导电胶带，用于完全电连接设置在基板条的上表面上的多个第一连接焊盘。全接触探针基板具有接触表面并且包括多个导电凸块和接触垫。导电凸块设置在接触表面上，并且用于单独地探测设置在衬底条的下表面上的多个对应的第二连接焊盘。接触焊盘电连接到导电凸块。通过夹具和全接触探针基板对基片条进行全面测试。

13. 发明授权

US06627481B2 Method of manufacturing a semiconductor package with a lead frame having a support structure 有权
标题翻译：制造具有支撑结构的引线框的半导体封装的方法
公开(公告)号：US06627481B2
公开(公告)日：2003-09-30
申请号：US10056358
申请日：2002-01-25
申请人： Meng-Tsang Lee , Kuang-Lin Lo
发明人： Meng-Tsang Lee , Kuang-Lin Lo
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L23/49503 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： The present invention relates to a method of manufacturing semiconductor packages and products thereof. The method of manufacturing comprises steps of: (a) providing a lead frame which comprises a die pad, a plurality of connecting parts and a plurality of leads, wherein the die pad is lower than the leads and connects the leads through the connecting parts, and wherein the die pad comprises at least one supporting structure to fix the lead frame substantially; (b) mounting a die onto the die pad and electrically connecting the lead frame and die by bonding wires; (c) providing an upper mold and a lower mold, wherein the upper mold and lower mold are located at an upper side and a lower side of the leads, respectively, wherein the supporting structures of the die pad are allowed to be supported on the lower mold, and the leads are allowed to protrude outwards from a mold cavity formed by the upper and lower molds; (d) setting the lead frame in steps (a) and (b) onto the lower mold in step (c) and making the supporting structures of the die pad to be supported on the lower mold and then combining the upper mold to the lower mold; (e) applying an encapsulant into the mold cavity formed by the upper and lower molds; and (f) removing the upper and lower molds after encapsulating.
摘要翻译：本发明涉及半导体封装的制造方法及其制造方法。制造方法包括以下步骤：（a）提供引线框架，其包括管芯焊盘，多个连接部件和多个引线，其中管芯焊盘低于引线并且将引线连接到连接部分，并且其中所述管芯焊盘包括至少一个支撑结构以基本上固定所述引线框架; （b）将管芯安装在管芯焊盘上，并通过接合线电连接引线框架和管芯; （c）提供上模具和下模具，其中上模具和下模具分别位于引线的上侧和下侧，其中模片垫的支撑结构被允许支撑在下模，允许引线从由上模和下模形成的模腔向外突出; （d）在步骤（c）中将步骤（a）和（b）中的引线框架设置在下模上，并使模片垫的支撑结构支撑在下模上，然后将上模与下模模子; （e）将密封剂施加到由上模和下模形成的模腔中; 和（f）在封装之后去除上模和下模。

14. 发明授权

US07473629B2 Substrate structure having a solder mask and a process for making the same 有权
标题翻译：具有焊接掩模的基板结构及其制造方法
公开(公告)号：US07473629B2
公开(公告)日：2009-01-06
申请号：US11634059
申请日：2006-12-06
申请人： Wei-Chang Tai , Chi-Chih Chu , Meng-Jung Chuang , Cheng-Yin Lee , Yao-Ting Huang , Kuang-Lin Lo
发明人： Wei-Chang Tai , Chi-Chih Chu , Meng-Jung Chuang , Cheng-Yin Lee , Yao-Ting Huang , Kuang-Lin Lo
IPC分类号： H01L21/44
CPC分类号： H05K3/3452 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H05K3/284 , H05K2203/0588 , H01L2924/00014 , H01L2924/00
摘要： A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.
摘要翻译：一种具有焊料掩模的衬底结构及其制造方法，包括：（a）提供具有顶表面的衬底，所述顶表面具有管芯焊盘和多个焊盘; （b）在所述顶表面上形成第一焊料掩模，所述第一焊料掩模具有多个开口，每个开口对应于每个焊盘，以暴露所述焊盘的至少一部分; 和（c）在第一焊料掩模上形成第二焊料掩模。衬底结构可用于包装较厚的模具，以防止模具裂纹，并避免模塑料的溢流。

15. 发明授权

US07384566B2 Fabrication method for printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US07384566B2
公开(公告)日：2008-06-10
申请号：US11121091
申请日：2005-05-04
申请人： Hung-Nan Chen , Jen-Kuang Fang , Kuang-Lin Lo
发明人： Hung-Nan Chen , Jen-Kuang Fang , Kuang-Lin Lo
IPC分类号： H01B13/00 , H05K3/02
CPC分类号： H05K3/242 , H05K3/0035 , H05K3/06 , H05K3/28 , H05K2201/0989 , H05K2203/175 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162
摘要： A fabrication method for PCBs. The method includes providing a substrate having a layout area and a periphery area around the layout area on a surface, forming a patterned wiring layer, having a bus line in the periphery area, a plurality of pads in the layout area, a plurality of bridge lines providing electrical connection between the pads, and a plating line electrically connecting the bus line and pads, overlying the substrate, forming a patterned solder mask over the substrate and wiring layer, the patterned solder mask having a plurality of first openings respectively exposing the pads and plating a metal layer respectively overlying the pads, forming a plurality of second openings respectively exposing the bridge lines between the pads, and removing the exposed bridge lines.
摘要翻译：一种PCB制造方法。该方法包括提供具有在表面上的布局区域周围的布局区域和周边区域的基板，形成图案化的布线层，在周边区域中具有总线，布局区域中的多个焊盘，多个桥在衬垫之间提供电连接的线，以及覆盖衬底的电连接总线和衬垫的电镀线，在衬底和布线层上形成图案化的焊料掩模，图案化的焊料掩模具有多个第一开口，分别暴露衬垫以及分别覆盖覆盖在所述焊盘上的金属层，形成分别暴露所述焊盘之间的所述桥接线并且去除所暴露的桥接线的多个第二开口。

16. 发明申请

US20070243704A1 Substrate structure having a solder mask and a process for making the same 有权
标题翻译：具有焊接掩模的基板结构及其制造方法
公开(公告)号：US20070243704A1
公开(公告)日：2007-10-18
申请号：US11634059
申请日：2006-12-06
申请人： Wei-Chang Tai , Chi-Chih Chu , Meng-Jung Chuang , Cheng-Yin Lee , Yao-Ting Huang , Kuang-Lin Lo
发明人： Wei-Chang Tai , Chi-Chih Chu , Meng-Jung Chuang , Cheng-Yin Lee , Yao-Ting Huang , Kuang-Lin Lo
IPC分类号： H01L21/44
CPC分类号： H05K3/3452 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H05K3/284 , H05K2203/0588 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a substrate structure having a solder mask and a process for making the same. The process comprises: (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. Whereby, the substrate structure of the invention can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.
摘要翻译：本发明涉及一种具有焊接掩模的基片结构及其制造方法。该方法包括：（a）提供具有顶表面的基底，顶表面具有管芯焊盘和多个焊盘; （b）在所述顶表面上形成第一焊料掩模，所述第一焊料掩模具有多个开口，每个开口对应于每个焊盘，以暴露所述焊盘的至少一部分; 和（c）在第一焊料掩模上形成第二焊料掩模。由此，本发明的基板结构可以用于包装较厚的模具，以防止模具裂纹，并避免模塑料的溢流。

17. 发明授权

US07144239B2 Molding apparatus with a molding flowability sensor for packaging semiconductor device 有权
标题翻译：具有用于封装半导体器件的成型流动性传感器的成型装置
公开(公告)号：US07144239B2
公开(公告)日：2006-12-05
申请号：US10901039
申请日：2004-07-29
申请人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
发明人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
IPC分类号： B29C45/77
CPC分类号： B29C45/7646 , B29C45/14639 , B29C2945/76056 , B29C2945/76063 , B29C2945/7626
摘要： A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.
摘要翻译：成型装置主要包括模具支架，模具追踪器，加热器和成型流动性传感器。模具追逐包括模腔和通孔，其中所述通孔穿过模腔的模腔表面。模具追逐由模具夹持器容纳，并且设置有用于加热模具追加的加热器。并且用于测量模腔的模腔表面处的即时成型流的成型流动性的成型流动性传感器设置在模腔的模腔表面。

18. 发明申请

US20050246892A1 Fabrication method for printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US20050246892A1
公开(公告)日：2005-11-10
申请号：US11121091
申请日：2005-05-04
申请人： Hung-Nan Chen , Jen-Kuang Fang , Kuang-Lin Lo
发明人： Hung-Nan Chen , Jen-Kuang Fang , Kuang-Lin Lo
IPC分类号： H01R43/00 , H05K3/00 , H05K3/06 , H05K3/24 , H05K3/28
CPC分类号： H05K3/242 , H05K3/0035 , H05K3/06 , H05K3/28 , H05K2201/0989 , H05K2203/175 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162
摘要： A fabrication method for PCBs. The method includes providing a substrate having a layout area and a periphery area around the layout area on a surface, forming a patterned wiring layer, having a bus line in the periphery area, a plurality of pads in the layout area, a plurality of bridge lines providing electrical connection between the pads, and a plating line electrically connecting the bus line and pads, overlying the substrate, forming a patterned solder mask over the substrate and wiring layer, the patterned solder mask having a plurality of first openings respectively exposing the pads and plating a metal layer respectively overlying the pads, forming a plurality of second openings respectively exposing the bridge lines between the pads, and removing the exposed bridge lines.
摘要翻译：一种PCB制造方法。该方法包括提供具有在表面上的布局区域周围的布局区域和周边区域的基板，形成图案化布线层，在周边区域中具有总线，布局区域中的多个焊盘，多个桥在衬垫之间提供电连接的线，以及覆盖衬底的电连接总线和衬垫的电镀线，在衬底和布线层上形成图案化的焊料掩模，图案化的焊料掩模具有多个第一开口，分别暴露衬垫以及分别覆盖覆盖在所述焊盘上的金属层，形成分别暴露所述焊盘之间的所述桥接线并且去除所暴露的桥接线的多个第二开口。

19. 发明申请

US20050089593A1 Molding apparatus with a pressure sensor for packaging semiconductor device 审中-公开
标题翻译：具有用于封装半导体器件的压力传感器的成型装置
公开(公告)号：US20050089593A1
公开(公告)日：2005-04-28
申请号：US10876609
申请日：2004-06-28
申请人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
发明人： Wei-Chih Wang , Kuang-Lin Lo , Yun-Lung Chang
IPC分类号： B29C45/14 , B29C45/40 , B29C45/76 , B29C45/77 , B29C70/72
CPC分类号： B29C45/401 , B29C45/14639 , B29C45/7646 , B29C45/77 , B29C2945/76006 , B29C2945/76244 , B29C2945/7626
摘要： A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a pressure sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates the mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the pressure sensor for measuring the viscosity of the instant molding flow at the mold-cavity surface of the mold cavity is provided in the via of the mold chase.
摘要翻译：成型装置主要包括模具支架，模具追加器，加热器和压力传感器。模具包括模具腔和通孔，其中通孔穿过模腔的模腔表面。模具追逐由模具夹持器容纳，并且设置有用于加热模具追加的加热器。并且用于测量在模腔的模腔表面处的即时成型流的粘度的压力传感器设置在模具追踪的通孔中。

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